Printed circuit board with magnetic assembly

• US 7,352,270 B1
• Filed: 10/27/2006
• Issued: 04/01/2008
• Est. Priority Date: 10/27/2006
• Status: Active Grant

• Current Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Original Assignee: ITT Manufacturing Enterprises, Inc. (ITT, Inc.)
• Inventors: Copeland, Curtis S.
• Primary Examiner(s): Enad; Elvin
• Assistant Examiner(s): BAISA, JOSELITO SASIS
• Application Number:
  US11/553,502
• Time in Patent Office: 522 Days
• Field of Search: 336/200
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 17/062 Toroidal core with turns of coil around it
• CPC Class Codes: H01F 2027/2814 with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
• CPC Class Codes: H01F 27/22 Cooling by heat conduction through solid or powdered fillings

Abstract

A magnetic assembly including a printed circuit board and a core made from magnetically permeable material positioned on the printed circuit board. Plated through holes are formed in the printed circuit board, a first plated through hole on a first side of the core, a second plated through on a second side of the core and third plated though hole on the first side of the core. A winding lead has a first leg soldered in the first plated through hole and a second leg soldered in the second plated through hole, the winding lead being a discrete electrical conductor separate from the printed circuit board. A conductive trace is formed in the printed circuit board, the conductive trace electrically connected the second plated through hole and the third plated through hole.

Claims

1. A magnetic assembly comprising:

a printed circuit board;

a core made from magnetically permeable material positioned on the printed circuit board;

plated through holes formed in the printed circuit board, a first plated through hole on a first side of the core, a second plated through hole on a second side of the core and third plated through hole on the first side of the core;

a winding lead having a first leg soldered in the first plated through hole and a second leg soldered in the second plated through hole, the winding lead being a discrete electrical conductor separate from the printed circuit board, the first leg extending through and beyond the printed circuit board opposite the core and the second leg extending through and beyond the printed circuit board opposite the core;

a conductive trace formed in the printed circuit board, the conductive trace electrically connecting the second plated through hole and the third plated through hole; and

a heat sink positioned on the printed circuit board opposite the core, the heat sink including a first recessed channel for receiving the first leg extending beyond the printed circuit board opposite the core, the heat sink including a second recessed channel for receiving the second leg extending beyond the printed circuit board opposite the core.

2. The magnetic assembly of claim 1 further comprising:

a plurality of winding leads and a plurality of conductive traces, the winding leads and conductive traces forming a winding encompassing the core.

3. The magnetic assembly of claim 1 further comprising:

a spacer positioned between the printed circuit board and the core.

4. The magnetic assembly of claim 1 further comprising:

a spacer positioned between the winding lead and the core.

5. The magnetic assembly of claim 1 further comprising:

a plurality of thermal vias in the printed circuit board, the thermal vias conducting heat from the core to the heat sink.