Assembly comprising functional devices and method of making same

• US 7,353,598 B2
• Filed: 11/07/2005
• Issued: 04/08/2008
• Est. Priority Date: 11/08/2004
• Status: Expired due to Fees

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Eisenhardt, Randolph W., Herrmann, Scott, Hadley, Mark A., Drzaic, Paul S., Craig, Gordon S. W., Tootoonchi, Ali A.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US11/268,837
• Publication Number:
  US 20060148166A1
• Time in Patent Office: 883 Days
• Field of Search: 298/25, 298/32, 298/40, 298/46
• US Class Current: 29/846
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/24101 Connecting bonding areas at the same height
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95122 by applying vibration
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 29/0657 : characterised by the shape of the body
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10155 : being other than a cuboid
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15157 : Top view
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

Claims

1. A method comprising:

providing a local printing systems equipped with a print head that dispense a first material in a predetermined configuration

providing a guidance system for the print head;

registering with the guidance system an alignment feature on a substrate;

printing the first material selectively on the substrate at one or more selected areas, said substrate comprising a web material having a plurality of functional components, said printing utilizing the local printing system and the guidance system; and

forming one or more radio frequency identification (RFID) devices,

wherein said functional components comprises integrated circuits.

2. The method of claim 1, wherein said functional components are embedded in said substrate.

3. The method of claim 1, wherein said RFID includes RFID strap assemblies.

4. The method of claim 1, wherein the selected areas include an area that extends over at least a portion of said substrate and at least a portion of said functional component to tack a functional component to the substrate.

5. The method of claim 1, wherein the first material comprises a dielectric layer over the selected areas.

6. The method of claim 5 further comprising:

forming vias through said dielectric layer to establish coupling paths to said functional components;

forming conductors on a surface of said substrate using said local printing system and said guidance system; and

connecting the pad conductors to respective contact provide on said functional components using said local printing system and said guidance system, wherein said via exposing at least potions of said contact pads for interconnections.

7. The method of claim 6, wherein said guidance system is used to assist in forming vias through said dielectric layer and wherein said vias are formed using a laser drilling system configured to work with said guidance system.

8. The method of claim 7 wherein a laser system is used to form said vias.

9. The method of claim 8 further comprising:

forming protective conductive bumps on said contact prior to printing said dielectric layer and prior to forming said vias through said dielectric layer, said protective conductive bumps preventing damage at least to said functional blocks and said contact pads.

10. The method of claim 9 wherein electrical interconnections to the functional blocks are established through said protective conductive bumps to reach said respective contact pads.

11. The method of claim 1 further comprising:

embedding said plurality of functional components into said substrate such that contact pads provided on said integrated circuits are at least partially exposed; and

using said local printing system and said guidance system to form interconnections on said substrate to said contact pads, said interconnections including contact leads to connect directly to said contact pads and directly to pad conductors formed on a surface of said substrate, wherein said first material forms said interconnections and where said selected areas are locations where said interconnections are formed.

12. The method of claim 1 further comprising:

embedding said plurality of functional components into said substrate such that contact pads provided on said integrated circuits are at least partially exposed; and

placing dielectric layers over portions of said substrate and said functional components selectively; and

using said local printing system and said guidance system to form interconnections on said substrate to said contact pads, said interconnections including contact leads to connect directly to said contact pads and directly to pad conductors formed on a surface of said substrate, wherein said first material forms said interconnections and where said selected areas are locations where said interconnections are formed.

13. The method of claim 12, wherein said dielectric layers comprise dried dielectric layers having adhesive layers attached thereto for adhering said adhesive layers to said substrate and said functional components.

14. The method of claim 12, wherein said adhesive layers comprise a dye that enhances the ability of said dielectric layer to ablate when a laser is applied to said dielectric layers.

15. The method of claim 14 further comprising:

forming vias through said dielectric layer to establish coupling paths to said functional components;

forming pad conductors on a surface of said substrate using said local printing system and said guidance system; and

connecting the pad conductors to respective contact pads provide on said functional components using said local printing system and said guidance system,

wherein said vias expose at least portions of said contact pads for interconnections.

16. The method of claim 15 further comprising:

forming protective conductive bumps on said contact pads prior placing said dielectric layers and prior to forming said vias through said dielectric layers, said protective conductive bumps preventing damage at least to said functional blocks and said contact pads.

17. The method of claim 16 wherein electrical interconnections to the functional blocks are established through said protective conductive bumps to reach said respective contact pads.

18. The method of claim 1 further comprising:

embedding said plurality of functional components into said substrate such that contact pads provided on said integrated circuits are exposed at least partially;

using said local printing system and said guidance system and said first material to form interconnections to said contact pads, said interconnections including contact leads coupling to said contact pads and to said pad conductors formed on a surface of said substrate.

19. The method of claim 18 further comprising:

screen printing dielectric layers over selected areas of said substrate and said functional components.

20. The method of claim 18 further comprising:

laminating or coating a dielectric layer over the substrate and said functional components.

21. The method of claim 1 further comprising:

embedding said plurality of functional components into said substrate such that contact pads provided on said integrated circuits are exposed at least partially;

using said local printing system and said guidance system and said first material to form contact leads to said contact pads provided on said integrated circuits;

screen printing pad conductors on a surface of said substrate and connecting said pad conductors to respective contact leads; and

forming dielectric layers over selected areas of said substrate and said functional components.

22. The method of claim 21, wherein said dielectric layers are formed using said local printing system and said guidance system and a second material.

23. The method of claim 1 further comprising:

forming interconnections to contact pads provided on said functional components;

testing for a defective interconnection; and

repairing said defective interconnection using one or more of said local printing system and said guidance system and a cutting system.

24. The method of claim 1 wherein the substrate comprises a plurality of recessed receptors configured to receive said plurality of functional components and wherein said method further comprising:

printing a conductive layer in one or more of said plurality of recessed receptors;

using said local printing system to form one or more electrical contacts for one or more functional components to be deposited in said recessed receptors, wherein said first material forms said electrical contacts;

depositing said functional components into said recessed receptors using a Fluidic-Self-Assembly (FSA) process; and

establishing electrical interconnections to said functional components.

25. The method of claim 1 further comprising:

using said local printing system to form one of a conductive element, a capacitive element, a resistor element, and an inductive element on or near said substrate, said conductive element, capacitive element, resistor element, and inductive element improving a performance of said RFID tag.

26. The method of claim 25 further comprising:

testing said RFID tag for a selected performance.

27. The method of claim 26 further comprising:

tuning said RFID tag based on said testing including printing an additional conductive or dielectric layer on or near said functional components.

28. The method of claim 26 further comprising:

using said local printing system to print one or more of a fuse, a sacrificial feature, a spacer, and a bump on said substrate.

29. The method of claim 26 further comprising:

using said local printing system and selectively print a surface active agent over selected portions of said substrate so as to facilitate a subsequent alignment process, said active agent being selected to selectively alter surface characteristic of said substrate and facilitate alignment.

30. The method of claim 1 further comprising:

determining positions of one or more of the functional components using said guidance system, wherein said functional components serve as alignment features for determining said positions.

31. The method of claim 1 further comprising:

embedding said plurality of functional components into said substrate such that contact pads provided on said integrated circuits are exposed at least partially;

laminating dielectric layers over selected areas of said substrate and said functional components;

drilling vias through said dielectric layers to open paths to said contact pads;

using said local printing system and said guidance system and said first material to form contact leads to said contact pads; and

screen printing pad conductors on a surface of said substrate and connecting said pad conductors to respective contact leads.