Weighted released-beam sensor

• US 7,353,706 B2
• Filed: 12/28/2004
• Issued: 04/08/2008
• Est. Priority Date: 12/28/2004
• Status: Active Grant

• Current Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Original Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Inventors: McAlexander, Joseph Colby III
• Primary Examiner(s): Kwok; Helen C.
• Application Number:
  US11/024,191
• Publication Number:
  US 20060137449A1
• Time in Patent Office: 1,197 Days
• Field of Search: 735/141.6, 735/142.9, 735/143.2, 735/143.6, 735/041.2, 735/041.5
• US Class Current: 73/514.16
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81C 1/0015 Cantilevers switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/0891 with indication of predetermined acceleration values G01P15/135 takes precedence
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/135 by making use of contacts which are actuated by a movable inertial mass
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 35/14 Switches operated by change of acceleration, e.g. by shock or vibration, inertia switch wherein the liquid constitutes a contact of the switch H01H29/002

Abstract

A released-beam sensor includes a semiconductor substrate having a layer formed thereon, and an aperture formed in the layer. A beam is mechanically coupled at a first end to the layer and suspended above the layer such that a second end forms a cantilever above the aperture. A boss is coupled to a second end of the beam and suspended at least partially within the aperture. The beam is configured to flex in response to acceleration of the substrate along a vector substantially perpendicular to a surface of the substrate. Parameters of the sensor, such as the dimensions of the beam, the mass of the boss, and the distance between the boss and a contact surface within the aperture, are selected to establish an acceleration threshold at which the boss will make contact with the contact surface. The sensor may be employed to deploy an airbag in a vehicle.

Claims

1. A sensor, comprising:

a semiconductor substrate;

a first layer formed on a surface of the substrate;

an aperture within the first layer;

a beam having first and second ends, the beam being mechanically coupled at the first end to the first layer and suspended above the first layer for at least a portion of the length thereof and the second end having a region above the aperture; and

a boss coupled to the second end of the beam and suspended at least partially within the aperture.

2. The sensor of claim 1 wherein the first layer is a dielectric layer.

3. The sensor of claim 1, further comprising a second layer positioned between the first layer and the semiconductor substrate.

4. The sensor of claim 1, further comprising a conductive layer positioned between the semiconductor substrate and the first layer with a portion thereof exposed within the aperture.

5. The sensor of claim 1 wherein the beam and the boss are electrically conductive.

6. The sensor of claim 1, further comprising a conductive layer positioned on sidewalls of the aperture.

7. The sensor of claim 1, further comprising a conductive layer coupled to the boss between the boss and a sidewall of the aperture.

8. The sensor of claim 1, further comprising a contact surface within the aperture.

9. The sensor of claim 8, further comprising a circuit within the semiconductor substrate configured to detect electrical contact between the boss and the contact surface.

10. The sensor of claim 8, further comprising a circuit within the semiconductor substrate configured to detect changes in capacitive coupling between the boss and the contact surface.

11. The sensor of claim 1 wherein the beam is composed of a metal.

12. The sensor of claim 1 wherein the beam is composed of a semiconductor material.

13. The sensor of claim 1 wherein the boss is composed of a semiconductor material.

17. The sensor of claim 1 wherein the beam is configured to move the boss along a selected vector relative to the aperture in response to an acceleration, and the beam is spaced apart in a direction along the selected vector from an upper surface of the first layer.

18. The sensor of claim 1 wherein an upper surface of the first layer is interposed between a bottom surface of at least a portion of the beam suspended above the first layer and the semiconductor substrate.

14. A sensor, comprising:

a semiconductor substrate;

a first layer of material formed on a surface of the substrate;

a beam having first and second ends, the beam being mechanically coupled at the first end to the first layer and suspended above the first layer such tat the second end forms a cantilever above the first layer;

means for increasing a sensitivity of the cantilever to acceleration in at least one axis, the increasing means includes an aperture formed in the first layer and a boss coupled to the second end of the beam and suspended at least partially within the aperture.

15. The sensor of claim 14, comprising:

means for reducing a contact resistance in a circuit that includes the beam, the boss, and a layer formed on the substrate.

19. The sensor of claim 14 wherein an upper surface of the first layer is interposed between a bottom surface of at least a portion of the beam suspended above the first layer and the semiconductor substrate.

16. A system, comprising:

a vehicle having a motor, a drive train coupled to the motor, an axle coupled to the drive train, and wheels coupled to the axle for causing movement of the vehicle powered by the motor;

a passenger seat within said vehicle;

an airbag positioned adjacent to the passenger seat; and

a sensor coupled to the airbag configured to cause inflation of the airbag, the sensor including a semiconductor material substrate, a first layer above the semiconductor substrate, a beam having first and second ends, the beam being mechanically coupled at the first end to the substrate and positioned above the first layer for a portion thereof to form a cantilever in a plane that is substantially parallel to an upper surface of the substrate, and a boss of semiconductor material coupled to the second end of the beam and suspended over the substrate;

wherein the semiconductor material substrate includes an aperture positioned underneath the beam such that at least a portion of the boss is suspended within the aperture by the beam.

20. The system of claim 16 wherein an upper surface of the first layer is interposed between at least a portion of a bottom surface of the beam and the semiconductor substrate.