Heat sink with microchannel cooling for power devices
First Claim
1. An apparatus for cooling at least one heated surface, said apparatus comprising:
- a base plate defining a plurality of inlet manifolds and a plurality of outlet manifolds, wherein said inlet manifolds are configured to receive a coolant and said outlet manifolds are configured to exhaust the coolant, and wherein said inlet and outlet manifolds are interleaved and are oriented in a plane of the base plate;
at least one substrate having an inner surface and an outer surface, wherein said inner surface is coupled to said base plate, wherein said inner surface defines a plurality of microchannels configured to receive the coolant from said inlet manifolds and to deliver the coolant to said outlet manifolds, wherein said microchannels are oriented substantially perpendicular to said inlet and outlet manifolds, and wherein said outer surface is in thermal contact with the heated surface;
an inlet plenum configured to supply the coolant to said inlet manifolds; and
an outlet plenum configured to exhaust the coolant from said outlet manifolds, wherein said inlet plenum and said outlet plenum are oriented in the plane of said base plate,wherein said substrate comprises a top metal layer, an insulating microchannel layer and a lower layer, wherein said microchannels are formed in said insulating microchannel layer, wherein said insulating microchannel layer is disposed between said top metal layer and said base plate, wherein said lower layer is disposed between and attached to said insulating microchannel layer and said base plate, and wherein said top metal layer is coupled to the heated surface.
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Abstract
An apparatus for cooling at least one heated surface includes a base plate defining a number of inlet and outlet manifolds. The inlet manifolds are configured to receive a coolant, and the outlet manifolds exhaust the coolant. The inlet and outlet manifolds are interleaved. The apparatus also includes at least one substrate having inner and outer surfaces. The inner surface is coupled to the base plate and defines a number of microchannels that receive the coolant from the inlet manifolds and deliver the coolant to the outlet manifolds. The microchannels are oriented substantially perpendicular to the inlet and outlet manifolds. The outer surface is in thermal contact with the heated surface. The apparatus also includes an inlet plenum that supplies the coolant to the inlet manifolds, and an outlet plenum that exhausts the coolant from the outlet manifolds. The inlet plenum and outlet plenum are oriented in a plane of the base plate.
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Citations
31 Claims
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1. An apparatus for cooling at least one heated surface, said apparatus comprising:
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a base plate defining a plurality of inlet manifolds and a plurality of outlet manifolds, wherein said inlet manifolds are configured to receive a coolant and said outlet manifolds are configured to exhaust the coolant, and wherein said inlet and outlet manifolds are interleaved and are oriented in a plane of the base plate; at least one substrate having an inner surface and an outer surface, wherein said inner surface is coupled to said base plate, wherein said inner surface defines a plurality of microchannels configured to receive the coolant from said inlet manifolds and to deliver the coolant to said outlet manifolds, wherein said microchannels are oriented substantially perpendicular to said inlet and outlet manifolds, and wherein said outer surface is in thermal contact with the heated surface; an inlet plenum configured to supply the coolant to said inlet manifolds; and an outlet plenum configured to exhaust the coolant from said outlet manifolds, wherein said inlet plenum and said outlet plenum are oriented in the plane of said base plate, wherein said substrate comprises a top metal layer, an insulating microchannel layer and a lower layer, wherein said microchannels are formed in said insulating microchannel layer, wherein said insulating microchannel layer is disposed between said top metal layer and said base plate, wherein said lower layer is disposed between and attached to said insulating microchannel layer and said base plate, and wherein said top metal layer is coupled to the heated surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A heat sink for cooling at least one power device, said heat sink comprising:
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a base plate defining a plurality of inlet manifolds and a plurality of outlet manifolds, wherein said inlet manifolds are configured to receive a coolant and said outlet manifolds are configured to exhaust the coolant, and wherein said inlet and outlet manifolds are interleaved and are oriented in a plane of the base plate, wherein each of said inlet manifolds is tapered and comprises a wide end and a narrow end, wherein each of said wide ends is larger that the respective one of said narrow ends, wherein each of said outlet manifolds is tapered and comprises a wide end and a narrow end, and wherein each of said wide ends is larger that the respective one of said narrow ends; at least one substrate having an inner surface and an outer surface, wherein said inner surface is coupled to said base plate, wherein said inner surface defines a plurality of microchannels configured to receive the coolant from said inlet manifolds and to deliver the coolant to said outlet manifolds, wherein said microchannels are oriented substantially perpendicular to said inlet and outlet manifolds, and wherein said outer surface is in thermal contact with the power device; an inlet plenum configured to supply the coolant to said inlet manifolds, wherein each of said inlet manifolds extends from said inlet plenum; and an outlet plenum configured to exhaust the coolant from said outlet manifolds, wherein each of said outlet manifolds extends from said outlet plenum, and wherein said inlet plenum and said outlet plenum are oriented in the plane of said base plate, wherein said substrate comprises a top metal layer, an insulating microchannel layer and a lower layer, wherein said microchannels are formed in said insulating microchannel layer, wherein said insulating microchannel layer is disposed between said top metal layer and said base plate, wherein said lower layer is disposed between and attached to said insulating microchannel layer and said base plate, and wherein said top metal layer is coupled to the power device. - View Dependent Claims (28, 29, 30, 31)
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Specification