Method for manufacturing semiconductor device

• US 7,354,801 B2
• Filed: 09/20/2005
• Issued: 04/08/2008
• Est. Priority Date: 09/21/2004
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Sugiyama, Eiji, Ito, Kyosuke
• Primary Examiner(s): Picardat; Kevin M.
• Application Number:
  US11/229,497
• Publication Number:
  US 20060063309A1
• Time in Patent Office: 931 Days
• Field of Search: 438/113, 438/114, 438/68, 438/455, 438/458, 438/459, 438/460, 438/462, 438/463, 438/464, 438/465
• US Class Current: 438/113
• CPC Class Codes: H01L 21/7806 involving the separation of the active layers from a substrate
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate

Abstract

In the case where an integrated circuit formed of a thin film is formed over a substrate and peeled from the substrate, a fissure (also referred to as crack) is generated in the integrated circuit in some cases. The present invention is to restrain the generation of a fissure by fixing the proceeding direction of etching in one direction to make a peeled layer warp in one direction in accordance with the proceeding of etching. For example, the proceeding of etching can be controlled by utilizing the fact that a portion where a substrate is in contact with a base insulating layer is not etched in the case of patterning a peeling layer provided over the substrate, then forming the base insulating layer, and then fixing a peeled layer by the portion where the substrate is in contact with the base insulating layer.

Claims

1. A method for manufacturing a semiconductor device comprising:

forming a peeling layer over a first substrate, with a top shape of the peeling layer including at least three sides;

forming a base insulating layer over the peeling layer and the first substrate, the base insulating layer covering all of the at least three sides of the peeling layer;

forming at least one thin film integrated circuit over the peeling layer with the base insulating layer interposed therebetween;

forming a protective layer covering the thin film integrated circuit;

exposing one of the sides of the peeling layer by removing the base insulating layer selectively, while leaving the other sides of the peeling layer covered by the base insulating layer;

etching the peeling layer; and

transferring the thin film integrated circuit to a second substrate,

wherein the etching proceeds in one direction from the exposed side of peeling layer, and

wherein an adhesive material is provided on the second substrate.

2. A method for manufacturing a semiconductor device according to claim 1, wherein a top surface of the thin film integrated circuit is a rectangular shape and the exposed side of the peeling layer is located in parallel to one side or two opposing sides of the thin film integrated circuit.

3. A method for manufacturing a semiconductor device according to claim 1, wherein the base insulating layer comprises a material which does not react chemically with gas or liquid containing fluorine halide.

4. A method for manufacturing a semiconductor device according to claim 1, wherein the protective layer is comprises a material which does not react chemically with gas or liquid containing fluorine halide.

5. A method for manufacturing a semiconductor device comprising:

forming a peeling layer over a first substrate, with the a top shape of the peeling layer including at least three sides;

forming a base insulating layer over the peeling layer and the first substrate, the base insulating layer covering all of the at least three sides of the peeling layer;

forming at least one thin film integrated circuit over the peeling layer with the base insulating layer interposed therebetween;

forming a protective layer covering the thin film integrated circuit;

exposing a first side and a second side of the peeling layer by removing the base insulating layer selectively, while leaving other of the at least three sides of the peeling layer covered by the base insulating layer;

etching the peeling layers; and

transferring the thin film integrated circuit to a second substrate,

wherein the first side and the second side of the peeling layer are opposed to each other,

wherein the etching proceeds in one direction from the first side and the second side of the peeling layer, and

wherein an adhesive material is provided on the second substrate.

6. A method for manufacturing a semiconductor device according to claim 5, wherein a top surface of the thin film integrated circuit is a rectangular shape and the exposed first side of the peeling layer is located in parallel to one side or two opposing sides of the thin film integrated circuit.

7. A method for manufacturing a semiconductor device according to claim 5, wherein the base insulating layer comprises a material which does not react chemically with gas or liquid containing fluorine halide.

8. A method for manufacturing a semiconductor device according to claim 5, wherein the protective layer is comprises a material which does not react chemically with gas or liquid containing fluorine halide.

9. A method for manufacturing a semiconductor device comprising:

forming a peeling layer over a first substrate;

forming at least a first peeling layer and a second peeling layer by removing the peeling layer selectively, with a top shape of each of the first peeling layer and the second peeling layer including at least three sides;

forming a base insulating layer over the first peeling layer, the second peeling layer and the first substrate, with the base insulating layer covering all of the sides of the first peeling layer and the second peeling layer;

forming a first thin film integrated circuit over the first peeling layer with the base insulating layer interposed therebetween and a second thin film integrated circuit over the second peeling layer with the base insulating layer interposed therebetween;

forming a first protective layer covering the first thin film integrated circuit and a second protective layer covering the second thin film integrated circuit;

exposing one of the sides of the first peeling layer and one of the sides of the second peeling layer by removing the base insulating layer selectively, while leaving the other sides of the first peeling layer and the other sides of the second peeling layer covered by the base insulating layer;

etching the first and second peeling layers; and

transferring the first and second thin film integrated circuits to a second substrate,

wherein the side of the second peeling layer that is exposed is between the first and second thin film integrated circuits,

wherein the etching proceeds in one direction from the exposed side of the first peeling layer and the exposed side of the second peeling layer, and

wherein an adhesive material is provided on the second substrate.

10. A method for manufacturing a semiconductor device according to claim 9, wherein the method further comprises dividing the first and second thin film integrated circuits into the individual pieces after the transferring step.

11. A method for manufacturing a semiconductor device according to claim 9, wherein each top surface of the first and second thin film integrated circuits is a rectangular shape and each of the exposed sides of the first peeling layer and the second peeling layer is located in parallel to one side or two opposing sides of one of the thin film integrated circuits.

12. A method for manufacturing a semiconductor device according to claim 9, wherein the base insulating layer comprises a material which does not react chemically with gas or liquid containing fluorine halide.

13. A method for manufacturing a semiconductor device according to claim 9, wherein the protective layer is comprises a material which does not react chemically with gas or liquid containing fluorine halide.

14. A method for manufacturing a semiconductor device comprising:

forming a peeling layer over a first substrate;

forming at least a first peeling layer and a second peeling layer by removing the peeling layer selectively, with a top shape of each of the first peeling layer and the second peeling layer including at least three sides;

forming a base insulating layer over the first peeling layer, the second peeling layer and the first substrate, with the base insulating layer covering all of the sides of the first peeling layer and the second peeling layer;

forming a first thin film integrated circuit over the first peeling layer with the base insulating layer interposed therebetween and a second thin film integrated circuit over the second peeling layer with the base insulating layer interposed therebetween;

forming a first protective layer covering the first thin film integrated circuit and a second protective layer covering the second thin film integrated circuit;

exposing one of the sides of the first peeling layer and one of the sides of the second peeling layer by removing the base insulating layer selectively, while leaving the other sides of the first peeling layer and the other sides of the second peeling layer covered by the base insulating layer;

etching the first and second peeling layers; and

interposing the first and second thin film integrated circuits between a first film and a second film by thermocompressing,

wherein the side of the second peeling layer that is exposed is between the first thin film integrated circuit and the second thin film integrated circuit,

wherein the etching proceeds in one direction from the exposed side of the first peeling layer and the exposed side of the second peeling layer, and

wherein an adhesive material is provided on the second substrate.

15. A method for manufacturing a semiconductor device according to claim 14, the method further comprises dividing the first and second thin film integrated circuits into the individual pieces after the interposing step.

16. A method for manufacturing a semiconductor device according to claim 14, wherein each top surface of the first and second thin film integrated circuits is a rectangular shape and each of the exposed sides of the first peeling layer and the second peeling layer is located in parallel to one side or two opposing sides of one of the thin film integrated circuits.

17. A method for manufacturing a semiconductor device according to claim 14, wherein the base insulating layer comprises a material which does not react chemically with gas or liquid containing fluorine halide.

18. A method for manufacturing a semiconductor device according to claim 14, wherein the protective layer is comprises a material which does not react chemically with gas or liquid containing fluorine halide.

19. A method for manufacturing a semiconductor device comprising:

forming a peeling layer over a first substrate, with a top shape of the peeling layer including at least three sides;

forming a base insulating layer over the peeling layer, the base insulating layer covering all of the at least three sides of the peeling layer;

forming at least first and second thin film integrated circuits over the peeling layer;

forming a protective layer for covering the first and second thin film integrated circuits;

exposing a first side and a second side of the peeling layer by selectively removing the base insulating layer, while leaving other of the at least three sides of the peeling layer covered by the base insulating layer;

partially etching the peeling layer, so as to leave a part of the peeling layer between the first and second thin film integrated circuits; and

transferring the first and second thin film integrated circuits to a second substrate,

wherein an adhesive material is provided on the second substrate.

20. A method for manufacturing a semiconductor device according to claim 19, wherein the method further comprises dividing the first and second thin film integrated circuits into the individual pieces after the transferring step.

21. A method for manufacturing a semiconductor device according to claim 19, wherein the base insulating layer comprises a material which does not react chemically with gas or liquid containing fluorine halide.

22. A method for manufacturing a semiconductor device according to claim 19, wherein the protective layer is comprises a material which does not react chemically with gas or liquid containing fluorine halide.

23. A method for manufacturing a semiconductor device according to claim 19, wherein the first and second sides of the peeling layer are opposed to each other.