Method for removal of pattern resist over patterned metal having an underlying spacer layer
First Claim
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1. A method of removing pattern resist, comprising the steps of:
- providing a wafer having an etched patterned layer and an overlying mask pattern resist outwardly from a spacer layer;
cleaning the wafer with a develop solution;
ashing the surface of the wafer;
photochemically removing the pattern resist that remains after the cleaning and ashing steps; and
selectively removing at least a majority of the spacer layer.
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Abstract
A method of removing the pattern resist that remains on a microchip wafer after etching a patterned layer that is supported by a spacer layer. After the etch, the wafer is cleaned with a develop clean process that removes polymer residues from the pattern resist surface. Next is an ash to remove the hardened pattern resist surface, followed by removal of the pattern resist.
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Citations
18 Claims
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1. A method of removing pattern resist, comprising the steps of:
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providing a wafer having an etched patterned layer and an overlying mask pattern resist outwardly from a spacer layer; cleaning the wafer with a develop solution; ashing the surface of the wafer; photochemically removing the pattern resist that remains after the cleaning and ashing steps; and selectively removing at least a majority of the spacer layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method, comprising the steps of:
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depositing a sacrificial layer; depositing material for a patterned layer; depositing a pattern resist material; etching the resist material and the material for the patterned layer; cleaning the resist material and remaining material for the patterned layer with a develop solution after said etching step; ashing the surface of the wafer after said cleaning step; photochemically removing the pattern resist that remains after the cleaning and ashing steps; and selectively removing the sacrificial layer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of forming a micromirror array, comprising the steps of:
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forming control circuitry on a semiconductor substrate; depositing a first spacer layer on the substrate; patterning the first spacer layer to define hinge support vias and spring tip support vias; depositing a hinge layer over the first spacer layer; forming at least one hinge etch mask on the hinge layer; patterning the hinge layer to form at least one hinge, wherein the pattern is formed using a pattern resist layer and an etch process; removing pattern resist that remains after the preceding step by;
cleaning the wafer with a develop solution;ashing the surface of the wafer; and
removing the pattern resist that remains after the cleaning and aching steps;depositing a second spacer layer over the hinge layer; patterning the second spacer layer to define mirror support vias; depositing a metal mirror layer over the second spacer layer; patterning the metal mirror layer to form an array of micro mirrors; and removing the first and the second spacer layers. - View Dependent Claims (16, 17, 18)
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Specification