Semiconductor device and method for high-k gate dielectrics
DCFirst Claim
1. A semiconductor device, comprising:
- a substrate;
a nitrogen-containing, substantially metal-free layer over the substrate;
a high-k dielectric material having nitrogen over the nitrogen-containing layer;
wherein the nitrogen percentage in the high-k dielectric material is lower than that in the nitrogen-containing layer; and
a gate electrode material over the high-k dielectric material.
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Abstract
A semiconductor device and process including a high-k gate dielectric is described. A substrate is provided, and a high-k gate dielectric material, preferably amorphous HfSiON, is deposited over the substrate. In preferred embodiments, the high-k dielectric material includes nitrogen. In a preferred embodiment, a silicon nitride layer is deposited using jet vapor deposition (JVD) on the high-k dielectric material. When the JVD nitride layer is deposited according to preferred embodiments, the layer has a low density of charge traps, it maintains comparable carrier mobility and provides better EOT compared to oxide or oxynitride. A second nitrogen-containing layer formed between the high-k dielectric and the gate electrode acts as a diffusion barrier. It also reduces problems relating to oxygen vacancy formation in high-k dielectric and therefore minimizes Fermi-level pinning.
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Citations
26 Claims
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1. A semiconductor device, comprising:
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a substrate; a nitrogen-containing, substantially metal-free layer over the substrate; a high-k dielectric material having nitrogen over the nitrogen-containing layer;
wherein the nitrogen percentage in the high-k dielectric material is lower than that in the nitrogen-containing layer; anda gate electrode material over the high-k dielectric material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device, comprising:
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a substrate; a nitrogen-containing layer over the substrate, wherein the nitrogen-containing layer is substantially void of metal and is deposited using jet vapor deposition (JVD); a high-k dielectric material having nitrogen over the nitrogen-containing layer wherein the high-k dielectric layer has a lower percentage of nitrogen than does the nitrogen-containing layer; and a gate electrode material over the high-k dielectric material. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A semiconductor device, comprising:
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a substrate; a non-metal, nitrogen-containing interfacial layer over the substrate; a high-k dielectric material having nitrogen over the interfacial layer wherein the nitrogen content in the high-k dielectric material is lower than the nitrogen content in the interfacial layer; a nitrogen-containing layer on the high-k dielectric material; and a gate electrode material over the nitrogen-containing layer. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26)
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Specification