Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

• US 7,355,280 B2
• Filed: 12/10/2004
• Issued: 04/08/2008
• Est. Priority Date: 09/04/2000
• Status: Expired due to Term

• Current Assignee: 138 East LCD Advancements Limited (Vector Capital Corporation)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Matsushima, Fumiaki, Ota, Tsutomu, Makabe, Akira
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US11/009,995
• Publication Number:
  US 20050087863A1
• Time in Patent Office: 1,215 Days
• Field of Search: 257/737, 257/738, 257/772, 257/779, 257/E23.021, 257/E21.508, 257/E21.509, 257/E21.519, 257/E23.015, 257/E23.02, 257E23023-E23079, 438612-617
• US Class Current: 257/738
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05164 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/11462 Electroplating
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/11822 by dipping, e.g. in a solder bath
• CPC Class Codes: H01L 2224/11849 Reflowing
• CPC Class Codes: H01L 2224/11901 with repetition of the same manufacturing step
• CPC Class Codes: H01L 2224/13012 in top view
• CPC Class Codes: H01L 2224/13078 being disposed next to each other, e.g. side-to-side arrangements
• CPC Class Codes: H01L 2224/1308 being stacked
• CPC Class Codes: H01L 2224/13083 Three-layer arrangements
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/1411 : the bump connectors being bonded to at least one common bonding area
• CPC Class Codes: H01L 2224/274 : by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/94 : at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01061 : Promethium [Pm]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA

Abstract

A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.

Claims

1. A semiconductor device comprising:

a semiconductor chip having a plurality of pads;

a metal layer disposed on each of the pads;

a plurality of leads, and

a soldering or brazing material disposed between the metal layer and one of the leads;

wherein the metal layer is bonded to one of the leads through the soldering or brazing material,

wherein a through-hole which is provided in the direction of the height of the metal layer is formed at the center of the metal layer, the through-hole exposing a portion of each of the pads, and

the soldering or brazing material is put in the through-hole.

2. The semiconductor device according to claim 1,

wherein two or more the metal layers are formed on one of the pads, and

the soldering or brazing material is put in a region formed between adjacent metal layers of the two or more the metal layers on one of the pads.

3. A circuit board on which is mounted the semiconductor device according to claim 1.

4. An electronic instrument comprising the semiconductor device according to claim 1.