Method of fabricating an imaging device for collecting photons
First Claim
Patent Images
1. A method of fabricating an imaging device, said method comprising:
- forming a plurality of photosensors on a wafer;
forming an insulating layer on the wafer over the plurality of photosensors;
forming a respective opening in the insulating layer, above the plurality of photosensors; and
depositing a reflecting material on sidewalls of each opening.
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Abstract
A photon collector has a reflecting metal layer to increase photon collection efficiency in a solid state imaging sensor. The reflecting metal layer reflects incident light internally to a photosensor. A plurality of photon collectors is formed in a wafer substrate over an array of photosensors. The photon collector is formed in an opening in an insulating layer provided over each photosensor.
39 Citations
15 Claims
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1. A method of fabricating an imaging device, said method comprising:
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forming a plurality of photosensors on a wafer; forming an insulating layer on the wafer over the plurality of photosensors; forming a respective opening in the insulating layer, above the plurality of photosensors; and depositing a reflecting material on sidewalls of each opening. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of fabricating an imaging device, said method comprising:
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forming a photodiode within a semiconductor substrate located beneath an insulating layer; providing an etch stop layer over said the photodiode; etching an opening in the insulating layer above the photodiode to the etch stop layer; depositing a light-reflecting metal on sidewalls of the opening; and filling the opening with an optically transparent material. - View Dependent Claims (15)
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Specification