Method for fabricating packaged die
First Claim
Patent Images
1. A method, comprising:
- fabricating at least two dies on a wafer, wherein the at least two dies are joined at a saw street;
forming a recess in the saw street;
filling the recess with an electrically conducting material;
connecting a bond pad from at least one of the dies to the electrically conductive material with a metal on each die between the bond pad and the electrically conductive material; and
separating the at least two dies from each other along the saw street.
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Abstract
Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
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Citations
24 Claims
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1. A method, comprising:
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fabricating at least two dies on a wafer, wherein the at least two dies are joined at a saw street; forming a recess in the saw street; filling the recess with an electrically conducting material; connecting a bond pad from at least one of the dies to the electrically conductive material with a metal on each die between the bond pad and the electrically conductive material; and separating the at least two dies from each other along the saw street. - View Dependent Claims (2, 3, 4)
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5. A method, comprising:
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patterning a recess in a saw street intermediate adjacent dies in a wafer; depositing an electrically conductive material in the recess to form an edge contact; connecting a bond pad of both dies to the edge contact by forming a metal line on each die between the bond pad and the edge contact; and separating the adjacent dies along the saw street such that each dies includes a part of the edge contact. - View Dependent Claims (6, 7, 8)
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9. A method, comprising:
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fabricating at least two dies on a wafer, wherein the at least two dies are joined at a saw street, wherein fabricating the dies includes fabricating a memory on at least one die; forming a recess in the saw street; filling the recess with an electrically conducting material; connecting a bond pad from at least one of the dies to the electrically conductive material by forming a metal on each die between the bond pad and the electrically conductive material; and separating the at least two dies from each other along the saw street. - View Dependent Claims (10, 11, 12)
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13. A method of forming an electrical system, comprising:
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forming a first circuit having first contacts, and forming a die having an integrated circuit formed therein, wherein the die includes; a main body including a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer; forming a bond pad on the main body; forming an edge contact at the peripheral edge surface, the edge contacts being in electrical communication with the first contacts; and connecting a line to the bond pad to the edge contact. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A method of forming an electrical system, comprising:
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forming a first circuit having first contacts, and forming a die having an integrated circuit formed therein, wherein forming the die includes;
forming a main body to a first height and including a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer;forming a bond pad on the main body; forming edge contacts to a second height essentially equal to the first height at the peripheral edge surface, the edge contacts being in electrical communication with the first contacts; and connecting a line to the bond pad to the edge contact. - View Dependent Claims (20, 21, 22, 23)
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24. A method of forming an electrical system, comprising:
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forming a first circuit having first contacts, and forming a die having an integrated circuit formed therein, wherein forming the die includes;
forming a main body to a first height and including a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer;forming a bond pad on the main body at the top layer; forming edge contacts to a second height essentially equal to the first height at the peripheral edge surface, the edge contacts being in electrical communication with the first contacts; and connecting a line to the bond pad to the edge contact.
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Specification