Circuit substrate and apparatus including the circuit substrate
First Claim
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1. A circuit substrate comprising:
- a substrate including a first surface and a second surface opposite to the first surface;
a first conductor pattern formed on the first surface;
a second conductor pattern formed on the second surface;
an external terminal formed on the second conductor pattern to mount the circuit substrate on a second substrate;
a dielectric layer formed on the second conductor pattern and the second surface; and
a third conductor pattern formed on the dielectric layer and the second surface, whereinthe second surface has larger surface roughness than the first surface,the dielectric layer covers the edge of the second conductor pattern,the third conductor pattern covers the edge of the second conductor pattern through the dielectric layer, andthe second conductor pattern, the dielectric layer and the third conductor pattern form a capacitor.
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Abstract
The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are formed on the first and the second surface respectively. The second surface has larger surface roughness than the first surface. When the circuit substrate is mounted on another substrate, it is mounted to the other substrate via the second surface. The circuit substrate is capable of mounting a device or being mounted on another substrate to form an apparatus.
43 Citations
9 Claims
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1. A circuit substrate comprising:
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a substrate including a first surface and a second surface opposite to the first surface; a first conductor pattern formed on the first surface; a second conductor pattern formed on the second surface; an external terminal formed on the second conductor pattern to mount the circuit substrate on a second substrate; a dielectric layer formed on the second conductor pattern and the second surface; and a third conductor pattern formed on the dielectric layer and the second surface, wherein the second surface has larger surface roughness than the first surface, the dielectric layer covers the edge of the second conductor pattern, the third conductor pattern covers the edge of the second conductor pattern through the dielectric layer, and the second conductor pattern, the dielectric layer and the third conductor pattern form a capacitor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification