Electromagnetic interference shields for electronic devices

• US 7,358,447 B2
• Filed: 09/10/2003
• Issued: 04/15/2008
• Est. Priority Date: 06/06/1994
• Status: Expired due to Term

• Current Assignee: Deep Coat, LLC
• Original Assignee: WaveZero, Inc.
• Inventors: Gabower, John F.
• Primary Examiner(s): Ngo; Hung V.
• Application Number:
  US10/659,838
• Publication Number:
  US 20040048077A1
• Time in Patent Office: 1,679 Days
• Field of Search: 174/35.R, 174/35.MS, 174/378, 174/390, 361/816, 361/818
• US Class Current: 174/378
• CPC Class Codes: B29C 2791/001 Shaping in several steps
• CPC Class Codes: B29C 2791/006 Using vacuum
• CPC Class Codes: B29C 51/10 Forming by pressure difference, e.g. vacuum
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: C23C 14/20 on organic substrates
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: H05K 9/0045 being rigid plastic containers having a coating of shielding material
• CPC Class Codes: H05K 9/0073 Shielding materials H05K9/0003 takes precedence
• CPC Class Codes: H05K 9/0084 comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.

Claims

1. An EMI/RFI shielding device comprising:

a shaped polymer substrate comprised of a metallized polymer substrate and a first surface that has been modified to increase surface tension of the shaped polymer substrate;

wherein the shaped polymer substrate is substantially conductive;

a conductive material on at least the first surface of the shaped polymer substrate that has been modified to increase surface tension of the shaped polymer substrate;

wherein the shaped polymer substrate comprises polyvinyl chloride, polycarbonate, polybutylene terephthalate, or polyethylene terephthalate glycol; and

wherein the shaped polymer substrate is shaped to have an enclosure for enclosing an electronic component.

2. The EMI/RFI shielding device of claim 1 wherein the conductive material comprises aluminum.

3. The EMI/RFI shielding device of claim 1 wherein the conductive material comprises a substantially uniform thickness over at least one surface of the shaped polymer substrate.

4. The EMI/RFI shielding device of claim 1 further comprising grinding and re-extruding a metal material along with the polymer substrate.

5. The EMI/RFI shielding device of claim 1 wherein the conductive material comprises copper.

6. The EMI/RFI shielding device of claim 1 wherein the conductive material comprises nickel.

7. The EMI/RFI shielding device of claim 1 wherein the first surface that has been modified to increase surface tension of the shaped polymer substrate has been bombarded by an ionized gas in an evacuated chamber.

8. An EMI/RFI shielding device comprising:

a shaped polymer substrate comprised of a metallized polymer substrate, wherein the shaped polymer substrate is substantially conductive;

a conductive material on at least one surface of the shaped polymer substrate;

wherein the shaped polymer substrate comprises;

a first surface;

a plurality of sidewalls that comprise a first end and a second end, wherein a first end of each of the sidewalls are coupled to the first surface, wherein the sidewalls extend at an angle from the first surface, wherein the first surface and sidewalls define an enclosure portion;

a peripheral flange coupled to the second end of the sidewalls that extends around the enclosure portion;

wherein the shaped polymer substrate is shaped to have an enclosure for enclosing an electronic component; and

wherein at least one surface of the shaped polymer substrate has been modified to increase surface tension of the shaped polymer substrate.

9. An EMI/RFI shield comprising:

a thermoformed thin-walled shape formed of a recycled metallized polymeric material, wherein the thermoformed thin-walled shape comprises an inner surface, an outer surface and edges, and wherein the polymeric material comprises polyvinyl chloride, polycarbonate, polybutylene terephthalate, or polyethylene terephthalate glycol, and wherein the polymeric material is shaped to have an enclosure for enclosing an electronic component, and wherein at least one surface of the shaped polymer substrate has been modified to increase surface tension of the shaped polymer substrate; and

a conductive material deposited on at least one of the inner surface and outer surface, wherein the conductive coating comprises a substantially even thickness between 1 micron to 50 microns.

10. The EMI/RFI shielding device of claim 9 wherein the surface of the shaped polymer substrate has been modified to increase surface tension of the shaped polymer substrate has been bombarded by an ionized gas in an evacuated chamber.

11. An EMI/RFI shield comprising:

a thermoformed thin-walled shape formed of a recycled metallized polymeric material, wherein the thermoformed thin-walled shape comprises;

an inner surface, an outer surface and edges;

a first surface;

a plurality of sidewalls that comprise a first end and a second end, wherein a first end is coupled to the first surface, wherein the sidewalls extend at an angle from the first surface, wherein the first surface and sidewalls define an enclosure portion;

a peripheral flange coupled to the second end of the sidewalls that extends around the enclosure portion;

a conductive material deposited on at least one of the inner surface and outer surface, wherein the conductive coating comprises a substantially even thickness between 1 micron to 50 microns;

wherein the polymeric material is shaped to have an enclosure for enclosing an electronic component; and

wherein at least one surface of the shaped polymer material has been modified to increase surface tension of the shaped polymer substrate.

12. The EMI/RFI shielding device of claim 11 wherein the surface of the shaped polymer material has been modified to increase surface tension of the shaped polymer substrate has been bombarded by an ionized gas in an evacuated chamber.