Planar optical waveguide assembly
First Claim
1. A planar optical waveguide assembly prepared by a method comprising the steps of:
- (i) applying a curable polymer composition to a surface of a substrate to form a polymer film;
(ii) curing the polymer film to form a lower clad layer;
(iii) applying a silicone composition to the lower clad layer to form a silicone film, wherein the silicone composition comprises;
(A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule,(B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, and(C) a catalytic amount of a photoactivated hydrosilylation catalyst;
(iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region;
(v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and
(vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23°
C. for light having a wavelength of 589 nm;
wherein the lower clad layer has a refractive index less than the refractive index of the silicone core.
1 Assignment
0 Petitions
Accused Products
Abstract
A planar optical waveguide assembly prepared by a method comprising the steps of (i) applying a curable polymer composition to a surface of a substrate to form a polymer film; (ii) curing the polymer film to form a lower clad layer; (iii) applying a silicone composition to the lower clad layer to form a silicone film; (iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23° C. for light having a wavelength of 589 nm; wherein the lower clad layer has a refractive index less than the refractive index of the silicone core.
-
Citations
6 Claims
-
1. A planar optical waveguide assembly prepared by a method comprising the steps of:
-
(i) applying a curable polymer composition to a surface of a substrate to form a polymer film; (ii) curing the polymer film to form a lower clad layer; (iii) applying a silicone composition to the lower clad layer to form a silicone film, wherein the silicone composition comprises; (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, and (C) a catalytic amount of a photoactivated hydrosilylation catalyst; (iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23°
C. for light having a wavelength of 589 nm;
wherein the lower clad layer has a refractive index less than the refractive index of the silicone core. - View Dependent Claims (2, 3)
-
-
4. A planar optical waveguide prepared by a method comprising the steps of:
-
(i) applying a curable polymer composition to a surface of a substrate to form a polymer film; (ii) curing the polymer film to form a lower clad layer; (iii) applying a silicone composition to the lower clad layer to form a silicone film, wherein the silicone composition comprises; (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, and (C) a catalytic amount of a photoactivated hydrosilylation catalyst; (iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (v) heating the partially exposed film for an amount of time such that the exposed region is substantially insoluble in a developing solvent and the non-exposed region is soluble in the developing solvent; (vi) removing the non-exposed region of the heated film with the developing solvent to form a patterned film; and (vii) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23°
C. for light having a wavelength of 589 nm;
wherein the lower clad layer has a refractive index less than the refractive index of the silicone core. - View Dependent Claims (5, 6)
-
Specification