Optical semiconductor device having a lead frame and electronic equipment using same

• US 7,358,599 B2
• Filed: 02/24/2005
• Issued: 04/15/2008
• Est. Priority Date: 02/25/2004
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Nagura, Kazuhito, Ohe, Nobuyuki
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US11/063,554
• Publication Number:
  US 20050184374A1
• Time in Patent Office: 1,146 Days
• Field of Search: 257/E33.059, 257/E33.058, 257/E33.073, 257/E33.072, 257/E31.117, 257/E31.127, 257 98-100, 257/427, 257/678, 257/601, 264/272.17, 372/108, 385/15, 385/89, 385/92
• US Class Current: 257/678
• CPC Class Codes: G02B 6/4206 Optical features G02B6/4207, G02B6/421 take precedence
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01055 Cesium [Cs]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3 which has an optical portion 6 and which is mounted on a surface of the submount 8 opposite to a surface on a side of the aperture 7 with the optical portion 6 facing the aperture 7 through the submount 8, a molding portion 10 made of a non-transparent molding resin which exposes at least a region including the aperture 7 on the other surface side of the lead frame 4 and which encapsulates the lead frame 4, the semiconductor optical element 3 and the submount 8, and a lens 9 disposed on the other surface of the lead frame 4 to close the aperture 7.

Claims

1. An optical semiconductor device comprising:

a lead frame having an aperture;

a submount having transparency which is disposed on one surface of the lead frame to close the aperture of the lead frame;

a semiconductor optical element which has an optical portion and which is mounted on a surface of the submount opposite to a surface on a side of the a aperture of the lead frame with the optical portion facing the aperture through the submount;

a molding portion made of a non-transparent molding resin which exposes at least a region including the aperture on the other surface side of the lead frame and which encapsulates the lead frame, the semiconductor optical element and the submount; and

a lens attached to the other surface of the lead frame to close the aperture of the lead frame, wherein

the non-transparent molding resin includes a 70 wt % or more filler.

2. The optical semiconductor device as defined in claim 1, wherein

the submount is provided with an electrode which is electrically connected to a front-surface electrode of the semiconductor optical element.

3. The optical semiconductor device as defined in claim 1, wherein

the electrode mounted on the submount has at least one notch, and

a space between the submount and the optical portion of the semiconductor optical element is filled with a transparent resin.

13. The optical semiconductor device as defined in claim 1, wherein

the lead frame has at least two alignment hole portions, and

the lens has protrusions which are fitted into the hole portions of the lead frame.

14. The optical semiconductor device as defined in claim 13, wherein

the hole portions of the lead frame are provided in a vicinity of the aperture of the lead frame and in a region closed by the submount.

15. The optical semiconductor device as defined in claim 13, wherein

the lens is made of a transparent resin,

the non-transparent molding resin includes a filler, and

the lens is mounted on the molding portion and the lead frame with an adhesive made of a resin having the same level of coefficient of linear expansion as that of the non-transparent molding resin.

16. The optical semiconductor device as defined in claim 15, wherein

the adhesive has transparency and is filled in the aperture and the hole portions of the lead frame.

17. The optical semiconductor device as defined in claim 16, wherein

the lens has an adhesive reservoir portion for containing the adhesive around the protrusions.

23. Electronic equipment including the optical semiconductor device as defined in claim 1.

4. An optical semiconductor device comprising:

a lead frame having an aperture;

a submount having transparency which is disposed on one surface of the lead frame to close the aperture of the lead frame;

a semiconductor optical element which has an optical portion and which is mounted on a surface of the submount opposite to a surface on a side of the aperture of the lead frame with the optical portion facing the aperture through the submount;

a molding portion made of a non-transparent molding resin which exposes at least a region including the aperture on the other surface side of the lead frame and which encapsulates the lead frame, the semiconductor optical element and the submount; and

a lens attached to the other surface of the lead frame to close the aperture of the lead frame, wherein

the molding portion has a hole portion that exposes the aperture, and

the hole portion in the molding portion has a partial cone shape with an opening that is larger than the aperture side at the lead frame.

5. The optical semiconductor device as defined in claim 4, wherein

the lens is made of a transparent resin.

6. The optical semiconductor device as defined in claim 5, wherein

the non-transparent molding resin contains a filler, and

the lens is attached at least to the molding portion out of the molding portion and the lead frame with an adhesive made of a resin having the same level of coefficient of linear expansion as that of the non-transparent molding resin.

7. The optical semiconductor device as defined in claim 6, wherein

the lens has a mounting portion in a region outside an optical path, and

the molding portion has a recess portion for mounting of the lens, the recess portion corresponding to the mounting portion of the lens.

8. The optical semiconductor device as defined in claim 7, wherein

the mounting portion of the lens has an adhesive reservoir portion for containing the adhesive.

9. The optical semiconductor device as defined in claim 4, wherein

the lens has a protruding portion which is fitted into the aperture of the lead frame.

10. The optical semiconductor device as defined in claim 9, wherein

the lens is made of a transparent resin,

the non-transparent molding resin includes a filler, and

the lens is mounted on the molding portion and the lead frame with an adhesive made of a resin having the same level of coefficient of linear expansion as that of the non-transparent molding resin.

11. The optical semiconductor device as defined in claim 10, wherein

the adhesive has transparency and is filled in the aperture of the lead frame.

12. The optical semiconductor device as defined in claim 11, wherein

the lens has an adhesive reservoir portion for containing the adhesive around the protruding portion.

18. The optical semiconductor device as defined in claim 4, further comprising

a signal processing integrated circuit which is disposed on the lead frame and is electrically connected to the semiconductor optical element.

19. The optical semiconductor device as defined in claim 18, wherein

the semiconductor optical element is a light-receiving device, and the signal processing integrated circuit is an amplifying integrated circuit for amplifying an output signal from the light-receiving device, and

the light-receiving device and the amplifying integrated circuit are included in a single chip.

20. The optical semiconductor device as defined in claim 18, wherein

the semiconductor optical element includes a light-emitting device and a light-receiving device, and

the signal processing integrated circuit includes a driving integrated circuit for driving the light-emitting device and an amplifying integrated circuit for amplifying an output signal from the light-receiving device.

21. The optical semiconductor device as defined in claim 20, wherein

the driving integrated circuit and the amplifying integrated circuit are included in a single chip.

22. The optical semiconductor device as defined in claim 18, wherein

the signal processing integrated circuit includes at least one of an output external connection terminal for outputting information regarding operational states and an input external connection terminal for receiving control information.