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Optical semiconductor device having a lead frame and electronic equipment using same

  • US 7,358,599 B2
  • Filed: 02/24/2005
  • Issued: 04/15/2008
  • Est. Priority Date: 02/25/2004
  • Status: Expired due to Fees
First Claim
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1. An optical semiconductor device comprising:

  • a lead frame having an aperture;

    a submount having transparency which is disposed on one surface of the lead frame to close the aperture of the lead frame;

    a semiconductor optical element which has an optical portion and which is mounted on a surface of the submount opposite to a surface on a side of the a aperture of the lead frame with the optical portion facing the aperture through the submount;

    a molding portion made of a non-transparent molding resin which exposes at least a region including the aperture on the other surface side of the lead frame and which encapsulates the lead frame, the semiconductor optical element and the submount; and

    a lens attached to the other surface of the lead frame to close the aperture of the lead frame, whereinthe non-transparent molding resin includes a 70 wt % or more filler.

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