Architecture for face-to-face bonding between substrate and multiple daughter chips
First Claim
Patent Images
1. An integrated circuit system including:
- a first integrated circuit die having input/output circuits disposed thereon and further having a first array of face-to-face bonding structures disposed on a first face thereof, the first integrated circuit die having no digital programmable logic circuits disposed thereon;
a family of second integrated circuit dice, each member of the family having digital programmable logic circuits disposed thereon and each member of the family having a size that is an integer multiple of a unit-tile size in each of an X and Y direction, further having a second array of face-to-face bonding structures disposed on a first face thereof, the second array of face-to-face bonding structures of each member of the family mates with different portion of the first array of face-to-face bonding structures, each member of the family having no input/output circuits disposed thereon.
7 Assignments
0 Petitions
Accused Products
Abstract
An integrated circuit system includes a first integrated circuit die and a family of second integrated circuit dice. The first integrated circuit die have input/output circuits disposed thereon and further have a first array of face-to-face bonding structures disposed on a first face thereof. Each member of the family of second integrated circuit dice have logical function circuits disposed thereon and further have a second array of face-to-face bonding structures disposed on a first face thereof. The second array of face-to-face bonding structures of each member of the family mates with a different portion of the first array of face-to-face bonding structures.
-
Citations
14 Claims
-
1. An integrated circuit system including:
-
a first integrated circuit die having input/output circuits disposed thereon and further having a first array of face-to-face bonding structures disposed on a first face thereof, the first integrated circuit die having no digital programmable logic circuits disposed thereon; a family of second integrated circuit dice, each member of the family having digital programmable logic circuits disposed thereon and each member of the family having a size that is an integer multiple of a unit-tile size in each of an X and Y direction, further having a second array of face-to-face bonding structures disposed on a first face thereof, the second array of face-to-face bonding structures of each member of the family mates with different portion of the first array of face-to-face bonding structures, each member of the family having no input/output circuits disposed thereon. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
-
-
14. An integrated circuit system comprising:
-
a mother integrated circuit die, including a substrate, input/output circuits disposed on the substrate, and an array of face-to-face bonding structures disposed on a surface of the substrate and organized into repeatable tiles, and adapted to receive a first daughter integrated circuit die and a second daughter integrated circuit die via face to face bonding at the array of bonding structures, the mother integrated circuit die having no digital programmable logic circuits disposed thereon; and at least one first and second daughter integrated circuit dice including digital programmable logic circuits each connectable to the mother integrated circuit die via one of the tiles of bonding structures on the mother integrated circuit die, each at least one first and second daughter integrated circuit die having a size that is an integer multiple of a unit-tile size in each of an X and Y direction, and further having no input/output circuits disposed thereon.
-
Specification