Probing apparatus, probing circuit board and probing system for high-voltage matrix probing
First Claim
1. A probing apparatus for high-voltage matrix probing, the probing apparatus, electrically connected with a plurality of probe points and a plurality of interface signals, receiving a test signal and generating a probing result, the probing apparatus comprising:
- a plurality of probing pins;
a command decoding unit manufactured with a mixed high-voltage IC process;
a plurality of transmission switch elements manufactured with the mixed high-voltage IC process; and
a plurality of receiving switch elements manufactured with the mixed high-voltage IC process;
wherein the plurality of probing pins are electrically connected with the plurality of probe points, the command decoding unit is electrically connected with the plurality of interface ports and controls on/off statuses of the plurality of transmission switch elements and/or the plurality of receiving switch elements, the plurality of transmission switch elements transmit the test signal to the corresponding probing pins in response to the command decoding unit, and the plurality of receiving switch elements generate the probing result corresponding to the corresponding probing pins in response to the command decoding unit.
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Accused Products
Abstract
A probing apparatus, probing circuit board and probing system for high-voltage matrix probing are provided. Switching circuits of the probing apparatus capable of probing a plurality of probing points for high-voltage matrix probing are manufactured with using a mixed high-voltage IC process. The probing circuit board comprises a plurality of probing apparatuses integrated on a bare circuit board. The probing system comprises a plurality of probing circuit boards integrated in a machine.
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Citations
32 Claims
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1. A probing apparatus for high-voltage matrix probing, the probing apparatus, electrically connected with a plurality of probe points and a plurality of interface signals, receiving a test signal and generating a probing result, the probing apparatus comprising:
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a plurality of probing pins; a command decoding unit manufactured with a mixed high-voltage IC process; a plurality of transmission switch elements manufactured with the mixed high-voltage IC process; and a plurality of receiving switch elements manufactured with the mixed high-voltage IC process; wherein the plurality of probing pins are electrically connected with the plurality of probe points, the command decoding unit is electrically connected with the plurality of interface ports and controls on/off statuses of the plurality of transmission switch elements and/or the plurality of receiving switch elements, the plurality of transmission switch elements transmit the test signal to the corresponding probing pins in response to the command decoding unit, and the plurality of receiving switch elements generate the probing result corresponding to the corresponding probing pins in response to the command decoding unit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A probing circuit board for high-voltage matrix probing, the probing circuit board, electrically connected with a plurality of probe points and a plurality of interface signals, receiving a test signal and generating a probing result, the probing circuit board comprising:
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a bare printed circuit board; a connection unit mounted on the bare printed circuit board; and a plurality of probing apparatuses mounted on the bare printed circuit board, each of the probing apparatuses comprising a plurality of probing pins, a command decoding unit, a plurality of transmission switch elements, and a plurality of receiving switch elements; wherein the connection unit electrically connects the plurality of probe points and the plurality of interface ports with the plurality of probing apparatuses, the plurality of probing pins are electrically connected with the connection unit, the command decoding unit is manufactured with a mixed high-voltage IC process and electrically connected with the plurality of interface ports and controls on/off statuses of the plurality of transmission switch elements and/or the plurality of receiving switch elements, the plurality of transmission switch elements are manufactured with the mixed high-voltage IC process and transmit the test signal to the corresponding probing pins in response to the control of the command decoding unit, and the plurality of receiving switch elements are manufactured with the mixed high-voltage IC process and generate the probing result corresponding to the plurality of probing pins in response to the control of the command decoding unit. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A probing system for high-voltage matrix probing, the probing system probing an electrically connected object with a test signal and generating a probing result, the probing system comprising:
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a plurality of probe points electrically connected with the object; a control unit for generating a plurality of interface signals and receiving the probing result; and a plurality of probing circuit boards, each of the probing circuit boards comprising; a bare printed circuit board; a connection unit mounted on the bare printed circuit board; and a plurality of probing apparatuses mounted on the bare printed circuit board, each of the probing apparatuses comprising a plurality of probing pins, a command decoding unit, a plurality of transmission switch elements and a plurality of receiving switch elements; wherein the connection unit is electrically connected with the plurality of probe points and transmits a plurality of interface signals to the plurality of probing apparatuses, the plurality of probing pins are electrically connected with the connection unit, the command decoding unit is manufactured with a mixed high-voltage IC process and receives the plurality of interface signals to control on/off statuses of the plurality of transmission switch elements and/or the plurality of receiving switch elements, the plurality of transmission switch elements are manufactured with the mixed high-voltage IC process and transmit the test signal to the corresponding probing pins in response to the control of the command decoding unit, and the plurality of receiving switch elements are manufactured with the mixed high-voltage IC process and generate the probing result corresponding to the plurality of probing pins in response to the control of the command decoding unit. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification