Printer apparatus

• US 7,359,202 B2
• Filed: 12/20/2005
• Issued: 04/15/2008
• Est. Priority Date: 05/20/1992
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Wakabayashi, Kenichi, Takayama, Chitoshi, Shiozaki, Tadashi
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US11/314,726
• Publication Number:
  US 20060158858A1
• Time in Patent Office: 847 Days
• Field of Search: 361/687, 361/690, 361/692, 361702-712, 361714-719, 361/732, 361/737, 361/803, 361/816, 361/818, 361/694, 361/753, 361/761, 361/726, 361/727, 257715-727, 365/52.63, 165/80.2, 165/80.3, 165/80.4, 165/165, 165/185, 235/380, 235/441, 235/492, 174/35.R, 174/50, 174/51
• US Class Current: 361/714
• CPC Class Codes: B41J 29/377 Cooling or ventilating arrangements
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07741 comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0256 of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

A printer apparatus is disclosed. The printer apparatus includes a heat dissipation plate structure including a thermally conductive material, and a processor comprising a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is coupled to the heat dissipation structure and is adapted to dissipate heat from the processor. An array of pins is substantially perpendicular to the major surface of the processor. The apparatus also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly. The apparatus also includes a memory for storing print image data, the memory being operatively coupled to the processor. It also includes a printing unit operatively coupled to the memory for printing on paper.

Claims

1. A printer apparatus comprising:

a heat dissipation plate structure comprising a thermally conductive material;

a processor comprising a major surface, wherein said processor generates heat when energized, and wherein the heat dissipation plate structure is coupled to the processor and is adapted to dissipate heat from the processor;

an array of pins, wherein the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor;

a socket assembly;

a circuit board, wherein the socket assembly is on the circuit board, and

wherein the pins in the array of pins are configured to be received in the socket assembly;

a memory for storing print image data, the memory being operatively coupled to the processor; and

a printing unit operatively coupled to the memory for printing on paper.

2. The printer apparatus of claim 1 wherein the processor is a microprocessor.

3. The printer apparatus of claim 1 wherein the heat dissipation plate structure comprises aluminum.

4. The printer apparatus of claim 1 wherein the processor is a RISC type processor.

5. The printer apparatus of claim 1 wherein the processor operates at a frequency of 25 MHz or more.

6. The printer apparatus of claim 1 further comprising a paper source, which supplies paper for the printing unit.

7. The printer apparatus of claim 1 further comprising a conductive structure mechanically coupled to the processor, and wherein the conductive structure forms an electromagnetic shield for the processor.

8. The printer apparatus of claim 1 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure is grounded to the circuit board.

9. The printer apparatus of claim 1 wherein the pins are only at a peripheral region of the processor.

10. The printer apparatus of claim 1 wherein the printer apparatus is a laser printer.

11. The printer apparatus of claim 1 further comprising a control panel operatively coupled to the processor for allowing a user to control the printer apparatus.

12. A printer apparatus comprising:

a heat dissipation structure comprising a thermally conductive material;

a processor comprising a major surface, wherein said processor generates heat when energized, and wherein the processor is coupled to the heat dissipation structure and is adapted to dissipate heat from the processor;

an array of pins, wherein the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor;

a circuit board, wherein the processor is mounted to the circuit board;

a compressible element under the circuit board;

a memory for storing print image data, the memory being operatively coupled to the processor; and

a printing unit operatively coupled to the memory for printing on paper.

13. The printer apparatus of claim 12 wherein the compressible element is in the form of a cylinder.

14. The printer apparatus of claim 12 wherein the processor is a microprocessor.

15. The printer apparatus of claim 12 wherein the heat dissipation structure comprises aluminum.

16. The printer apparatus of claim 12 wherein the processor is a RISC type processor.

17. The printer apparatus of claim 12 wherein the processor operates at a frequency of 25 MHz or more.

18. The printer apparatus of claim 12 further comprising a paper source, which supplies paper for the printing unit.

19. The printer apparatus of claim 12 further comprising a conductive structure mechanically coupled to the processor, and wherein the conductive structure forms an electromagnetic shield for the processor.

20. The printer apparatus of claim 12 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure is grounded to the printed circuit board.

21. The printer apparatus of claim 12 wherein the pins are only at a peripheral region of the processor.

22. The printer apparatus of claim 12 wherein the printer apparatus is a laser printer.

23. The printer apparatus of claim 12 further comprising a control panel operatively coupled to the processor for allowing a user to control the printer apparatus.