Image sensor package and its manufacturing method

• US 7,359,579 B1
• Filed: 10/08/2004
• Issued: 04/15/2008
• Est. Priority Date: 10/08/2004
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Seo, Seong Min, Paek, Jong Sik, Jang, Ho Cheol
• Primary Examiner(s): Tran; Phuoc
• Application Number:
  US10/962,221
• Time in Patent Office: 1,285 Days
• Field of Search: 382/312, 250/239, 250/208.1, 257/678, 257/734
• US Class Current: 382/312
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05026 the internal layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

Disclosed are an image sensor package and a method for manufacturing the same. A sealing portion is formed between an image sensor die and a glass substrate to completely isolate the sensing portion of the image sensor die from external environment. Electrically conductive bumps are formed outside of the sealing portion to electrically connect the image sensor die to the glass substrate. The image sensor die can be sealed by a cap while the image sensor die is connected to the glass substrate via the electrically conductive bumps.

Claims

1. An image sensor package comprising:

an image sensor die having an approximately planar first surface, an approximately planar second surface which is opposite to the first surface, a sensing portion formed in the center of the first surface for sensing external images, a first sealing pad formed on the outer peripheral edge of the sensing portion, and a number of first bonding pads formed on the outer peripheral edge of the first sealing pad;

a glass substrate having an approximately planar first surface, an approximately planar second surface which is opposite to the first surface of the glass substrate, a second sealing pad formed on the second surface of the glass substrate, a number of second bonding pads formed on the outer peripheral edge of the second sealing pad, and a number of ball pads formed on the outer peripheral edges of the second bonding pads;

a sealing portion connecting the first sealing pad of the image sensor die and the second sealing pad of the glass substrate to each other;

electrically conductive bumps connecting the first bonding pads of the image sensor die and the second bonding pads of the glass substrate to each other; and

a number of solder balls fused on the ball pads of the glass substrate.

2. An image sensor package as claimed in claim 1, wherein the first sealing pad has the shape of an approximately square ring when viewed from above.

3. An image sensor package as claimed in claim 1, wherein the image sensor die has a protective layer formed on the first surface of the image sensor die, and the first sealing pad is formed on the protective layer.

4. An image sensor package as claimed in claim 1, wherein the sealing portion is formed of solder.

5. An image sensor package as claimed in claim 1, wherein the second sealing pad is formed of copper.

6. An image sensor package as claimed in claim 1, wherein the second sealing pad is electrically separated from the second bonding pads, and the second bonding pads are electrically connected to the ball pads by electrically conductive patterns.

7. An image sensor package as claimed in claim 1, wherein the solder balls are formed on the outer peripheral edge of the image sensor die.

8. An image sensor package as claimed in claim 1, wherein the electrically conductive bumps are surrounded by an underfill.

9. An image sensor package as claimed in claim 1, wherein the first sealing pad and the second sealing pad have at least one air vent incision formed in locations corresponding to each other.

10. An image sensor package as claimed in claim 1, wherein the sealing portion has at least one air vent formed thereon.

11. An image sensor package comprising:

an image sensor die having an approximately planar first surface, an approximately planar second surface which is opposite to the first surface, a sensing portion formed in the center of the first surface for sensing external images, and a number of first bonding pads formed on the outer peripheral edge of the sensing portion;

a glass substrate having an approximately planar first surface, an approximately planar second surface which is opposite to the first surface of the glass substrate, a number of second bonding pads formed on the second surface, and a number of ball pads formed on the outer peripheral edges of the second bonding pads;

electrically conductive bumps connecting the first bonding pads of the image sensor die and the second bonding pads of the glass substrate to each other;

a number of solder balls fused on the ball pads of the glass substrate; and

a cap glued on the glass substrate with an adhesive, the cap covering the image sensor die.

12. An image sensor package as claimed in claim 11, wherein the solder balls are formed on the outer peripheral edge of the cap.

13. An image sensor package as claimed in claim 11, wherein the height of the solder balls is larger than that of the cap.

14. An image sensor package as claimed in claim 11, wherein the cap has at least one air vent formed thereon.

15. An image sensor package comprising:

an image sensor die having an approximately planar first surface, an approximately planar second surface which is opposite to the first surface, a sensing portion formed in the center of the first surface for sensing external images, a number of first bonding pads formed on the outer peripheral edge of the sensing portion, and a first sealing pad formed on the outer peripheral edges of the first bonding pads;

a glass substrate having an approximately planar first surface, an approximately planar second surface which is opposite to the first surface, a number of second bonding pads formed on the second surface, a second sealing pad formed on the outer peripheral edges of the second bonding pads, and a number of ball pads formed on the outer peripheral edge of the second sealing pad;

electrically conductive bumps connecting the first bonding pads of the image sensor die and the second bonding pads of the glass substrate to each other;

a sealing portion connecting the first sealing pad of the image sensor die and the second sealing pad of the glass substrate to each other; and

a number of solder balls fused on the ball pads of the glass substrate.

16. An image sensor package as claimed in claim 15, wherein the first sealing pad has the shape of an approximately square ring when viewed from above.

17. A method for manufacturing an image sensor package comprising:

preparing an image sensor die having an approximately planar first surface, an approximately planar second surface which is opposite to the first surface, a sensing portion formed in the center of the first surface for sensing external images, a first sealing pad formed on the outer peripheral edge of the sensing portion, and a number of first bonding pads formed on the outer peripheral edge of the first sealing pad;

forming a sealing portion on the first sealing pad and electrically conductive bumps on the first bonding pads, respectively;

preparing a glass substrate having an approximately planar first surface, an approximately planar second surface which is opposite to the first surface of the glass substrate, a second sealing pad formed on the second surface of the glass substrate, a number of second bonding pads formed on the outer peripheral edge of the second sealing pad, and a number of ball pads formed on the outer peripheral edges of the second bonding pads;

fusing solder balls on the ball pads; and

connecting the sealing portion to the second sealing pad and the electrically conductive bumps to the second bonding pads, respectively.

18. A method for manufacturing an image sensor package as claimed in claim 17, wherein the forming a sealing portion and electrically conductive bumps is performed by printing solder and then causing the solder to reflow.

19. A method for manufacturing an image sensor package as claimed in claim 17, wherein the forming a sealing portion and electrically conductive bumps is performed by plating solder.

20. A method for manufacturing an image sensor package as claimed in claim 17, wherein the preparing a glass substrate further includes forming UBM on the lower surfaces of the second sealing pad, the first bonding pads, and the ball pads.