Method of manufacturing recognition sensor
First Claim
1. A method of manufacturing a surface shape recognition sensor, comprising the steps of:
- forming an interlevel dielectric on a semiconductor substrate;
forming a first metal film on the interlevel dielectric;
forming a first mask pattern having an opening portion in a predetermined region on the first metal film;
forming a first metal pattern on a surface of the first metal film exposed to a bottom portion of the opening portion of the first mask pattern by plating;
after the first mask pattern is removed, forming a second mask pattern having an opening portion laid out around the first metal pattern on the first metal film and first metal pattern;
forming a second metal pattern thicker than the first metal pattern on the surface of the first metal film exposed to a bottom portion of the opening portion of the second mask pattern by plating;
after the second mask pattern is removed, etching and removing the first metal film using the first and second metal patterns as a mask to form a lower electrode formed from the first metal film and first metal pattern and a support electrode formed from the first metal film and second metal pattern;
forming a sacrificial film on the interlevel dielectric to cover the lower electrode while keeping an upper portion of the support electrode exposed;
forming an upper electrode having a plurality of opening portions on the sacrificial film and support electrode;
after the upper electrode is formed, selectively removing only the sacrificial film through the opening portions;
after the sacrificial film is removed, forming a protective film on the upper electrode; and
forming a plurality of projections in a region of the protective film above a capacitive detection element, wherein a plurality of capacitive detection elements each having the lower electrode and upper electrode are formed, and the protective film is formed on the upper electrode by transfer.
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Abstract
A method of manufacturing a surface shape recognition sensor. A sacrificial film is formed on an interlevel dielectric to cover a lower electrode while keeping an upper portion of a support electrode exposed. An upper electrode is formed on the sacrificial film and support electrode. The sacrificial film is selectively removed and a protective film is formed on the upper electrode. A photosensitive resin film having photosensitivity is formed on the protective film. A plurality of projections are formed in a region of the protective film above a capacitive detection element. In this manner a plurality of capacitive detection elements each having the lower electrode and upper electrode are formed.
12 Citations
29 Claims
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1. A method of manufacturing a surface shape recognition sensor, comprising the steps of:
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forming an interlevel dielectric on a semiconductor substrate; forming a first metal film on the interlevel dielectric; forming a first mask pattern having an opening portion in a predetermined region on the first metal film; forming a first metal pattern on a surface of the first metal film exposed to a bottom portion of the opening portion of the first mask pattern by plating; after the first mask pattern is removed, forming a second mask pattern having an opening portion laid out around the first metal pattern on the first metal film and first metal pattern; forming a second metal pattern thicker than the first metal pattern on the surface of the first metal film exposed to a bottom portion of the opening portion of the second mask pattern by plating; after the second mask pattern is removed, etching and removing the first metal film using the first and second metal patterns as a mask to form a lower electrode formed from the first metal film and first metal pattern and a support electrode formed from the first metal film and second metal pattern; forming a sacrificial film on the interlevel dielectric to cover the lower electrode while keeping an upper portion of the support electrode exposed;
forming an upper electrode having a plurality of opening portions on the sacrificial film and support electrode;after the upper electrode is formed, selectively removing only the sacrificial film through the opening portions; after the sacrificial film is removed, forming a protective film on the upper electrode; and forming a plurality of projections in a region of the protective film above a capacitive detection element, wherein a plurality of capacitive detection elements each having the lower electrode and upper electrode are formed, and the protective film is formed on the upper electrode by transfer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of manufacturing a surface shape recognition sensor, comprising the steps of:
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forming an interlevel dielectric on a semiconductor substrate; forming a first metal film on the interlevel dielectric; forming a first mask pattern having an opening portion in a predetermined region on the first metal film; forming a first metal pattern on a surface of the first metal film exposed to a bottom portion of the opening portion of the first mask pattern by plating; after the first mask pattern is removed, forming a second mask pattern having an opening portion laid out around the first metal pattern on the first metal film and first metal pattern; forming a second metal pattern thicker than the first metal pattern on the surface of the first metal film exposed to a bottom portion of the opening portion of the second mask pattern by plating; after the second mask pattern is removed, etching and removing the first metal film using the first and second metal patterns as a mask to form a lower electrode formed from the first metal film and first metal pattern and a support electrode formed from the first metal film and second metal pattern; forming a sacrificial film on the interlevel dielectric to cover the lower electrode while keeping an upper portion of the support electrode exposed; forming an upper electrode having a plurality of opening portions on the sacrificial film and support electrode; after the upper electrode is formed, selectively removing only the sacrificial film through the opening portions; after the sacrificial film is removed, forming a photosensitive resin film having photosensitivity on the upper electrode; and simultaneously forming a protective film that covers the upper electrode and a plurality of projections laid out in a region of the protective film above a capacitive detection element by exposing and developing a predetermined pattern on the photosensitive resin film, wherein a plurality of capacitive detection elements each having the lower electrode and upper electrode are formed. - View Dependent Claims (21, 22, 23)
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24. A method of manufacturing a surface shape recognition sensor, comprising the steps of:
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forming an interlevel dielectric on a semiconductor substrate; forming a first metal film on the interlevel dielectric; forming a first mask pattern having an opening portion in a predetermined region on the first metal film; forming a first metal pattern on a surface of the first metal film exposed to a bottom portion of the opening portion of the first mask pattern by plating; after the first mask pattern is removed, forming a second mask pattern having an opening portion laid out around the first metal pattern on the first metal film and first metal pattern; forming a second metal pattern thicker than the first metal pattern on the surface of the first metal film exposed to a bottom portion of the opening portion of the second mask pattern by plating; after the second mask pattern is removed, etching and removing the first metal film using the first and second metal patterns as a mask to form a lower electrode formed from the first metal film and first metal pattern and a support electrode formed from the first metal film and second metal pattern; forming a sacrificial film on the interlevel dielectric to cover the lower electrode while keeping an upper portion of the support electrode exposed; forming an upper electrode having a plurality of opening portions on the sacrificial film and support electrode; after the upper electrode is formed, selectively removing only the sacrificial film through the opening portions;
after the sacrificial film is removed, forming a protective film on the upper electrode;forming a second metal film on the protective film; forming a third mask pattern having an opening portion in a predetermined region on the second metal film; forming a third metal pattern on a surface of the second metal film exposed to a bottom portion of the opening portion of the third mask pattern by plating; and after the third mask pattern is removed, etching and removing the second metal film using the third metal pattern as a mask to form a projection formed from the second metal film and third metal pattern wherein a plurality of capacitive detection elements each having the lower electrode and upper electrode are formed; wherein in forming the coat, the coat is laid out on a force acting side of the substrate and hardened, and wherein the protective film is formed on the upper electrode by transfer. - View Dependent Claims (25, 26, 27, 28, 29)
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Specification