Method of registering a spacer with a conducting track

• US 7,361,379 B2
• Filed: 03/01/2006
• Issued: 04/22/2008
• Est. Priority Date: 03/02/2005
• Status: Expired due to Fees

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Fyson, John R., Rider, Christopher B.
• Primary Examiner(s): Rose; Kiesha
• Assistant Examiner(s): Jones; Eric W
• Application Number:
  US11/365,251
• Publication Number:
  US 20060199362A1
• Time in Patent Office: 783 Days
• Field of Search: 438/597, 438149-164, 349 1-202, 427/108
• US Class Current: 427/108
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells

Abstract

A method of producing a relief structure on a patterned conductor comprises the steps of; coating a layer of conductive material onto a transparent substrate, coating a layer of metal onto the layer of conductive material, coating a layer of photoresist onto the layer of metal, curing the layer of photoresist, exposing a desired pattern of transparent conductors through a first mask onto the layer of photoresist, developing the photoresist and simultaneously etching the layer of the conductive material and the layer of metal, exposing a desired pattern of metal conductors through a second mask onto the remaining layer of photoresist, developing the photoresist and etching the layer of metal, applying a further layer of photoresist, curing the further layer of photoresist, exposing the further layer of photoresist thorough the substrate, developing the photoresist and allowing the layer to dry, resulting in a pattern of spacers/reliefs in registration with the metal conductors.

Claims

1. A method of producing a relief structure on a patterned conductor comprising the steps of:

coating a layer of conductive material onto a transparent substrate;

coating a layer of metal onto the layer of conductive material;

coating a layer of photoresist onto the layer of metal;

curing the layer of photoresist;

exposing, through a first mask, a desired pattern of transparent conductors onto the layer of photoresist;

developing the photoresist and simultaneously etching the layer of the conductive material and the layer of metal;

exposing, through a second mask, a desired pattern of metal conductors onto the remaining layer of photoresist;

developing the photoresist and etching the layer of metal,

applying a further layer of photoresist;

curing the further layer of photoresist;

exposing the further layer of photoresist thorough the substrate; and

developing the photoresist and allowing the layer to dry, resulting in a pattern of spacers/reliefs in registration with the metal conductors.

2. A method as claimed in claim 1, wherein the etched layer is coated with a layer of dielectric material prior to the application of the further layer of photoresist.

3. A method as claimed in claim 1, wherein the metal is silver.

4. A method as claimed in claim 1, wherein the substrate is flexible.

5. A method as claimed in claim 1, wherein the conducting layer is comprised of an inorganic material.

6. A device manufactured by the method claimed in claim 1.