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Laser marking system for dice carried in trays and method of operation

  • US 7,361,862 B2
  • Filed: 12/04/2001
  • Issued: 04/22/2008
  • Est. Priority Date: 12/21/1998
  • Status: Expired due to Fees
First Claim
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1. A system for marking integrated circuit (IC) packages comprising:

  • a plurality of trays, each tray being sized and configured to carry a plurality of discrete integrated circuit (IC) packages;

    a transport actuator including a tray transport;

    a tray carrier carried by, and unsecured to, the tray transport of the transport actuator for receiving at least one tray of IC packages of the plurality of trays;

    an input shuttle assembly for providing the at least one tray of IC packages to the tray carrier;

    an output shuttle assembly for receiving the at least one tray of IC packages from the tray carrier; and

    a laser marking station disposed adjacent a portion of the transport actuator between the input shuttle assembly and the output shuttle assembly.

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