Device and method for fabricating liquid crystal display device

• US 7,364,633 B2
• Filed: 09/15/2003
• Issued: 04/29/2008
• Est. Priority Date: 11/15/2002
• Status: Expired due to Term

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Philips LCD Company Limited (LG Display Co., Ltd.)
• Inventors: Lim, Young Kug, Kim, Heung Sun, Kwak, Soo Min
• Primary Examiner(s): KOCH, GEORGE R
• Application Number:
  US10/661,515
• Publication Number:
  US 20040095548A1
• Time in Patent Office: 1,688 Days
• Field of Search: 156/378, 156/351, 156/379, 156/358, 156/381, 156/382, 156/585, 156/550, 156/64, 156/273.7, 156/275.5, 156/275.7, 156/295, 156/299, 298/33, 298/34
• US Class Current: 156/64
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells
• CPC Class Codes: G02F 1/1341 Filling or closing of cells
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face

Abstract

A device for fabricating LCD devices includes a base frame, a lower chamber unit on the base frame, an upper chamber unit over the lower chamber unit and moveable over the base frame, chamber moving means for raising/lowering the upper chamber unit, stages within interior spaces of the upper and lower chamber units, wherein substrates are securable to each of the stages, and sealing means on at least one surface of the chamber units for sealing an interior space definable by joined upper and lower chamber units, the substrates being within the sealed interior space. A method for fabricating LCD devices includes loading substrates onto stages, lowering an upper chamber unit to seal an interior space from an external environment, evacuating the sealed interior space, aligning the first and second substrates, contacting the first and second substrates with sealant material, venting the sealed interior space, and unloading the bonded substrates.

Claims

1. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame;

a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface;

an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface;

chamber moving means mounted to the base frame for raising and lowering the upper chamber unit;

an upper stage fixed to the upper chamber unit for securing a first substrate;

a lower stage fixed to the lower chamber unit for securing a second substrate; and

sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising;

loading the first and second substrates onto the upper and lower stages, respectively;

lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;

evacuating the sealed interior space;

moving the upper chamber unit and the upper stage aligning the first and second substrates;

contacting the first and second substrates with a sealant material;

venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and second substrates are bonded together; and

unloading the bonded substrates,

wherein the moving the upper chamber unit and the upper stage includes;

spacing the first and second substrates apart by a first predetermined distance;

aligning at least one set of rough alignment marks; and

aligning at least one set of fine alignment marks after aligning the rough alignment marks, wherein the distance between the first and second substrates is varied during the aligning of the fine alignment marks.

2. The method as claimed in claim 1, wherein a distance between the first and second substrates is less than the first predetermined distance during the aligning of the fine alignment marks.

3. The method as claimed in claim 1, wherein aligning the rough alignment marks includes determining a state of alignment using two cameras arranged at at least two diagonally opposed regions of the first and second substrates.

4. The method as claimed in claim 1, wherein aligning the fine alignment marks includes determining a state of alignment using cameras arranged at four corner regions of the first and second substrates.

5. The method as claimed in claim 1, wherein varying the distance between the first and second substrates includes:

arranging the upper stage such that the first and second substrates do not contact each other; and

lowering the upper stage such that a central portion of the first contacts a central portion of the second substrate,

wherein the fine alignment marks are aligned between the arranging and the lowering of the upper stage.

6. The method as claimed in claim 1, wherein aligning the rough alignment marks includes focusing an alignment camera at an intermediate point between the first and second substrates.

7. The method as claimed in claim 1, wherein aligning the fine alignment marks includes focusing an alignment camera at an intermediate point between the first and second substrates.

8. The method as claimed in claim 1, wherein aligning the rough alignment marks includes further comprising alternating a focusing of an alignment camera between rough alignment marks formed on the second substrate and on rough alignment marks formed on the first substrate.

9. The method as claimed in claim 1, wherein aligning the fine alignment marks includes further comprising alternating a focusing of an alignment camera between fine alignment marks formed on the second substrate and on fine alignment marks formed on the first substrate.

10. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame;

a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface;

an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface;

chamber moving means mounted to the base frame for raising and lowering the upper chamber unit;

an upper stage fixed to the upper chamber unit for securing a first substrate;

a lower stage fixed to the lower chamber unit for securing a second substrate; and

sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising;

loading the first and second substrates onto the upper and lower stages, respectively;

lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;

evacuating the sealed interior space;

moving the upper chamber unit and the upper stage aligning the first and second substrates;

contacting the first and second substrates with a sealant material;

venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and second substrates are bonded together;

unloading the bonded substrates,

wherein loading the first substrate to the upper stage includes applying a suction force and an electrostatic charge from the upper stage to the first substrate and, after aligning the first and second substrates, the method further comprising;

deactivating the electrostatic charge applied from the upper stage;

raising the upper chamber unit to a predetermined height;

determining an alignment state of the first and second substrates; and

realigning the aligned first and second substrates based upon the determination of the alignment state.

11. The method as claimed in claim 10, wherein the determining the alignment state includes using at least one set of fine alignment marks.

12. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame;

a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface;

an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface;

chamber moving means mounted to the base frame for raising and lowering the upper chamber unit;

an upper stage fixed to the upper chamber unit for securing a first substrate;

a lower stage fixed to the lower chamber unit for securing a second substrate; and

sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising;

loading the first and second substrates onto the upper and lower stages, respectively;

lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;

evacuating the sealed interior space;

moving the upper chamber unit and the upper stage aligning the first and second substrates;

contacting the first and second substrates with a sealant material;

venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and second substrates are bonded together;

unloading the bonded substrates;

providing a plurality of venting holes within the upper and lower stages; and

providing low vacuum chamber pipelines to the sealed interior space, wherein the venting includes;

in a first venting step, injecting nitrogen gas into the sealed interior space through the plurality of venting holes provided within the upper and lower stages; and

in a second step, injecting nitrogen gas through the low vacuum chamber pipelines increase the pressure inside the sealed interior space equal to an atmospheric pressure.

13. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame;

a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface;

an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface;

chamber moving means mounted to the base frame for raising and lowering the upper chamber unit;

an upper stage fixed to the upper chamber unit for securing a first substrate;

a lower stage fixed to the lower chamber unit for securing a second substrate; and

sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising;

loading the first and second substrates onto the upper and lower stages, respectively;

lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;

evacuating the sealed interior space;

moving the upper chamber unit and the upper stage, aligning the first and second substrates;

contacting the first and second substrates with a sealant material;

venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and substrates are bonded together; and

unloading the bonded substrates,

wherein the unloading includes;

securing the bonded substrates to the upper stage;

raising the upper stage to which the bonded substrates are secured;

arranging a loader proximate the bonded substrates, secured to the upper stage;

releasing the bonded substrates from the upper stage, wherein the released bonded substrates are supported by the loader; and

removing the loader supporting the bonded substrates from the substrate bonding machine.

14. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame;

a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface;

an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface;

chamber moving means mounted to the base frame for raising and lowering the upper chamber unit;

an upper stage fixed to the upper chamber unit for securing a first substrate;

a lower stage fixed to the lower chamber unit for securing a second substrate; and

sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising;

loading the first and second substrates onto the upper and lower stages, respectively;

lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;

evacuating the sealed interior space;

moving the upper chamber unit and the upper stage aligning the first and second substrates;

contacting the first and second substrates with a sealant material;

venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and second substrates are bonded together;

unloading the bonded substrates,

wherein the unloading includes;

securing the bonded substrates to the upper stage;

raising the upper stage to which the bonded substrates are secured;

raising a lift pin through the lower stage and over the upper surface, wherein the raised lift pin is proximate the secured bonded substrates;

releasing the bonded substrates from the upper stage, wherein the released bonded substrates are supported by the raised lift pin; and

arranging a loader proximate the bonded substrates supported by the raised lift pin;

lowering the raised lift pin such that the bonded substrates are supported by the loader; and

removing the loader supporting the bonded substrates from the substrate bonding machine.

15. A method for fabricating a liquid crystal display (LCD) panel using a substrate bonding device having a base frame;

a lower chamber unit mounted to the base frame, wherein the lower chamber unit includes an upper surface;

an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit is moveable relative to the base frame and wherein the upper chamber unit includes a lower surface;

chamber moving means mounted to the base frame for raising and lowering the upper chamber unit;

an upper stage fixed to the upper chamber unit for securing a first substrate;

a lower stage fixed to the lower chamber unit for securing a second substrate; and

sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable joined ones of the upper and lower chamber units, the method comprising;

loading the first and second substrates onto the upper and lower stages, respectively;

lowering the upper chamber unit to seal the interior space from an external environment via the sealing means;

evacuating the sealed interior space;

moving the upper chamber unit and the upper stage aligning the first and second substrates;

contacting the first and second substrates with a sealant material;

venting the sealed interior space to apply pressure to the first and second substrates contacted by the sealant material, wherein, after the venting, the first and second substrates are bonded together;

unloading the bonded substrates,

wherein the unloading includes;

raising the bonded substrates above the upper surface, wherein the raised bonded substrates are supported by a raised lift pin arranged through the lower stage and over the upper surface;

arranging a loader proximate the raised bonded substrates supported by the lift pin;

lowering the raised lift pin such that the bonded substrates are supported by the loader; and

removing the loader supporting the bonded substrates from the substrate bonding machine.

16. The method as claimed in claim 15, further comprising loading an unbonded substrate onto the upper stage prior to removing the loader supporting the bonded substrates from the substrate bonding machine.