Method for manufacturing semiconductor device having super junction construction

• US 7,364,971 B2
• Filed: 02/21/2006
• Issued: 04/29/2008
• Est. Priority Date: 06/24/2003
• Status: Expired due to Fees

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Yamaguchi, Hitoshi, Hattori, Yoshiyuki, Suzuki, Mikimasa
• Primary Examiner(s): Lebentritt; Michael
• Assistant Examiner(s): Lee; Kyoung
• Application Number:
  US11/356,984
• Publication Number:
  US 20060138407A1
• Time in Patent Office: 798 Days
• Field of Search: None
• US Class Current: 438/268
• CPC Class Codes: H01L 29/0634 Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
• CPC Class Codes: H01L 29/1095 Body region, i.e. base region, of DMOS transistors or IGBTs cell layout H01L29/0696
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236

Abstract

A semiconductor device includes a body region, a drift region having a first part and a second part, and a trench gate electrode. The body region is disposed on the drift region. The first and second parts extend in an extending direction so that the second part is adjacent to the first part. The trench gate electrode penetrates the body region and reaches the drift region so that the trench gate electrode faces the body region and the drift region through an insulation layer. The trench gate electrode extends in a direction crossing with the extending direction of the first and second parts. The first part includes a portion near the trench gate electrode, which has an impurity concentration equal to or lower than that of the body region.

Claims

1. A method for manufacturing a semiconductor device, comprising the steps of:

forming a plurality of second parts having a second conductive type, wherein each second part is disposed separately;

forming a plurality of first parts having a first conductive type, wherein each first part is disposed between the second parts so that a drift region including the first and second parts aligned alternately in a repeat direction is provided;

forming a body region having the first conductive type on the drift region;

forming a trench, which penetrates the body region and reaches the drift region, wherein the trench extends in parallel to the repeat direction;

forming an insulation film on an inner wall of the trench;

embedding a gate electrode in the trench through the insulation film; and

reducing an impurity concentration of a portion of the first part of the drift region so that the impurity concentration of the portion is equal to or lower than that of the body region, wherein the portion of the first part is disposed near the trench.

2. The method according to claim 1,

wherein the first part of the drift region except for the portion near the trench has another impurity concentration, which is equal to or higher than that of the body region.

3. The method according to claim 1,

wherein the step of forming the first parts is performed by an epitaxial growth method, and

wherein the step of forming the body region is performed by the epitaxial growth method, which is continuously performed after the step of forming the first parts.

4. The method according to claim 1, further comprising the step of:

forming a source region having the second conductive type,

wherein the source region is disposed on a surface of the body region, and adjacent to the trench through the insulation layer.

5. The method according to claim 4,

wherein the source region extends along with the trench.

6. The method according to claim 1, further comprising the step of:

forming a drain region having the second conductive type,

wherein the drain region is disposed under the drift region,

wherein the first part of the drift region extends between the body region and the drain region in the extending direction, and

wherein the second part of the drift region extends between the body region and the drain region in the extending direction.

7. The method according to claim 1, further comprising the steps of:

forming a plurality of trenches, which penetrates the body region and reaches the drift region,

wherein the trenches extend in parallel to the repeat direction;

forming an insulation film on an inner wall of each trench; and

embedding a gate electrode in each trench through the insulation film,

wherein the trenches are aligned in parallel together, and

wherein the trenches are disposed separately so that the body region is sandwiched between the trenches.

8. The method according to claim 7, further comprising the step of:

forming a plurality of source regions having the second conductive type,

wherein each source region is disposed on a surface of the body region, and adjacent to the trench through the insulation layer.

9. The method according to claim 8, further comprising the step of:

forming a plurality of body contact regions having the first conductive type,

wherein each body contact region is disposed on the surface of the body region, and sandwiched between the trenches through the source regions.

10. The method according to claim 1, further comprising the steps of:

forming a source region having the second conductive type; and

forming a drain region having the second conductive type, wherein the source region is disposed on a surface of the body region, and adjacent to the trench through the insulation layer,

wherein the drain region is disposed under the drift region, wherein the first part of the drift region extends between the body region and the drain region in the extending direction,

wherein the second part of the drift region extends between the body region and the drain region in the extending direction, and

wherein the source region, the body region, the drift region, the drain region and the trench provide a vertical type MOSFET.

11. A method for manufacturing a semiconductor device, comprising the steps of:

forming a plurality of second parts having a second conductive type,

wherein each second part is disposed separately;

forming a plurality of first parts having a first conductive type,

wherein each first part is disposed between the second parts so that an under drift region including the first and second parts aligned alternately in a repeat direction is provided;

forming a semiconductor layer on the under drift region,

wherein the semiconductor layer has the first conductive type and an impurity concentration of the semiconductor layer is equal to or lower than that of the first part of the under drift region; and

doping an impurity having the second conductive type into a part of the semiconductor layer so that the part of the semiconductor layer changes its conductive type from the first conductive type to the second conductive type, wherein the part of the semiconductor layer is disposed on the second part.

12. The method according to claim 11,

wherein the part of the semiconductor layer has an impurity concentration equal to that of the second part after the step of doping the impurity.

13. The method according to claim 12, further comprising the steps of:

forming a body region having the first conductive type on the semiconductor layer after the step of doping the impurity;

forming a trench, which penetrates the body region and reaches the semiconductor layer, wherein the trench extends in parallel to the repeat direction;

forming an insulation film on an inner wall of the trench; and

embedding a gate electrode in the trench through the insulation film.

14. The method according to claim 13,

wherein the impurity concentration of the semiconductor layer is equal to or lower than that of the body region.

15. The method according to claim 13, further comprising the steps of:

forming a plurality of trenches, which penetrates the body region and reaches the semiconductor layer, wherein the trenches extend in parallel to the repeat direction;

forming an insulation film on an inner wall of each trench; and

embedding a gate electrode in each trench through the insulation film,

wherein the trenches are aligned in parallel together, and

wherein the trenches are disposed separately so that the body region is sandwiched between the trenches.

16. The method according to claim 15, further comprising the step of:

forming a plurality of source regions having the second conductive type,

wherein each source region is disposed on a surface of the body region, and adjacent to the trench through the insulation layer.

17. The method according to claim 13, further comprising the step of:

forming a drain region having the second conductive type,

wherein the drain region is disposed under the under drift region,

wherein the first part of the under drift region extends between the body region and the drain region in an extending direction, and

wherein the second part of the under drift region extends between the body region and the drain region in the extending direction.