Polymer systems with reactive and fusible properties for solid freeform fabrication

• US 7,365,129 B2
• Filed: 10/14/2003
• Issued: 04/29/2008
• Est. Priority Date: 10/14/2003
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Kramer, Laura, Kasperchik, Vladek, Boyd, Melissa D.
• Primary Examiner(s): Nutter; Nathan M.
• Application Number:
  US10/686,137
• Publication Number:
  US 20050080191A1
• Time in Patent Office: 1,659 Days
• Field of Search: 525/191, 525/208, 525/217, 525/221, 525/222, 525/239, 525/240, 525/241
• US Class Current: 525/191
• CPC Class Codes: B29C 64/165 using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
• CPC Class Codes: B33Y 70/00 Materials specially adapted for additive manufacturing
• CPC Class Codes: C08F 210/02 Ethene
• CPC Class Codes: C08F 8/00 Chemical modification by after-treatment graft polymers, block polymers, crosslinking with unsaturated monomers or with polymers C08F251/00 - C08F299/00; of conjugated diene rubbers C08C

Abstract

A powder system for use in solid freeform fabrication. The powder system includes at least one polymer having reactive properties and fusible properties. The at least one polymer is reactive with a liquid binder and is fusible at a temperature above the melting point or glass transition temperature of the at least one polymer. The at least one polymer may be a single co-polymer having at least one reactive portion and at least one fusible portion or may be a mixture of polymers including at least one reactive polymer and at least one fusible polymer. A method of forming an object by solid freeform fabrication is also disclosed.

Claims

1. A powder system for use in solid freeform fabrication, consisting essentially of:

at least one first polymer powder having reactive properties and at least one second polymer powder having fusible properties, wherein the at least one first polymer comprises at least one reactive polymer and wherein the at least one second polymer comprises at least one fusible polymer, the at least one reactive polymer selected from the group consisting of a cationic polyelectrolyte, a mixture of cationic and anionic polyelectrolytes, a polymer having an epoxy functionality, a polymer having a primary amino group, and mixtures thereof and the at least one fusible polymer selected from the group consisting of an acrylate polymer or copolymer, a copolymer of vinyl/vinylidene chloride, poly(styrene-co-butyl-acrylate), a polyester, a low melting polyolefin, a polyurethane, a polyether-ester elastomer, poly(vinyl acetate), an ethylene-vinyl acetate co-polymer, a vinyl ester polymer, a vinyl ester copolymer, and mixtures thereof and wherein the at least one first polymer is selected to be reactive with a liquid binder and wherein the at least one second polymer is selected to be fusible at a temperature above the melting point or glass transition temperature of the at least one second polymer.

2. The powder system of claim 1, wherein the at least one first polymer powder comprises a single polymer.

3. The powder system of claim 2, wherein the single polymer is poly(ethylene-co-vinyl alcohol) or poly(ethylene co-methacrylic acid).

4. The powder system of claim 1, wherein the at least one fusible polymer has a melting point or glass transition temperature ranging from approximately 50°

C. to approximately 250°

C.

5. The powder system of claim 1, wherein the at least one fusible polymer is present in the powder system from approximately 25% by weight to approximately 95% by weight.

6. The powder system of claim 1, wherein both the at least one first polymer powder and the at least one second polymer powder have a particle size ranging from approximately 15 μ

m to approximately 50 μ

m.

7. A powder system for use in solid freeform fabrication, consisting essentially of:

at least one first polymer powder having reactive properties and at least one second polymer powder having fusible properties, wherein the at least one first polymer comprises at least one reactive polymer and wherein the at least one second polymer comprises at least one fusible polymer, wherein the at least one reactive polymer is polyacrylic acid, wherein the at least one fusible polymer is selected from the group consisting of an acrylate polymer or copolymer, a copolymer of vinyl/vinylidene chloride, poly(styrene-co-butyl-acrylate), a polyester, a low melting polyolefin, a polyurethane, a polyether-ester elastomer, poly(vinyl acetate), an ethylene-vinyl acetate co-polymer, a vinyl ester polymer, a vinyl ester copolymer, and mixtures thereof, and wherein the at least one first polymer is selected to be reactive with a liquid binder and wherein the at least one second polymer is selected to be fusible at a temperature above the melting point or glass transition temperature of the at least one second polymer.

8. A powder system for use in solid freeform fabrication, consisting essentially of:

at least one first polymer powder having reactive properties and at least one second polymer powder having fusible properties, wherein the at least one first polymer comprises at least one reactive polymer present in the powder system from approximately 5% by weight to approximately 75% by weight and wherein the at least one second polymer comprises at least one fusible polymer, the at least one reactive polymer selected from the group consisting of a cationic polyelectrolyte, a mixture of cationic and anionic polyelectrolytes, a polymer having an epoxy functionality, a polymer having a primary amino group, and mixtures thereof and the at least one fusible polymer selected from the group consisting of an acrylate polymer or copolymer, a copolymer of vinyl/vinylidene chloride, poly(styrene-co-butyl-acrylate), a polyester, a low melting polyolefin, a polyurethane, a polyether-ester elastomer, poly(vinyl acetate), an ethylene-vinyl acetate co-polymer, a vinyl ester polymer, a vinyl ester copolymer, and mixtures thereof, and wherein the at least one first polymer is selected to be reactive with a liquid binder and wherein the at least one second polymer is selected to be fusible at a temperature above the melting point or glass transition temperature of the at least one second polymer.