Heat sink tab for optical sub-assembly

• US 7,365,923 B2
• Filed: 01/25/2005
• Issued: 04/29/2008
• Est. Priority Date: 01/26/2004
• Status: Active Grant

• Current Assignee: Lumentum Operations, LLC (Lumentum Holdings Inc.)
• Original Assignee: JDS Uniphase Corporation (Lumentum Holdings Inc.)
• Inventors: Moon, James Robert, Hargis, Marian C., Hanley, Michael Francis
• Primary Examiner(s): Mack; Ricky
• Assistant Examiner(s): Stultz; Jessica T
• Application Number:
  US11/042,541
• Publication Number:
  US 20050162761A1
• Time in Patent Office: 1,190 Days
• Field of Search: 359/820, 385/92
• US Class Current: 359/820
• CPC Class Codes: G02B 26/06 for controlling the phase of light G02B26/08 takes precedence , measuring optical phase difference G01J9/00
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4281 the printed circuit boards being flexible in general H05K1/147
• CPC Class Codes: G02B 6/4283 with electrical insulation means
• CPC Class Codes: G02B 7/008 with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation

Abstract

The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The heat sinking tab includes a mounting plate for mounting on the rear end of a transistor outline (TO) can, and a finger for extending into contact or close proximity to the transceiver housing. The mounting plate also provides a stiffening plate for flexible conductors used to connect the OSA leads to a transceiver printed circuit board (PCB).

Claims

1. An opto-electronic device comprising:

an optical sub-assembly for converting optical signals into electrical signals or electrical signals into optical signals, the optical sub-assembly including a rear header forming the rear end thereof with electrical leads extending therefrom;

a housing including a heat dissipating cover for supporting the optical sub-assembly; and

a thermally conductive heat sinking tab for transferring heat from the optical sub-assembly to the heat dissipating cover;

wherein the heat sinking tab includes;

a mounting plate for mounting only on the rear end of the optical sub-assembly covering the rear header, with slots in the mounting plate through which the electrical leads extend, and a finger for extending into contact with or close proximity to the heat dissipating cover.

2. The device according to claim 1, wherein the mounting plate fits over the rear header of the optical sub-assembly.

3. The device according to claim 2, wherein the finger includes corrugations providing increased surface area for heat transfer.

4. The device according to claim 2, wherein the rear header is circular with the electrical leads extending therefrom;

wherein the mounting plate is circular to match the header.

5. The device according to claim 1, further comprising:

a printed circuit board mounted in the housing for controlling the optical sub-assembly; and

a flexible electrical cable electrically connecting the leads with the printed circuit board;

wherein an end of the flexible electrical cable is mounted on the mounting plate, whereby the mounting plate defines a stiffening plate for the flexible electrical cable.

6. The device according to claim 5, wherein the flexible electrical cable includes holes for receiving the leads;

wherein the holes are aligned with the slots in the mounting plate for preventing the leads from contacting the heat sinking tab and for aligning the mounting plate with the optical sub-assembly.

7. The device according to claim 1, wherein the mounting plate includes a shoulder for aligning the heat sinking tab with the rear header.

8. The device according to claim 1, further comprising a pair of wings extending perpendicular from the mounting plate along the sides of the optical sub-assembly for aligning the heat sinking tab with the optical sub-assembly.

9. The device according to claim 8, wherein the optical sub-assembly is mounted in a transistor outline (TO) can, and wherein the wings are arcuate for abutting opposites sides of the TO can.

10. The device according to claim 1, further comprising an intermediary compliant thermal material disposed between the finger and the heat dissipating cover.

11. The device according to claim 1, further comprising a thermoelectric cooler disposed between the finger and the heat dissipating cover for increasing the amount of heat transferred therebetween.