Integrated circuit package separators
First Claim
1. An integrated circuit package separator for separating a plurality of integrated circuit packages from one another, the integrated circuit packages being provided as integrated circuit chip components joined to a board, the separating including cutting the board, the separator comprising:
- a panel;
a plurality of blocks over the panel, the plurality of the blocks comprising separate and discrete structures relative a structure of the panel, the plurality of the blocks having curved upper surfaces and being configured to support the board while leaving the integrated circuit chip components extending between the block upper surfaces and the panel;
a cutting mechanism configured to cut the board while the board is supported on the blocks and to thereby separate the integrated circuit packages from one another;
a pair of actuators, each actuator configured for driving a plate positioned beneath the panel, the plates being moveable to vertically displace the panel, each actuator comprising release valves configured to equilibrate a back-pressure of the actuator to ambient prior to and during movement of the panel.
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Accused Products
Abstract
An integrated circuit package separator. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.
43 Citations
15 Claims
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1. An integrated circuit package separator for separating a plurality of integrated circuit packages from one another, the integrated circuit packages being provided as integrated circuit chip components joined to a board, the separating including cutting the board, the separator comprising:
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a panel; a plurality of blocks over the panel, the plurality of the blocks comprising separate and discrete structures relative a structure of the panel, the plurality of the blocks having curved upper surfaces and being configured to support the board while leaving the integrated circuit chip components extending between the block upper surfaces and the panel; a cutting mechanism configured to cut the board while the board is supported on the blocks and to thereby separate the integrated circuit packages from one another; a pair of actuators, each actuator configured for driving a plate positioned beneath the panel, the plates being moveable to vertically displace the panel, each actuator comprising release valves configured to equilibrate a back-pressure of the actuator to ambient prior to and during movement of the panel. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification