System and method for forming solder joints

• US 7,367,486 B2
• Filed: 09/30/2004
• Issued: 05/06/2008
• Est. Priority Date: 09/30/2004
• Status: Active Grant

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Agere Systems Incorporated (Broadcom, Inc.)
• Inventors: Kostiew, George
• Primary Examiner(s): Stoner; Kiley
• Application Number:
  US10/955,912
• Publication Number:
  US 20060065696A1
• Time in Patent Office: 1,314 Days
• Field of Search: None
• US Class Current: 228/110.1
• CPC Class Codes: B23K 1/06 making use of vibrations, e.g. supersonic vibrations
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/0292 Using vibration, e.g. during soldering or screen printing
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212

Abstract

Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a substrate/component combination into a reflow oven; directing the substrate/component combination to the heating zone of said reflow oven; and vibrating the substrate/component combination while said substrate/component combination is in said heating zone. The vibrating of the substrate/component combination occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is stimulated without displacing said substrate and said component relative to each other.

Claims

1. A method of forming a solder joint between a substrate and a component comprising solder disposed therebetween, said method comprising:

providing a carrier comprising a vibrating device;

placing a substrate and a component together to form a substrate/component combination, and putting the substrate/component onto the carrier;

placing the carrier with the substrate/component into the reflow oven;

directing the carrier with said substrate/component combination to a heating zone of said reflow oven; and

causing the vibrating device to vibrate at a predetermined time, at a predetermined temperature or at a predetermined position in the reflow oven, or a combination thereof, to vibrate said substrate/component combination while said substrate/component combination is in said heating zone, wherein said vibrating occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is encouraged without displacing said substrate and said component relative to each other, wherein said vibrating of said substrate/component combination is adapted to cause a ball of solder between said substrate and said component to collapse.

2. The method of claim 1, wherein said carrier is designed to engage a transfer conveyer comprised within said reflow oven.

3. The method of claim 1, wherein said substrate/component combination comprises interposing solder balls between said substrate and said component.

4. The method of claim 1, wherein said substrate is a printed circuit board.

5. The method of claim 1, wherein said component is a semiconductor device.

6. A method of forming a solder joint between a substrate and a component comprising solder disposed therebetween, said method comprising:

placing a substrate and a component together to form a substrate/component combination, and placing the substrate/component into a reflow oven, wherein said reflow oven comprises a platform designed for engaging said substrate/component combination, said platform comprising a vibrating device that vibrates at a predetermined time in the reflow process, or at a predetermined temperature or predetermined position in the reflow oven, said platform moving with said substrate/component through said reflow oven;

directing said substrate/component combination to a heating zone of said reflow oven; and

causing said vibrating device to move with said substrate/component through said reflow oven and vibrate said substrate/component combination while said substrate/component combination is in said heating zone, wherein said vibrating occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is encouraged without displacing said substrate and said component relative to each other, and wherein said vibrating of said substrate/component combination is adapted to cause a ball of solder between said substrate and said component to collapse.

7. The method of claim 6, wherein said platform pneumatically engages said substrate/component combination.