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System and method for forming solder joints

  • US 7,367,486 B2
  • Filed: 09/30/2004
  • Issued: 05/06/2008
  • Est. Priority Date: 09/30/2004
  • Status: Active Grant
First Claim
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1. A method of forming a solder joint between a substrate and a component comprising solder disposed therebetween, said method comprising:

  • providing a carrier comprising a vibrating device;

    placing a substrate and a component together to form a substrate/component combination, and putting the substrate/component onto the carrier;

    placing the carrier with the substrate/component into the reflow oven;

    directing the carrier with said substrate/component combination to a heating zone of said reflow oven; and

    causing the vibrating device to vibrate at a predetermined time, at a predetermined temperature or at a predetermined position in the reflow oven, or a combination thereof, to vibrate said substrate/component combination while said substrate/component combination is in said heating zone, wherein said vibrating occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is encouraged without displacing said substrate and said component relative to each other, wherein said vibrating of said substrate/component combination is adapted to cause a ball of solder between said substrate and said component to collapse.

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