Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules

• US 7,368,311 B2
• Filed: 07/21/2004
• Issued: 05/06/2008
• Est. Priority Date: 04/19/2001
• Status: Expired due to Term

• Current Assignee: Interuniversitair Micro-Electronica Centrum VZW (IMEC International)
• Original Assignee: Interuniversitair Micro-Electronica Centrum VZW (IMEC International)
• Inventors: Beyne, Eric, Tilmans, Hendrikus, De Raedt, Walter, Jansen, Henri
• Primary Examiner(s): Geyer; Scott B.
• Application Number:
  US10/897,271
• Publication Number:
  US 20050003606A1
• Time in Patent Office: 1,385 Days
• Field of Search: 438622-623, 438/725, 438/10, 438/6, 438/379, 438/48, 438/50, 438/51, 438/52, 438/54, 438/55, 438/57, 257/E27.004, 257/E27.009, 257/E27.113, 257/E27.114, 257/E29.001, 257/E29.111, 257/E29.166, 257/E29.167, 257/E29.324
• US Class Current: 438/48
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: H01H 59/0009 making use of micromechanics
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01P 1/127 Strip line switches

Abstract

An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.

Claims

1. A method of making an interconnect module on a substrate, the method comprising:

forming an interconnect section on the substrate, the interconnect section comprising at least first and second metal interconnect layers separated by a dielectric layer, wherein the minimum distance between the substrate and the second layer is greater than the minimum distance between the substrate and the first layer;

forming an RF microelectromechanical (MEMS) device on the substrate at a location laterally adjacent to the interconnect section, wherein the RF MEMS device comprises at least one moveable element comprising at least one of the first and second metal layers,

wherein forming the interconnect section comprises forming a plurality of fixed microwave integrated passive devices (IPDs) therein and connecting the fixed microwave IPDs with at least one of the the first and second interconnect metal layers.

2. The method of claim 1, wherein the moveable element is configured to carry a communication signal.

3. The method of claim 1, wherein forming the interconnect section and the RF MEMS device comprise forming on a multi-chip module with deposited thin film (MCM-D) substrate technology.

4. The method according to claim 1, wherein the RF MEMS device is configured to be electrically connected between first and second electrical components, and the moveable element is configured to communicate a data carrying signal between the first and second electrical components.

5. A method of making an interconnect module on a substrate, the method comprising:

forming an interconnect section on the substrate, the interconnect section comprising at least first and second metal interconnect layers separated by a dielectric layer, wherein the minimum distance between the substrate and the second layer is greater than the minimum distance between the substrate and the first layer;

forming a passive device on the substrate at a location laterally adjacent to the interconnect section, wherein the passive device comprises at least one moveable element comprising at least one of the first and second metal layers, wherein the passive device is configured to be electrically connected between first and second electrical components, and the moveable element is configured to communicate a data carrying signal between the first and second electrical components.