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System and method for protecting microelectromechanical systems array using back-plate with non-flat portion

  • US 7,368,803 B2
  • Filed: 03/25/2005
  • Issued: 05/06/2008
  • Est. Priority Date: 09/27/2004
  • Status: Expired due to Fees
First Claim
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1. An electronic device, comprising:

  • a substrate comprising a first surface and a second surface;

    an array of microelectromechanical devices formed on the first surface of the substrate, wherein the microelectromechanical devices are configured to operate an optical processing with light incident to the second surface;

    a back-plate placed over the array and having an interior surface and an exterior surface, the interior surface of the back-plate facing the array with a gap therebetween, the exterior surface facing away from the substrate, wherein the back-plate is configured so as not to transmit light involving the optical processing of the microelectromechanical devices; and

    wherein the interior surface is substantially parallel to the second surface of the substrate, and wherein the exterior surface is curved.

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