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Methods of making microelectronic assemblies including compliant interfaces

  • US 7,368,818 B2
  • Filed: 10/26/2005
  • Issued: 05/06/2008
  • Est. Priority Date: 09/20/1994
  • Status: Expired due to Fees
First Claim
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1. An assembly comprising:

  • (a) a structure;

    (b) a plurality of terminals electrically connected to said structure;

    (c) a plurality of compliant pads disposed between said terminals and said structure, said terminals being aligned with at least some of said pads, said pads providing a standoff between said structure and said terminals;

    (d) a flexible film, said terminals being disposed on said film, said compliant pads being disposed between said film and said structure, said film having a first side facing toward said structure and a second side facing away from said structure, said terminals being exposed at said second side of said film; and

    (e) a compliant filler disposed between said compliant pads and between said structure and said flexible film.

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