Mirror structure with single crystal silicon cross-member
First Claim
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1. A method of fabricating a mirror structure, the method comprising:
- forming a cavity in a first substrate;
implanting hydrogen ions in a second substrate;
bonding the first substrate to the second substrate; and
separating a portion of the second substrate.
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Abstract
Hydrogen cleave silicon process for light modulating mirror structure using single crystal silicon as the base cross-member. Existing processes use two critical alignment steps that can contribute to higher actuation voltages and result in lower manufacturing yields. The hydrogen cleave process simplifies the manufacturing process to one step: transferring a thin film of single crystal silicon to the CMOS substrate, resulting in minimal alignment error and providing large bonding area.
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Citations
33 Claims
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1. A method of fabricating a mirror structure, the method comprising:
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forming a cavity in a first substrate; implanting hydrogen ions in a second substrate; bonding the first substrate to the second substrate; and separating a portion of the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of fabricating a mirror structure for a micro mirror used in display applications, the method comprising:
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forming a recessed region in a bonding side of a first substrate; performing hydrogen doping of a silicon substrate to form a carrier wafer portion of the silicon substrate; joining the bonding side of the first substrate to the silicon substrate; and separating the carrier wafer portion of the silicon substrate. - View Dependent Claims (11, 12, 13, 14)
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15. A micro mirror for a spatial light modulator, the micro mirror comprising:
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a substrate comprising; addressing and control circuitry including one or more CMOS cells and operable for receiving actuation signals; and a cavity formed in a bonding side of the substrate and operable for providing a motion space during motion of the micro mirror in response to the actuation signals; a silicon cross-member coupled to the bonding side of the substrate, wherein the silicon cross-member comprises a cleaved surface; and a micro mirror coupled to the cleaved surface of the silicon cross-member and operable for moving in response to the actuation signals. - View Dependent Claims (16, 17, 18, 19)
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20. A reflecting structure comprising:
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a first substrate including addressing and control circuitry operable for receiving actuation signals, and a cavity in a bonding side operable for providing a motion space during motion of a micro mirror in response to the actuation signals; and a second substrate coupled to the bonding side and including the micro mirror operable for moving in response to the actuation signals, wherein the second substrate comprises a moveable silicon cross-member coupled to the micro mirror. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27)
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28. A method of fabricating a reflecting structure comprising:
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forming in a first substrate, addressing and control circuitry operable for receiving actuation signals, and a cavity in a bonding side operable for providing a motion space during motion of a micro mirror in response to the actuation signals; bonding a second substrate to the bonding side of the first substrate; fabricating a micro mirror on the second substrate operable for moving in response to the actuation signals; and forming a moveable silicon cross-member in the second substrate, the micro mirror coupled to the silicon cross-member. - View Dependent Claims (29, 30, 31, 32, 33)
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Specification