Apparatuses for dissipating heat from semiconductor devices

• US 7,369,410 B2
• Filed: 05/03/2006
• Issued: 05/06/2008
• Est. Priority Date: 05/03/2006
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Liu, Hsichang, Hsu, Louis, Chen, Howard, Mok, Lawrence
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US11/416,762
• Publication Number:
  US 20070258213A1
• Time in Patent Office: 734 Days
• Field of Search: 361697-702, 361704-712, 361719-722, 165/80.4, 165/80.5, 16510421-10427, 165/104.33, 165/104.34, 257/714, 257/715, 622/592
• US Class Current: 361/701
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: F28F 2215/06 Hollow fins; fins with internal circuits
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445

Abstract

An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped members have interior and exterior sidewalls, the 3D-shaped members being connected to the base section so that vapor carrying latent heat can reach the respective interior sidewalls and get transferred to the respective exterior sidewalls configured to be in contact with an external coolant. The vapor chamber is configured to be in contact with a semiconductor device in order to remove heat therefrom.

Claims

1. An apparatus for removing heat from a semiconductor structure, comprising:

a top vapor chamber having a plurality of three-dimensional (3D) shaped members and disposed on top of the semiconductor structure;

a plurality of side vapor chambers each having another set of a plurality of three-dimensional (3D) shaped members, the side vapor chambers disposed to surround the semiconductor structure, the top vapor chamber and the side vapor chambers are configured to be fluidly coupled to enable transfer of fluid therebetween;

the side vapor chambers are mounted at an angle to enable backflow of condensed fluid by gravity towards a base portion of the semiconductor structure, the base portion being in contact with a chip carrier; and

wherein the top vapor chamber and the side vapor chambers are filled with a coolant so as to completely cover sidewalls and top exterior surface of the structure in order to provide maximum surface contact and cooling capacity.

2. The apparatus of claim 1, wherein the semiconductor structure comprises a three-dimensional stacked structure having a plurality of semiconductor chips, the plurality of chips being stacked vertically such that heat is dissipated from an exterior surface of the stacked structure.

3. The apparatus of claim 2, wherein thermally conductive material is used to fill gaps between adjacent semiconductor chips of the three-dimensional stacked structure.

4. The apparatus of claim 1, wherein the side vapor chambers are mounted at an angle between 45 degrees and 70 degrees.