Electronic control enclosure

• US 7,369,413 B2
• Filed: 03/12/2007
• Issued: 05/06/2008
• Est. Priority Date: 10/19/2004
• Status: Active Grant

• Current Assignee: Cinch Connectors Incorporated (Bel Connector Incorporated)
• Original Assignee: Cinch Connectors Incorporated (Bel Connector Incorporated)
• Inventors: Kostic, Bratislav, Rachwalski, Thaddeus Michael John, Caines, Arturo
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US11/716,964
• Publication Number:
  US 20070153485A1
• Time in Patent Office: 421 Days
• Field of Search: None
• US Class Current: 361/719
• CPC Class Codes: H05K 5/0039 having a tubular housing wherein the PCB is inserted longitudinally
• CPC Class Codes: H05K 5/061 sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
• CPC Class Codes: H05K 7/2049 Pressing means used to urge contact, e.g. springs
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence

Abstract

The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.

Claims

1. An electronic control enclosure comprising:

a enclosure housing defining an interior chamber, the enclosure housing including a first wall, an opposing second wall, and a third and opposing fourth walls extending between the opposing first and second walls;

a heat sink located at least partly in the interior chamber, the heat sink including a contact arm extending generally parallel to the second wall and a locator protruding from the contact arm;

a spring aligned with and projecting toward the contact arm;

a substrate assembly including a generally planar substrate having opposing first and second surfaces and a recess disposed into the first surface, the substrate assembly further including an electrical component, the electrical component having a heat transfer surface;

wherein when the substrate is inserted into the enclosure housing such that the locator contacts the first surface, the substrate compresses the spring and is spaced apart from the contact arm; and

when the substrate is inserted into the enclosure such that the locator is received in the recess, the spring urges the heat transfer surface against the contact arm.

2. The electronic control enclosure of claim 1, wherein the heat sink further includes an exterior surface located externally of the enclosure housing, the exterior surface joined to the contact arm by a transition arm.

3. The electronic control enclosure of claim 1, wherein the locator is generally circular in shape and curves toward the second wall.

4. The electronic control enclosure of claim 1, wherein the spring is a leaf spring cambered towards the contact arm.

5. The electronic control enclosure of claim 1, wherein the enclosure housing further comprises a rear wall and wherein when the substrate is inserted into the enclosure housing, the electrical component is disposed near the rear wall.

6. The electronic control enclosure of claim 1, wherein the heat sink is mounted to the enclosure housing through the second wall.

7. The electronic control enclosure of claim 1, wherein the heat sink is integral with the enclosure housing.

8. The electronic control enclosure of claim 1, wherein the locator protrudes from the contact arm towards the second wall.

9. The electronic control enclosure of claim 1, wherein the spring is disposed proximate to the second wall.

10. The electronic control enclosure of claim 1, wherein the enclosure housing is made of a thermoplastic material.

11. The electronic control enclosure of claim 1, wherein the enclosure housing is made of metal.

12. The electronic control enclosure of claim 1, further comprising a header assembly coupled to the substrate and enclosing the enclosure housing.

13. The electronic control enclosure of claim 1, wherein the spring is coupled to the heat sink.

14. The electronic control enclosure of claim 1, wherein when the substrate is inserted into the enclosure housing such that the locator contacts the first surface, the locator deflects the substrate away from the contact arm.

15. The electronic control enclosure of claim 1, wherein the contact arm substantially extends along a length of the rear edge of the substrate.

16. The electronic control enclosure of claim 1, wherein the substrate is inserted into the enclosure housing in a direction substantially parallel with the second surface.

17. The electronic control enclosure of claim 1, wherein the contact arm is disposed generally perpendicular to the transition arm.