Semiconductor integrated circuit
First Claim
1. A semiconductor integrated circuit device for signal reception operation of a mobile radio communication apparatus comprising:
- a sealing package enclosing a semiconductor chip and having four sides and being formed in rectangular shape, in a plane view;
a first low noise amplifier into which a radio frequency reception signal of a first frequency band is to be inputted;
a second low noise amplifier into which a radio frequency reception signal of a second frequency band is to be inputted, the second frequency band being different from the first frequency band;
a first radio frequency input filter into which a radio frequency reception signal of the first frequency band is to be inputted;
a second radio frequency input filter into which a radio frequency reception signal of the second frequency band is to be inputted;
a first input pin coupled to said first radio frequency input filter; and
a second input pin coupled to said second radio frequency input filter,wherein said first and second low noise amplifiers and said first and second input pins are monolithically integrated on said semiconductor chip,wherein said first and second input pins are coupled with said first and second radio frequency input filters, respectively, at one of four sides of said semiconductor chip,wherein said first and second radio frequency input pins are disposed at said one side, andwherein said radio frequency reception signal of the first frequency band is to be applied to said first input pin and said radio frequency reception signal of the second frequency band is to be applied to said second input pin.
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Accused Products
Abstract
A pin layout which prevents degradation of a frequency characteristic of a low noise amplifier and a receiving mixer included in a semiconductor integrated circuit for dual-band transmission/reception wherein the circuit of the low noise amplifier is provided at a position where the distance from the end of a pin outside the package of the low noise amplifier to the pad is the shortest; ground pins of two low noise amplifiers and the high frequency signal pins are arranged respectively so as not to be adjacent to each other; the power source and ground pin of the low noise amplifier, and the power source and ground pin of the bias circuit are respectively separated; and high frequency signal wires do not intersect each other.
26 Citations
21 Claims
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1. A semiconductor integrated circuit device for signal reception operation of a mobile radio communication apparatus comprising:
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a sealing package enclosing a semiconductor chip and having four sides and being formed in rectangular shape, in a plane view; a first low noise amplifier into which a radio frequency reception signal of a first frequency band is to be inputted; a second low noise amplifier into which a radio frequency reception signal of a second frequency band is to be inputted, the second frequency band being different from the first frequency band; a first radio frequency input filter into which a radio frequency reception signal of the first frequency band is to be inputted; a second radio frequency input filter into which a radio frequency reception signal of the second frequency band is to be inputted; a first input pin coupled to said first radio frequency input filter; and a second input pin coupled to said second radio frequency input filter, wherein said first and second low noise amplifiers and said first and second input pins are monolithically integrated on said semiconductor chip, wherein said first and second input pins are coupled with said first and second radio frequency input filters, respectively, at one of four sides of said semiconductor chip, wherein said first and second radio frequency input pins are disposed at said one side, and wherein said radio frequency reception signal of the first frequency band is to be applied to said first input pin and said radio frequency reception signal of the second frequency band is to be applied to said second input pin. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. In a semiconductor integrated circuit device for a dual-band transmission/reception mobile communication apparatus, a signal reception operation portion of the integrated circuit device comprising:
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a first input pin to be coupled to a first radio frequency input filter into which a radio frequency reception signal of a first frequency band is to be inputted; a second input pin to be coupled to a second radio frequency input filter into which a radio frequency reception signal of a second frequency band is to be inputted, the second frequency band being different from the first frequency band; a first low noise amplifier into which a radio frequency reception signal of the first frequency band is to be inputted and being electrically connected to said first input pin; and a second low noise amplifier into which a radio frequency reception signal of a second frequency band is to be inputted and being electrically connected to said second input pin; wherein said first and second low noise amplifiers and said first and second input pins are monolithically integrated on said semiconductor chip, wherein said semiconductor chip is enclosed in a sealing package having four sides and rectangular shaped, in a plane view, and wherein said first and second input pins are disposed along a same side of the sealing package, each of said first and second input pins having an outer pin end projecting from said same side of the sealing package for coupling to said first and second radio frequency input filters, respectively. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A semiconductor integrated circuit device for signal reception operation of a mobile radio communication apparatus comprising:
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a first input pin to be coupled to a first radio frequency input filter into which a radio frequency reception signal of a first frequency band is to be inputted; a second input pin to be coupled to a second radio frequency input filter into which a radio frequency reception signal of a second frequency band is to be inputted, the second frequency band being different from the first frequency band; a first low noise amplifier into which a radio frequency reception signal of the first frequency band is to be inputted and being electrically connected to said first input pin; and a second low noise amplifier into which a radio frequency reception signal of the second frequency band is to be inputted and being electrically connected to said second input pin; wherein said first and second low noise amplifiers and said first and second input pins are monolithically integrated on said semiconductor chip, wherein said semiconductor chip is enclosed in a sealing package having four sides and rectangular shaped, in a plane view, and wherein said first and second input pins are disposed along a same side of the sealing package, each of said first and second input pins having an outer pin end projecting from said same side of the sealing package for coupling to said first and second radio frequency input filters, respectively. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification