Wiring board manufacturing method
First Claim
Patent Images
1. A method of manufacturing a wiring board, said method comprising:
- forming a first insulating layer on a supporting board;
mounting at least one reinforcing member on the first insulating layer;
mounting at least one semiconductor chip on the first insulating layer;
forming a second insulating layer on the reinforcing member and the semiconductor chip; and
forming a wiring on the second insulating layer, the wiring being connected to the semiconductor chip.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of manufacturing a wiring board includes: forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least one semiconductor chip on the first insulating layer; forming a second insulating layer on the reinforcing member and the semiconductor chip; and forming a wiring on the second insulating layer, the wiring being connected to the semiconductor chip.
-
Citations
12 Claims
-
1. A method of manufacturing a wiring board, said method comprising:
-
forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least one semiconductor chip on the first insulating layer; forming a second insulating layer on the reinforcing member and the semiconductor chip; and forming a wiring on the second insulating layer, the wiring being connected to the semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
Specification