Package for MEMS devices

• US 7,370,530 B2
• Filed: 09/01/2004
• Issued: 05/13/2008
• Est. Priority Date: 09/01/2004
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: DCamp, Jon B., Curtis, Harlan L.
• Primary Examiner(s): Williams; Hezron
• Assistant Examiner(s): Bellamy; Tamiko
• Application Number:
  US10/931,653
• Publication Number:
  US 20060042382A1
• Time in Patent Office: 1,350 Days
• Field of Search: 734/93, 735/041.2, 735/10, 438/15, 438/106, 438/51, 438/110, 438/121, 438125-127, 257/E23.172, 257/E25.01, 257/628, 257/730
• US Class Current: 73/493
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: G01P 1/00 Details of instruments
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

A package for packaging one or more MEMS devices is disclosed. A package in accordance with an illustrative embodiment of the present invention can include a packaging structure having a base section, a top section, and an interior cavity adapted to contain a number of MEMS devices therein. In some embodiments, the packaging structure can include a first side, a second side, a third side, and a top end, which, in certain embodiments, may form a pinout plane surface that can be used to connect the packaging structure to other external components. In some embodiments, a number of MEMS-type inertial sensors contained within the interior cavity of the packaging structure can be used to detect and measure motion in multiple dimensions, if desired.

Claims

1. A package, comprising:

a packaging structure having a first sidewall, a second sidewall, and a third sidewall, joined to define an interior cavity, the packaging structure further having a planar top member coupled to a first end portion of the respective sidewalls and a bottom lid coupled to an opposite end portion of the respective sidewalls, the planar top member distally located from the bottom lid, the respective sidewalls, top member, and bottom lid cooperating to enclose the interior cavity;

a first MEMs device mounted within the interior cavity and on an inner wall surface on the first sidewall;

a second MEMs device mounted within the interior cavity and on an inner wall surface of the second sidewall; and

a thirds MEMs device mounted within the interior cavity and on an inner wall surface of the third sidewall.

2. The package of claim 1, wherein each of the first, second, and third sidewalls slope inwardly at an angle of inclination away from a base section of the packaging structure.

3. The package of claim 2, wherein the angle of inclination for each of the first, second, and third sidewalls is substantially equal.

4. The package of claim 1, wherein the lid comprises a material different than the remaining portion of the packaging structure.

5. The package of claim 1, wherein the interior cavity is a hermetically sealed cavity.

6. The package of claim 1 wherein the interior cavity is vacuum sealed.

7. The package of claim 1 wherein the interior cavity contains an inert gas.

8. The package of claim 1, wherein the packaging structure has the general shape of a regular tetrahedron with an apex portion thereof removed.

9. The package of claim 1, wherein the packaging structure has the general shape of a irregular tetrahedron with an apex portion thereof removed.

10. The package of claim 1, wherein the planar top member includes a pinout plane surface.

11. The package of claim 1, wherein the packaging structure further includes a number of electronic pinouts.

12. The package of claim 1, wherein the packaging structure further includes one or more bondout pads adapted to connect the package to one or more external components.

13. The package of claim 1, wherein each of the first, second, and third MEMS devices is coupled to or part of a corresponding die.

14. The package of claim 13, wherein each die is bonded to the corresponding inner wall surface using an adhesive.

15. The package of claim 13, wherein each die is bonded to the corresponding inner wall surface using a thermocompression bonding technique.

16. The package of claim 15, wherein said thermocompression bonding technique is a flip-chip thermocompression bonding technique.

17. The package of claim 13, wherein each die is bonded to the corresponding inner wall surface using a solder.

18. The package of claim 1, wherein each MEMS device is a gyroscope.

19. The package of claim 1, wherein each MEMS device is a accelerometer.

20. The package of claim 1, wherein said package is a three-axis LCC package.

21. The package of claim 1, wherein the packaging structure comprises a single molded piece.

22. The package of claim 1, wherein the packaging structure comprises a number of separate pieces assembled together.

23. A three-axis package, comprising:

a first sidewall, a second sidewall, and a third sidewall coupled together to define an interior cavity;

a planar top member coupled to a first end portion of the respective sidewalls;

a bottom lid coupled to an opposite end portion of the respective sidewalls, the planar top member distally located from the bottom lid, the respective sidewalls, top member, and bottom lid cooperating to enclose the interior cavity; and

a MEMs device mounted on at least one of the respective sidewalls.

24. The three-axis package of claim 23, wherein each of the first, second and third sidewalls slope inwardly at an angle of inclination that is less than 90 degrees relative to the base section of the packaging structure.

25. The three-axis package of claim 24, wherein the angle of inclination for each of the first, second, and third sidewalls is substantially equal.

26. The three-axis package of claim 23, wherein the top end of the packaging structure defines a pinout plane surface.

27. The three-axis package of claim 23, wherein the packaging structure further includes a number of electronic pinouts.

28. The three-axis package of claim 23, wherein the packaging structure further includes one or more bondout pads adapted to connect the package to one or more external components.

29. The three-axis package of claim 23, further comprising a plurality of die, each provided in the interior cavity and each coupled to a corresponding one of the first, second, and third sidewalls of the packaging, each die coupled to a sensor adapted to detect and measure motion of the package about a separate rate axis.

30. The three-axis package of claim 29, wherein each die is oriented substantially parallel with an inner wall surface of each the corresponding sidewall of the packaging.

31. The three-axis package of claim 30, wherein each die is bonded to the corresponding inner wall surface using an adhesive.

32. The three-axis package of claim 30, wherein each die is bonded to the corresponding inner wall using a thermocompression bonding technique.

33. The three-axis package of claim 32, wherein said thermocompression bonding technique is a flip-chip thermocompression bonding technique.

34. The three-axis package of claim 30, wherein each is bonded to the corresponding inner wall surface using a solder.

35. The three-axis package of claim 29, wherein said plurality of die includes:

a first die coupled to the first side of the packaging structure, said first die including a first sensor adapted to detect and measure motion about an X-rate axis;

a second die coupled to the second side of the packaging structure, said second die including a second sensor adapted to detect and measure motion about a Y-rate axis; and

a third die coupled to the third side of the packaging structure, said third die including a third sensor adapted to detect and measure motion about a Z-rate axis.

36. The three-axis package of claim 23, wherein said plurality of MEMS devices are gyroscopes.

37. The three-axis package of claim 23, wherein said plurality of MEMS devices are accelerometers.