Method of fabricating light emitting diode package

• US 7,371,603 B2
• Filed: 05/24/2006
• Issued: 05/13/2008
• Est. Priority Date: 05/26/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Kim, Yong Suk, Kim, Yong Sik, Choi, Seog Moon, Kim, Hyoung Ho
• Primary Examiner(s): THAI, LUAN C
• Application Number:
  US11/439,189
• Publication Number:
  US 20060270078A1
• Time in Patent Office: 720 Days
• Field of Search: 438/64, 438/115, 438/57, 438/69, 438/71, 438/125, 438/127, 438/974
• US Class Current: 438/64
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: Y10S 438/974 Substrate surface preparation

Abstract

The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.

Claims

1. A method of fabricating a light emitting diode (LED) package comprising steps of:

providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED;

plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed;

mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern; and

forming the resin-molded part in the mounting area of the LED to seal the LED package.

2. The method according to claim 1, wherein the package substrate comprises an upper substrate having a cavity with a sloped side wall, formed in an area corresponding to the mounting area of the LED, and a lower substrate having the mounting area of the LED and the metal pattern on an upper surface thereof.

3. The method according to claim 2, wherein the step of plasma-treating is performed on the entire upper and lower substrates, respectively.

4. The method according to claim 3, wherein the step of plasma-treating is performed at wafer level before the package substrate is cut into individual packages.

5. The method according to claim 1, wherein the package substrate is a silicon substrate.

6. The method according to claim 5, wherein the step of plasma-treating is performed in a vacuum-state with inert gas as a reactive gas at an output power of 700 W to 1500 W for 1 to 3 hours.

7. The method according to claim 6, wherein the step of plasma-treating is performed with a silicon substrate kept at a temperature ranging from 80°

C. to 120°

C.

8. The method according to claim 1, wherein the resin-molded part is made of epoxy resin, silicone resin, urethane resin or a compound thereof.

9. A method of fabricating a light emitting diode (LED) package comprising steps of:

providing a silicon package substrate having a mounting area of an LED and a metal pattern to be connected with the LED;

heat-treating the package substrate in an atmosphere of inert gas at a temperature ranging from about 300°

C. to 400°

C. for 1 to 3 hours in order to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed;

mounting the LED on the mounting area of the LED and electrically connecting the LED with the metal pattern; and

forming the resin-molded part in the mounting area of the LED to seal the LED package.