Ball grid array package and process for manufacturing same

• US 7,372,151 B1
• Filed: 09/12/2003
• Issued: 05/13/2008
• Est. Priority Date: 09/12/2003
• Status: Active Grant

• Current Assignee: Utac Headquarters Pte. Ltd (UTAC Holdings Ltd.)
• Original Assignee: ASAT Company Limited
• Inventors: Tsang, Kwok Cheung, McLellan, Neil, Fan, Chun Ho
• Primary Examiner(s): Kebede; Brook
• Application Number:
  US10/660,611
• Time in Patent Office: 1,705 Days
• Field of Search: 257/678, 257/693, 257/700, 257/707, 257/711, 257/713, 257734-738, 257/787, 257/788, 257777-786, 257/E23.069, 257/E21.503, 257/E21.511, 438123-127, 438612-614, 438/617
• US Class Current: 257/738
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

A process for manufacturing an integrated circuit package includes forming a plurality of solder balls on a first surface of a substrate and mounting a semiconductor die to the substrate such that bumps of the semiconductor die are electrically connected to conductive traces of the substrate. The semiconductor die and the solder balls are encapsulated in an overmold material on the substrate such that portions of the solder balls are exposed. A ball grid array is formed such that bumps of the ball grid array are electrically connected to the conductive traces and the integrated circuit package is singulated.

Claims

1. An integrated circuit package comprising:

a substrate having a plurality of conductive traces;

a plurality of balls disposed on a first surface of said substrate, such that said plurality of balls are electrically connected to said plurality of conductive traces;

a semiconductor die mounted to said substrate, such that said semiconductor die is electrically connected to said plurality of conductive traces of said substrate;

an overmold material encapsulating said semiconductor die and said balls on said substrate such that portions of said balls that are disposed farthest from said substrate are exposed at an exterior of said integrated circuit package;

a ball grid array disposed on a second surface of said substrate and in electrical connection with said conductive traces; and

a die adapter mounted on said semiconductor die and encapsulated in said overmold material.

2. The integrated circuit package according to claim 1, wherein said plurality of balls is attached to respective solder ball pads on said first surface of said substrate.

3. The integrated circuit package according to claim 1, wherein said bumps of said semiconductor die are electrically connected to said conductive traces by wire bonds.

4. The integrated circuit package according to claim 1, wherein said semiconductor die is fixed to said first surface of said substrate.

5. The integrated circuit package according to claim 1, wherein said plurality of balls circumscribe said semiconductor die.

6. The integrated circuit package according to claim 1, wherein said balls are deformed.

7. The integrated circuit package according to claim 1, wherein said plurality of balls is comprised of a plurality of solder balls.

8. The integrated circuit package according to claim 1, wherein the semiconductor die is mounted to said substrate via a plurality of solder ball connections.