Top layers of metal for high performance IC's

• US 7,372,155 B2
• Filed: 05/18/2005
• Issued: 05/13/2008
• Est. Priority Date: 12/21/1998
• Status: Expired due to Fees

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Mou-Shiung Lin
• Inventors: Lin, Mou-Shiung
• Primary Examiner(s): Soward; Ida M.
• Application Number:
  US11/131,481
• Publication Number:
  US 20050208757A1
• Time in Patent Office: 1,091 Days
• Field of Search: 257202-208, 257/211, 257758-760
• US Class Current: 257/758
• CPC Class Codes: H01L 21/768 Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
• CPC Class Codes: H01L 21/76804 by forming tapered via holes
• CPC Class Codes: H01L 21/76807 for dual damascene structures
• CPC Class Codes: H01L 21/76838 characterised by the formation and the after-treatment of the conductors etching for patterning the conductors H01L21/3213
• CPC Class Codes: H01L 2224/02 Bonding areas; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/0231 Manufacturing methods of the redistribution layers
• CPC Class Codes: H01L 2224/02311 Additive methods
• CPC Class Codes: H01L 2224/02313 Subtractive methods
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05184 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05671 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05684 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/1148 Permanent masks, i.e. masks left in the finished device, e.g. passivation layers
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/522 including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• CPC Class Codes: H01L 23/5222 : Capacitive arrangements or effects of, or between wiring layers other capacitive arrangements H01L23/642
• CPC Class Codes: H01L 23/5223 : Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5225 : Shielding layers formed together with wiring layers
• CPC Class Codes: H01L 23/5227 : Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/5228 : Resistive arrangements or effects of, or between, wiring layers other resistive arrangements H01L23/647
• CPC Class Codes: H01L 23/525 : with adaptable interconnections
• CPC Class Codes: H01L 23/5283 : Cross-sectional geometry
• CPC Class Codes: H01L 23/5286 : Arrangements of power or ground buses
• CPC Class Codes: H01L 23/5329 : Insulating materials
• CPC Class Codes: H01L 23/53295 : Stacked insulating layers
• CPC Class Codes: H01L 23/60 : Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 24/02 : Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 27/0676 : comprising combinations of diodes, or capacitors or resistors
• CPC Class Codes: H01L 27/08 : including only semiconductor components of a single kind
• CPC Class Codes: H01L 28/10 : Inductors
• CPC Class Codes: H01L 28/20 : Resistors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15184 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: Y10T 428/12542 : More than one such component
• CPC Class Codes: Y10T 428/12993 : Surface feature [e.g., rough, mirror]

Abstract

A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length-by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Claims

1. A semiconductor chip comprising:

a silicon substrate;

multiple semiconductor devices in or over said silicon substrate;

a first dielectric layer over said silicon substrate;

an interconnecting metallization structure over said first dielectric layer, wherein said interconnecting metallization structure is connected to said multiple semiconductor devices, and wherein said interconnecting metallization structure comprises multiple lower metal layers;

a second dielectric layer between neighboring two of said multiple lower metal layers;

a passivation layer over said first and second dielectric layers and over said interconnecting metallization structure, a first opening in said passivation layer exposing a first contact point of said interconnecting metallization structure, and a second opening in said passivation layer exposing a second contact point of said interconnecting metallization structure, wherein said first contact point is separate from said second contact point;

an upper metallization structure over said passivation layer and over said first and second contact points, wherein a connecting portion of said upper metallization structure connects multiple portions of said interconnecting metallization structure through said first and second openings and through said first and second contact points, and wherein said upper metallization structure comprises multiple upper metal layers, wherein one of said multiple upper metal layers is thicker than each of said multiple lower metal layers; and

a first polymer layer between neighboring two of said multiple upper metal layers, wherein said first polymer layer is thicker than each of said first and second dielectric layers.

2. The semiconductor chip of claim 1, wherein said interconnecting metallization structure comprises a sub-micron metal line.

3. The semiconductor chip of claim 1, wherein said semiconductor devices or said interconnecting metallization structure comprises a sub-micron integrated circuit.

4. The semiconductor chip of claim 1, wherein said passivation layer comprises nitride.

5. The semiconductor chip of claim 1, wherein said passivation layer comprises silicon nitride.

6. The semiconductor chip of claim 1, wherein said passivation layer comprises oxide.

7. The semiconductor chip of claim 1, wherein said passivation layer comprises an oxide layer having a thickness within a range between 0.15 and 2.0 μ

m.

8. The semiconductor chip of claim 1, wherein said passivation layer comprises a nitride layer having a thickness within a range between 0.5 and 2.0 μ

m.

9. The semiconductor chip of claim 1, wherein said passivation layer comprises multiple insulation layers, and the topmost one of said multiple insulation layers said passivation layer comprises an inorganic layer.

10. The semiconductor chip of claim 1, wherein said passivation layer comprises multiple insulation layers, and the topmost one of said multiple insulation layers of said passivation layer comprises a nitride layer.

11. The semiconductor chip of claim 1, wherein said passivation layer comprises multiple insulation layers, and the bottommost one of said multiple insulation layers of said passivation layer comprises an oxide layer.

12. The semiconductor chip of claim 1, wherein said passivation layer comprises a topmost inorganic layer of said semiconductor chip.

13. The semiconductor chip of claim 1, wherein said passivation layer comprises a topmost nitride layer of said semiconductor chip.

14. The semiconductor chip of claim 1, wherein said passivation layer comprises a topmost oxide layer of said semiconductor chip.

15. The semiconductor chip of claim 1, wherein said passivation layer comprises a topmost CVD insulation layer of said semiconductor chip.

16. The semiconductor chip of claim 1, wherein said upper metallization structure comprises an electroplated metal.

17. The semiconductor chip of claim 1, wherein said upper metallization structure comprises an electroless metal.

18. The semiconductor chip of claim 1, wherein said upper metallization structure comprises a sputtered metal.

19. The semiconductor chip of claim 1, wherein said upper metallization structure comprises a CVD metal.

20. The semiconductor chip of claim 1, wherein said upper metallization structure comprises a damascene metal.

21. The semiconductor chip of claim 1, wherein said upper metallization structure comprises copper.

22. The semiconductor chip of claim 1, wherein said upper metallization structure comprises nickel.

23. The semiconductor chip of claim 1, wherein said upper metallization structure comprises aluminum.

24. The semiconductor chip of claim 1, wherein said upper metallization structure comprises chromium.

25. The semiconductor chip of claim 1 further comprising a second polymer layer over said multiple upper metal layers.

26. The semiconductor chip of claim 1 further comprising a second polymer layer over the topmost one of said multiple upper metal layers.

27. The semiconductor chip of claim 1 further comprising a second polymer layer under the bottommost one of said multiple upper metal layers.

28. The semiconductor chip of claim 1, wherein said first contact point has a size between about 0.3 μ

m and 5 μ

m.

29. The semiconductor chip of claim 1, wherein said first opening has a diameter between about 0.5 μ

m and 3 μ

m.

30. The semiconductor chip of claim 1, wherein said first contact point comprises copper.

31. The semiconductor chip of claim 1, wherein said first contact point comprises aluminum.

32. The semiconductor chip of claim 1, wherein said first contact point comprises tungsten.

33. The semiconductor chip of claim 1, wherein said first contact point comprises an electroplated metal.

34. The semiconductor chip of claim 1, wherein said interconnecting metallization structure comprises copper, aluminum, or tungsten.

35. The semiconductor chip of claim 1, wherein said multiple semiconductor devices comprise multiple transistors.

36. The semiconductor chip of claim 1, wherein said multiple semiconductor devices comprise polysilicon.

37. The semiconductor chip of claim 1, wherein said connecting portion connects said multiple semiconductor devices through said interconnecting metallization structure.

38. The semiconductor chip of claim 1, wherein said connecting portion of said upper metallization structure comprises a signal distribution interconnect.

39. The semiconductor chip of claim 1, wherein said connecting portion of said upper metallization structure comprises a power distribution interconnect.

40. The semiconductor chip of claim 1, wherein said connecting portion of said upper metallization structure comprises a ground distribution interconnect.

41. The semiconductor chip of claim 1, wherein said connecting portion of said upper metallization structure comprises a clock distribution network.

42. The semiconductor chip of claim 1, wherein said connecting portion of said upper metallization structure comprises a signal line or a signal plane.

43. The semiconductor chip of claim 1, wherein said connecting portion of said upper metallization structure comprises a power line or a power plane.

44. The semiconductor chip of claim 1, wherein said connecting portion of said upper metallization structure comprises a ground line or a ground plane.

45. The semiconductor chip of claim 1, wherein said passivation layer comprises an oxide layer and a nitride layer.

46. The semiconductor chip of claim 45, wherein said nitride layer is over said oxide layer.

47. The semiconductor chip of claim 1, wherein said passivation layer comprises multiple inorganic layers.

48. The semiconductor chip of claim 47, wherein one of said multiple inorganic layers has a thickness between 0.15 μ

m and 2 μ

m.

49. The semiconductor chip of claim 1 further comprising a second polymer layer over said passivation layer and under said multiple upper metal layers.

50. The semiconductor chip of claim 49, wherein said second polymer layer is thicker than said passivation layer.

51. The semiconductor chip of claim 49, wherein said second polymer layer comprises a photosensitive polymer.

52. The semiconductor chip of claim 49, wherein said second polymer layer comprises a non-photosensitive polymer.

53. The semiconductor chip of claim 49, wherein said second polymer layer comprises polyimide.

54. The semiconductor chip of claim 49, wherein said second polymer layer comprises benzocyclobutene (BCB).

55. The semiconductor chip of claim 49, wherein said second polymer layer has a thickness of between about 2 μ

m and 30 μ

m.

56. A semiconductor wafer comprising:

a silicon substrate;

multiple semiconductor devices in or over said silicon substrate;

a first dielectric layer over said silicon substrate;

an interconnecting metallization structure over said first dielectric layer, wherein said interconnecting metallization structure is connected to said multiple semiconductor devices, and wherein said interconnecting metallization structure comprises multiple lower metal layers;

a second dielectric layer between neighboring two of said multiple lower metal layers;

a passivation layer over said first and second dielectric layers and over said interconnecting metallization structure, a first opening in said passivation layer exposing a first contact point of said interconnecting metallization structure, and a second opening in said passivation layer exposing a second contact point of said interconnecting metallization structure, wherein said first contact point is separate from said second contact point;

an upper metallization structure over said passivation layer and over said first and second contact points, wherein a connecting portion of said upper metallization structure within a chip connects multiple portions of said interconnecting metallization structure through said first and second openings and through said first and second contact points, and wherein said upper metallization structure comprises multiple upper metal layers, wherein one of said multiple upper metal layers is thicker than each of said multiple lower metal layers; and

a first polymer layer between neighboring two of said multiple upper metal layers, wherein said first polymer layer is thicker than each of said first and second dielectric layers.

57. The semiconductor wafer of claim 56, wherein said interconnecting metallization structure comprises a sub-micron metal line.

58. The semiconductor wafer of claim 56, wherein said semiconductor devices or said interconnecting metallization structure comprises a sub-micron integrated circuit.

59. The semiconductor wafer of claim 56, wherein said passivation layer comprises nitride.

60. The semiconductor wafer of claim 56, wherein said passivation layer comprises silicon nitride.

61. The semiconductor wafer of claim 56, wherein said passivation layer comprises oxide.

62. The semiconductor wafer of claim 56, wherein said passivation layer comprises an oxide layer having a thickness within a range between 0.15 and 2.0 μ

m.

63. The semiconductor wafer of claim 56, wherein said passivation layer comprises a nitride layer having a thickness within a range between 0.5 and 2.0 μ

m.

64. The semiconductor wafer of claim 56, wherein said passivation layer comprises multiple insulation layers, and the topmost one of said multiple insulation layers said passivation layer comprises an inorganic layer.

65. The semiconductor wafer of claim 56, wherein said passivation layer comprises multiple insulation layers, and the topmost one of said multiple insulation layers of said passivation layer comprises a nitride layer.

66. The semiconductor wafer of claim 56, wherein said passivation layer comprises multiple insulation layers, and the bottommost one of said multiple insulation layers of said passivation layer comprises an oxide layer.

67. The semiconductor wafer of claim 56, wherein said passivation layer comprises a topmost inorganic layer of said semiconductor wafer.

68. The semiconductor wafer of claim 56, wherein said passivation layer comprises a topmost nitride layer of said semiconductor wafer.

69. The semiconductor wafer of claim 56, wherein said passivation layer comprises a topmost oxide layer of said semiconductor wafer.

70. The semiconductor wafer of claim 56, wherein said passivation layer comprises a topmost CVD insulation layer of said semiconductor wafer.

71. The semiconductor wafer of claim 56, wherein said upper metallization structure comprises an electroplated metal.

72. The semiconductor wafer of claim 56, wherein said upper metallization structure comprises an electroless metal.

73. The semiconductor wafer of claim 56, wherein said upper metallization structure comprises a sputtered metal.

74. The semiconductor wafer of claim 56, wherein said upper metallization structure comprises a CVD metal.

75. The semiconductor wafer of claim 56, wherein said upper metallization structure comprises a damascene metal.

76. The semiconductor wafer of claim 56, wherein said upper metallization structure comprises copper.

77. The semiconductor wafer of claim 56, wherein said upper metallization structure comprises nickel.

78. The semiconductor wafer of claim 56, wherein said upper metallization structure comprises aluminum.

79. The semiconductor wafer of claim 56, wherein said upper metallization structure comprises chromium.

80. The semiconductor wafer of claim 56 further comprising a second polymer layer over said multiple upper metal layers.

81. The semiconductor wafer of claim 56 further comprising a second polymer layer over the topmost one of said multiple upper metal layers.

82. The semiconductor wafer of claim 56, further comprising a second polymer layer under the bottommost one of said multiple upper metal layers.

83. The semiconductor wafer of claim 56, wherein said first contact point has a size between about 0.3 μ

m and 5 μ

m.

84. The semiconductor wafer of claim 56, wherein said first opening has a diameter between about 0.5 μ

m and 3 μ

m.

85. The semiconductor wafer of claim 56, wherein said first contact point comprises copper.

86. The semiconductor wafer of claim 56, wherein said first contact point comprises aluminum.

87. The semiconductor wafer of claim 56, wherein said first contact point comprises tungsten.

88. The semiconductor wafer of claim 56, wherein said first contact point comprises an electroplated metal.

89. The semiconductor wafer of claim 56, wherein said interconnecting metallization structure comprises copper, aluminum, or tungsten.

90. The semiconductor wafer of claim 56, wherein said multiple semiconductor devices comprise multiple transistors.

91. The semiconductor wafer of claim 56, wherein said multiple semiconductor devices comprise polysilicon.

92. The semiconductor wafer of claim 56, wherein said connecting portion connects said multiple semiconductor devices through said interconnecting metallization structure.

93. The semiconductor wafer of claim 56, wherein said connecting portion of said upper metallization structure comprises a signal distribution interconnect.

94. The semiconductor wafer of claim 56, wherein said connecting portion of said upper metallization structure comprises a power distribution interconnect.

95. The semiconductor wafer of claim 56, wherein said connecting portion of said upper metallization structure comprises a ground distribution interconnect.

96. The semiconductor wafer of claim 56, wherein said connecting portion of said upper metallization structure comprises a clock distribution network.

97. The semiconductor wafer of claim 56, wherein said connecting portion of said upper metallization structure comprises a signal line or a signal plane.

98. The semiconductor wafer of claim 56, wherein said connecting portion of said upper metallization structure comprises a power line or a power plane.

99. The semiconductor wafer of claim 56, wherein said connecting portion of said upper metallization structure comprises a ground line or a ground plane.

100. The semiconductor wafer of claim 56, wherein said passivation layer comprises an oxide layer and a nitride layer.

101. The semiconductor wafer of claim 100, wherein said nitride layer is over said oxide layer.

102. The semiconductor wafer of claim 56, wherein said passivation layer comprises multiple inorganic layers.

103. The semiconductor wafer of claim 102, wherein one of said multiple inorganic layers has a thickness between 0.15 μ

m and 2 μ

m.

104. The semiconductor wafer of claim 56 further comprising a second polymer layer over said passivation layer and under said multiple upper metal layers.

105. The semiconductor wafer of claim 104, wherein said second polymer layer is thicker than said passivation layer.

106. The semiconductor wafer of claim 104, wherein said second polymer layer comprises a photosensitive polymer.

107. The semiconductor wafer of claim 104, wherein said second polymer layer comprises a non-photosensitive polymer.

108. The semiconductor wafer of claim 104, wherein said second polymer layer comprises polyimide.

109. The semiconductor wafer of claim 104, wherein said second polymer layer comprises benzocyclobutene (BCB).

110. The semiconductor wafer of claim 104, wherein said second polymer layer has a thickness of between about 2 μ

m and 30 μ

m.