Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas

• US 7,372,408 B2
• Filed: 01/13/2006
• Issued: 05/13/2008
• Est. Priority Date: 01/13/2006
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Grzyb, Janusz, Pfeiffer, Ullrich R., Gaucher, Brian P., Liu, Duixian
• Primary Examiner(s): Ho; Tan
• Application Number:
  US11/332,737
• Publication Number:
  US 20070164907A1
• Time in Patent Office: 851 Days
• Field of Search: 343/700.MS, 343/841, 455/90.3
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

Apparatus and methods are provided for packaging IC chips together with integrated antenna modules designed to provide a closed EM (electromagnetic) environment for antenna radiators, thereby allowing antennas to be designed independent from the packaging technology.

Claims

1. An electronic package apparatus, comprising:

a package frame;

an IC (integrated circuit) chip mounted to the package frame;

an antenna socket device mounted to the package frame;

a substrate having an antenna formed on a first surface of the substrate, wherein the substrate is mounted to the antenna socket device; and

a package mold,

wherein the substrate mounted to the antenna socket device provides a closed EM (electromagnetic) environment for the antenna such that antenna performance is not affected by package materials or components.

2. The apparatus of claim 1, wherein the antenna socket device is a frame structure comprising an outer wall that surrounds and defines an inner region of the antenna socket, wherein the first surface of the substrate is mounted to a first side of the antenna socket device such that the antenna is aligned to and faces the inner region of the antenna socket.

3. The apparatus of claim 2, wherein a second side of the antenna socket device is mounted to a metallic ground plane of the package frame, wherein the inner region of the antenna socket is enclosed by the substrate and ground plane to form a closed cavity region.

4. The apparatus of claim 3, wherein the antenna socket device is formed of a non-metallic material.

5. The apparatus of claim 3, wherein the antenna socket device is formed of a metallic material.

6. The apparatus of claim 5, wherein an aperture is formed in the outer wall of the antenna socket device to allow passage of an antenna feed line formed on the first surface of the substrate.

7. The apparatus of claim 1, wherein the antenna socket device is a hollow metallic structure comprising an outer wall and planar surface that define an inner cavity region of the antenna socket, wherein the first surface of the substrate is mounted to a first side of the antenna socket device such that the antenna is aligned to and faces the inner cavity region of the antenna socket.

8. The apparatus of claim 7, wherein the inner cavity region is filled with a dielectric material.

9. The apparatus of claim 7, wherein the inner cavity region is filled with air.

10. The apparatus of claim 1, wherein the antenna socket device is a dielectric substrate, wherein the first surface of the substrate is mounted to a first side of the antenna socket device such that the antenna is disposed between the substrate and the antenna socket device.

11. The apparatus of claim 10, wherein the dielectric substrate of the antenna socket device is coated with a layer of metallic material on all sides thereof except the first side.

12. The apparatus of claim 1, further comprising an antenna feed network formed on the first surface of the substrate, wherein the substrate mounted to the antenna socket device provides a closed EM (electromagnetic) environment for at least a portion of the antenna feed network.

13. The apparatus of claim 1, wherein the package mold includes an open window region that is formed over at least a portion of the substrate.

14. A modular antenna device for constructing electronic chip packages, comprising:

an antenna socket device; and

an integrated antenna device comprising a substrate and an antenna formed on a surface of the substrate;

wherein the substrate can be mounted to the antenna socket device to form an integrated antenna module that shields the antenna and provides a closed EM (electromagnetic) environment for the antenna,

wherein the antenna socket device is a frame structure comprising an outer wall that surrounds and defines an inner region of the antenna socket, wherein the first surface of the substrate is mounted to a first side of the antenna socket device such that the antenna is aligned to and faces the inner region of the antenna socket, and

wherein the antenna socket device is formed of a non-metallic material.

15. A modular antenna device for constructing electronic chip packages, comprising:

an antenna socket device; and

an integrated antenna device comprising a substrate and an antenna formed on a surface of the substrate;

wherein the substrate can be mounted to the antenna socket device to form an integrated antenna module that shields the antenna and provides a closed EM (electromagnetic) environment for the antenna,

wherein the antenna socket device is a frame structure comprising an outer wall that surrounds and defines an inner region of the antenna socket, wherein the first surface of the substrate is mounted to a first side of the antenna socket device such that the antenna is aligned to and faces the inner region of the antenna socket,

wherein the antenna socket device is formed of a metallic material, and

wherein an aperture is formed in the outer wall of the antenna socket device to allow passage of an antenna feed line formed on the first surface of the substrate.

16. A modular antenna device for constructing electronic chip packages, comprising:

an antenna socket device; and

an integrated antenna device comprising a substrate and an antenna formed on a surface of the substrate;

Wherein the substrate can be mounted to the antenna socket device to form an integrated antenna module that shields the antenna and provides a closed EM (electromagnetic) environment for the antenna,

wherein the antenna socket device is a hollow metallic structure comprising an outer wall and planar surface that define an inner cavity region of the antenna socket, wherein the first surface of the substrate is mounted to a first side of the antenna socket device such that the antenna is aligned to and faces the inner cavity region of the antenna socket, and

wherein the inner cavity region is filled with a dielectric material.

17. A modular antenna device for constructing electronic chip packages, comprising:

antenna socket device; and

an integrated antenna device comprising a substrate and an antenna formed on a surface of the substrate;

wherein the substrate can be mounted to the antenna socket device to form an integrated antenna module that shields the antenna and provides a closed EM (electromagnetic) environment for the antenna, and

wherein the antenna socket device is a dielectric substrate, wherein the first surface of the substrate is mounted to a first side of the antenna socket device such that the antenna is disposed between the substrate and the antenna socket device.