×

Complex microdevices and apparatus and methods for fabricating such devices

  • US 7,372,616 B2
  • Filed: 05/27/2005
  • Issued: 05/13/2008
  • Est. Priority Date: 12/06/2001
  • Status: Expired due to Term
First Claim
Patent Images

1. A process for forming a multilayer microdevice, comprising:

  • (a) forming a layer comprising at least two materials on a substrate that may include one or more previously deposited layers, each comprising at least two materials, wherein one of the at least two materials is a structural material and another of the at least two materials is a sacrificial material;

    (b) repeating the forming operation of “

    (a)”

    one or more times to form at least one subsequent layer, comprising at least two materials on at least one previously formed layer to build up a three-dimensional structure from a plurality layers;

    wherein the forming of at least a plurity of layers, comprises;

    (1) supplying a substrate;

    (2) supplying a mask on a surface of the substrate having a desired pattern of openings through which a first material of the at least two materials can be effectively deposited or etched to yield a desired pattern of the first material;

    (3) depositing the first material within the openings or etching the first material from the openings;

    (4) removing the mask;

    (5) depositing a second material of the at least two materials to fill the void in the deposited material; and

    (6) planarizing the deposited first and second materials to provide a planarized layer; and

    (c) after formation of the plurality of layers removing the sacrificial material from the deposited structural material, to reveal the three-dimensional structure,wherein the microdevice includes a 3D tilt mirror.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×