Cooling device and electronic apparatus

• US 7,372,697 B2
• Filed: 06/23/2006
• Issued: 05/13/2008
• Est. Priority Date: 06/30/2005
• Status: Active Grant

• Current Assignee: Toshiba Client Solutions CO., Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tomioka, Kentaro
• Primary Examiner(s): Gandhi; Jayprakash
• Assistant Examiner(s): HOFFBERG, ROBERT JOSEPH
• Application Number:
  US11/473,777
• Publication Number:
  US 20070002537A1
• Time in Patent Office: 690 Days
• Field of Search: 361/697, 361699-704, 165/80.4, 165/185, 165/104.33, 174/252, 257/E23.098
• US Class Current: 361/699
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates; a heat-receiving section thermally connected to a heating element; and a heat-sinking section for dissipating heat received by the heat-receiving section. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section is formed on one of the first and second plate members.

Claims

1. A cooling device comprising:

a heat transfer unit including a passage, through which a coolant circulates in a first direction, a heat-receiving section thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section,

wherein the heat transfer unit comprises a first plate member, in which a groove corresponding to the passage is formed, a plurality of protrusions formed over a sidewall of the groove and each of the plurality of protrusions inclined so as to form an obtuse angle between the sidewall and a surface of the protrusions in contact with the coolant flowing the first direction, and a second plate member, which covers the groove, and

the heat-receiving section is formed on one of the first and second plate members.

2. The cooling device according to claim 1, further comprising a pump having an inlet port and a discharge port,

wherein the passage has a first end communicating with the inlet port and a second end communicating with the discharge port.

3. The cooling device according to claim 1, wherein a second groove corresponding to the passage is formed in the second plate member.

4. The cooling device according to claim 1, wherein the groove comprises a plurality of grooves extending in parallel with each other.

5. The cooling device according to claim 1, wherein the groove extends across the heat-receiving section, the groove comprises a plurality of grooves extending in parallel with one another from the heat-receiving section to the heat-sinking section.

6. The cooling device according to claim 1, wherein a through hole is formed in a vicinity of the heat-sinking section of the first and second plate members for separating the passage into a segment upstream of the heat-sinking section and another segment downstream of the heat-sinking section.

7. The cooling device according to claim 1, wherein a vertical wall extending along the groove is provided in an area of the groove, the area located within a region corresponding to the heat-receiving section.

8. The cooling device according to claim 1, wherein a third plate member is connected to at least one of the first and the second plate members at a portion avoiding the heating element, and

the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and one of the first and second plate members, the partition wall sections connecting to one of the first and second plate members.

9. An electronic apparatus comprising:

a casing;

a heating element housed in the casing; and

a cooling device that cools the heating element, the cooling device comprising;

a heat transfer unit including a passage, through which a coolant circulates in a first direction, a heat-receiving section thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section,

wherein the heat transfer unit comprises;

a first plate member, in which a groove corresponding to the passage is formed, a plurality are formed over a sidewall of the groove and each of the plurality of protrusions is inclined so as to form an obtuse angle between the sidewall and a surface of the protrusion in contact with the coolant flowing in the first direction,

a second plate member, which covers the groove, and

the heat-receiving section is formed on one of the first and second plate members.

10. The electronic apparatus according to claim 9, further comprising a pump having an inlet port and a discharge port,

wherein the passage has a first end communicating with the inlet port and a second end communicating with the discharge port.

11. The electronic apparatus according to claim 9, wherein a second groove corresponding to the passage is formed in the second plate member.

12. The electronic apparatus according to claim 9, wherein the groove comprises a plurality of grooves extending in parallel with each other.

13. The electronic apparatus according to claim 9, wherein the groove extends across the heat-receiving section, the groove comprises a plurality of grooves extending in parallel with one another from the heat-receiving section to the heat-sinking section.

14. The electronic apparatus according to claim 9, wherein a through hole is formed in a vicinity of the heat-sinking section of the first and second plate members for separating the passage into a segment upstream of the heat-sinking section and another segment downstream of the heat-sinking section.

15. The electronic apparatus according to claim 9, wherein a vertical wall extending along the groove is provided in an area of the groove, the area located within a region corresponding to the heat-receiving section.

16. The electronic apparatus according to claim 9, wherein a third plate member is connected to at least one of the first and the second plate members at a portion avoiding the heating elements, and

the third plate member includes partition wall sections that extend toward one of the first and second plate members, and a hermetic space is defined between the partition wall sections and one of the first and second plate members, the partition wall sections connecting to one of the first and second plate members.