Front end module

• US 7,373,171 B2
• Filed: 02/10/2004
• Issued: 05/13/2008
• Est. Priority Date: 02/14/2003
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: TDK Corporation
• Inventors: Nakai, Shinya
• Primary Examiner(s): TRAN, TUAN A
• Application Number:
  US10/774,607
• Publication Number:
  US 20040224643A1
• Time in Patent Office: 1,554 Days
• Field of Search: 455 78- 83, 455/73, 455/550.1, 455/552.1, 455/553.1, 455/575.1, 455/7, 455 901- 3, 333100-104, 333/134, 333/175, 370/275, 370/278, 370290-291, 370/286, 370/297, 370/246, 370/172, 370/185, 257/728, 257/760, 257/664, 257/347, 343/700.MS, 343/700.R, 343701-702
• US Class Current: 455/552.1
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/16251 Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H04B 1/0057 using diplexing or multiplexing filters for selecting the desired band
• CPC Class Codes: H04B 1/406 with more than one transmission mode, e.g. analog and digital modes
• CPC Class Codes: H04B 1/44 Transmit/receive switching
• CPC Class Codes: H04B 1/52 Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa

Abstract

A front end module comprises a diplexer, a first duplexer, and a second duplexer. The first duplexer is connected to the diplexer through a first high frequency switch and separates transmission signals and reception signals of the N-CDMA from each other. The second duplexer is connected to the diplexer through a second high frequency switch and separates transmission signals and reception signals of the W-CDMA from each other. Each of the duplexers includes acoustic wave elements. A single multi-layer substrate for integration is used to integrate the components of the front end module. The diplexer is made up of a conductor layer located inside or on the surface of the multi-layer substrate.

Claims

1. A front end module for processing transmission signals and reception signals in each of a first frequency band and a second frequency band, the front end module comprising:

first separating means for separating the first and second frequency bands from each other, where the first separating means is connected to an antenna;

second separating means for separating the transmission signals and the reception signals in the first frequency band from each other, where the second separating means is connected to the first separating means and includes a first pair of two acoustic wave elements each of which functions as a filter;

third separating means for separating the transmission signals and the reception signals in the second frequency band from each other, where the third separating means is connected to the first separating means and includes a second pair of two acoustic wave elements each of which functions as a filter, wherein each of the acoustic wave elements in the first and second pairs of two acoustic wave elements is one of a surface acoustic wave element and a bulk acoustic wave element; and

a single multi-layer substrate that integrates the first to third separating means wherein;

the first separating means is made up of a conductor layer located inside or on a surface of the multi-layer substrate wherein;

the first separating means includes a filter;

one of the second and third separating means includes a delay line for impedance adjustment that is provided between one of the two acoustic wave elements included in the one of the second and third separating means and the first separating means;

the first pair of two acoustic wave elements and the second pair of two acoustic wave elements are mounted on a top surface of the multi-layer substrate; and

the multi-layer substrate includes, as conductor layers located inside the multi-layer substrate, a ground layer, a conductor layer that forms the delay line and that is disposed between the ground layer and the top surface of the multi-layer substrate; and

a conductor layer that forms the filter included in the first separating means and that is disposed between the ground layer and a bottom surface of the multi-layer substrate,

the front end module further comprising a terminal disposed on the bottom surface of the multi-layer substrate and connected to the conductor layer that forms the filter included in the first separating means.

2. The front end module according to claim 1, further comprising a matching circuit provided between the delay line and the first separating means, wherein the multi-layer substrate further includes, as another conductor layer located inside the multi-layer substrate, a conductor layer that forms the matching circuit and that is disposed between the ground layer and the top surface of the multi-layer substrate.