Sensor infrastructure

• US 7,373,260 B2
• Filed: 03/03/2005
• Issued: 05/13/2008
• Est. Priority Date: 03/03/2004
• Status: Active Grant

• Current Assignee: Metis Design Corporation
• Original Assignee: Metis Design Corporation
• Inventors: Kessler, Seth S., Jugenheimer, Kristin A., Size, Aaron B.
• Primary Examiner(s): NGHIEM, MICHAEL P
• Application Number:
  US11/071,129
• Publication Number:
  US 20060080048A1
• Time in Patent Office: 1,167 Days
• Field of Search: 702 33- 36, 702 38- 43, 702/47, 702/49, 702/54, 702/56, 702/130, 702/138, 702/150
• US Class Current: 702/35
• CPC Class Codes: G01B 5/30 for measuring the deformation in a solid, e.g. mechanical strain gauge
• CPC Class Codes: G01L 1/16 using properties of piezoelectric devices
• CPC Class Codes: G01M 5/0033 by determining damage, crack or wear
• CPC Class Codes: G01M 5/0075 by means of external apparatus, e.g. test benches or portable test systems G01M5/005 takes precedence
• CPC Class Codes: G01N 2291/0258 Structural degradation, e.g. fatigue of composites, ageing of oils
• CPC Class Codes: G01N 2291/02827 Elastic parameters, strength or force
• CPC Class Codes: G01N 2291/02845 Humidity, wetness
• CPC Class Codes: G01N 2291/0422 Shear waves, transverse waves, horizontally polarised waves
• CPC Class Codes: G01N 2291/0427 Flexural waves, plate waves, e.g. Lamb waves, tuning fork, cantilever
• CPC Class Codes: G01N 2291/106 one or more transducer arrays
• CPC Class Codes: G01N 2291/2694 Wings or other aircraft parts
• CPC Class Codes: G01N 29/045 by imparting shocks to the workpiece and detecting the vibrations or the acoustic waves caused by the shocks measuring resonant frequency G01H13/00; measuring strength properties by application of mechanical stress G01N3/00
• CPC Class Codes: G01N 29/12 by measuring frequency or resonance of acoustic waves measuring frequency or resonant frequency of mechanical vibrations or acoustic waves in general G01H1/06, G01H3/04, G01H13/00; acoustic resonators G10K11/04; vibration or shock testing of structures G01M7/00
• CPC Class Codes: G01N 29/2475 Embedded probes, i.e. probes incorporated in objects to be inspected
• CPC Class Codes: G01N 29/2481 Wireless probes, e.g. with transponders or radio links

Abstract

A device for use in detecting an event in a structure includes a sensor encapsulation, the encapsulation containing a sensor, an actuator positioned substantially in-plane to the sensor within the housing and a printed circuit board in communication with at least one of the sensor and the actuator. The printed circuit board includes a microprocessor constructed and arranged to collect data from at least one of the sensor and the actuator, a signal generator constructed and arranged to provide excitation to at least one of the sensor and the actuator, and an amplifier to condition the excitation.

Claims

1. A device for use in detecting an event in a structure, the device comprising:

a sensor encapsulation configured to be attached to the structure, the encapsulation containing;

a sensor;

an actuator positioned substantially in-plane to the sensor within the encapsulation, the actuator substantially completely surrounding the sensor; and

a printed circuit board in communication with at least one of the sensor and the actuator, the printed circuit board comprising;

a microprocessor constructed and arranged to collect data from at least one of the sensor and the actuator;

a signal generator constructed and arranged to provide excitation to at least one of the sensor and the actuator; and

an amplifier to condition the excitation.

2. The device of claim 1 wherein the microprocessor is configured to collect analog data from at least one of the sensor and the actuator, and further configured to convert the analog data to digital data.

3. The device of claim 1 further comprising a wireless chip coupled to the microprocessor.

4. The device of claim 1 further comprising a battery configured to provide power to the device.

5. The device of claim 1 further comprising a network connection configured to network multiple ones of the device.

6. A device for use in detecting an event in a structure, the device comprising:

a sensor encapsulation configured to be attached to the structure, the encapsulation containing;

a sensor;

an actuator positioned substantially in-plane to the sensor within the encapsulation,

wherein the sensor substantially completely surrounds the actuator; and

a printed circuit board in communication with at least one of the sensor and the actuator, the printed circuit board comprising;

a microprocessor constructed and arranged to collect data from at least one of the sensor and the actuator;

a signal generator constructed and arranged to provide excitation to at least one of the sensor and the actuator; and

an amplifier to condition the excitation.

7. The device of claim 6 wherein the microprocessor is configured to collect analog data from at least one of the sensor and the actuator, and further configured to convert the analog data to digital data.

8. The device of claim 6 further comprising a wireless chip coupled to the microprocessor.

9. The device of claim 6 further comprising a battery configured to provide power to the device.

10. The device of claim 6 further comprising a network connection configured to network multiple ones of the device.

11. A device for use in detecting an event in a structure, the device comprising:

a sensor encapsulation configured to be attached to the structure, the encapsulation containing;

a plurality of sensors;

a wireless chip;

an actuator positioned substantially in-plane to the plurality of sensors within the encapsulation; and

a printed circuit board in communication with the wireless chip and at least one of the plurality of sensors and the actuator, the printed circuit board comprising;

a microprocessor constructed and arranged to collect data from at least one of the sensor and the actuator;

a signal generator constructed and arranged to provide excitation to at least one of the sensor and the actuator; and

an amplifier to condition the excitation,

wherein the plurality of sensors are co-located on at least one piezoelectric wafer,

wherein the plurality of sensors are collectively at least partially surrounded by the actuator.

12. The device of claim 11 further comprising a battery configured to provide power to the device.

13. The device of claim 11 wherein the wireless chip is configured to provide a network connection between multiple ones of the device.

14. A device for use in detecting an event in a structure, the device comprising:

a sensor encapsulation configured to be attached to the structure, the encapsulation containing;

a sensor;

a wireless chip;

a plurality of actuators positioned substantially in-plane to the sensor within the encapsulation; and

a printed circuit board in communication with the wireless chip and at least one of the sensor and the plurality of actuators, the printed circuit board comprising;

a microprocessor constructed and arranged to collect data from at least one of the sensor and the plurality of actuators;

a signal generator constructed and arranged to provide excitation to at least one of the sensor and the plurality of actuators; and

an amplifier to condition the excitation;

wherein the plurality of actuators are co-located on at least one piezoelectric wafer,

wherein the plurality of actuators are collectively at least partially surrounded by the sensor.

15. The device of claim 14 further comprising a battery configured to provide power to the device.

16. The device of claim 14 wherein the wireless chip is configured to provide a network connection between multiple ones of the device.