Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits

• US 7,373,967 B1
• Filed: 06/28/2004
• Issued: 05/20/2008
• Est. Priority Date: 06/28/2004
• Status: Expired due to Fees

• Current Assignee: Delta Design Incorporated (COHU Incorporated)
• Original Assignee: Delta Design Incorporated (COHU Incorporated)
• Inventors: McAuley, Richard Scot, Babcock, James Wittman, Tustaniwskyj, Jerry Ihor
• Primary Examiner(s): CIRIC, LJILJANA V
• Application Number:
  US10/879,245
• Time in Patent Office: 1,422 Days
• Field of Search: 165/104.21, 165/104.26, 165/104.33
• US Class Current: 165/80.4
• CPC Class Codes: F28F 2280/105 with hinged connections
• CPC Class Codes: F28F 9/007 Auxiliary supports for elements
• CPC Class Codes: G01R 31/2874 related to temperature
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid

Abstract

A mechanical assembly for regulating the temperature of an IC-chip in an IC-module includes: a) a heat-exchanger having a first face for contacting a second face on the IC-module; and b) a gimbal, coupled to the heat-exchanger, for tilting and pressing the first face flatly against the second face, as the first and second faces are moved from a spaced-apart position to an engaged position at which the IC-chip temperature is regulated. In addition, the mechanical assembly further includes an output tube, coupled to an output port on the heat-exchanger, which has two ends that move relative to each other as the first and second faces move from the spaced-apart position to the engaged position; and, this output tube is coiled into a weak spring which is characterized by a stiffness matrix that is limited by a predetermined acceptance criterion.

Claims

1. A mechanical assembly for regulating the temperature of an IC-chip in an IC-module comprising:

a heat-exchanger having a first face for contacting a second face on said IC-module;

a gimbal coupled to said heat-exchanger, which is configured to tilt and press said first face flatly against said second face, as said first and second faces are moved from a spaced-apart position to an engaged position at which said IC-chip temperature is regulated; and

an output tube, coupled to an output port on said heat-exchanger, and having two ends configured to move relative to each other as said first and second faces move from said spaced-apart position to said engaged position;

wherein said output tube is formed into a spring which is characterized by a stiffness matrix that is limited by a predetermined acceptance criterion.

2. A mechanical assembly according to claim 1 wherein said spring is sufficiently limited in stiffness to maintain said first face in contact with said second face, as those faces move from said spaced-apart position to said engaged position.

3. A mechanical assembly according to claim 1 wherein said spring is sufficiently limited in stiffness to induce a force per unit area at any particular point between said first and second faces, which is greater to or equal than one-fifth of the average force per unit area between those faces, as those faces move from said spaced-apart position to said engaged position.

4. A mechanical assembly according to claim 1 wherein said spring is sufficiently limited in stiffness to prevent any lateral slippage of said first face against said second face, as those faces move from said spaced-apart position to said engaged position.

5. A mechanical assembly according to claim 1 wherein said spring is sufficiently limited in stiffness to prevent any rotational slippage of said first face against said second face, as those faces move from said spaced-apart position to said engaged position.

6. A mechanical assembly according to claim 1 wherein said output tube is formed into a spiral spring.

7. A mechanical assembly according to claim 1 wherein said output tube is formed into a cylindrical spring.

8. A mechanical assembly according to claim 1 further comprising:

an input tube, coupled to an input port on said heat-exchanger, and having two ends that move relative to each other as said first and second faces move from said spaced-apart position to said engaged position, wherein said input tube is formed into a spring which is characterized by a stiffness matrix that is limited by a predetermined acceptance criterion.

9. A mechanical assembly according to claim 8 wherein said output tube has a large diameter relative to said input tube which has a substantially smaller diameter.

10. A mechanical assembly according to claim 8 wherein said heat-exchanger includes an evaporator for said coolant, and said coolant in said input tube is in a liquid state whereas said coolant in said output tube is in a gas state.

11. A mechanical assembly according to claim 8 wherein said coolant in said output tube is at a low pressure and said coolant in said input tube is at a high pressure which is at least one-hundred psi more than said low pressure.

12. A mechanical assembly according to claim 8 wherein at least one of said tubes is formed as a cylindrical spring.

13. A mechanical assembly according to claim 8 wherein at least one of said tubes is formed as a spiral spring.

14. A mechanical assembly according to claim 8 wherein said input tube and said output tube have different diameters with one tube being inside of the other tube.