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Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits

  • US 7,373,967 B1
  • Filed: 06/28/2004
  • Issued: 05/20/2008
  • Est. Priority Date: 06/28/2004
  • Status: Expired due to Fees
First Claim
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1. A mechanical assembly for regulating the temperature of an IC-chip in an IC-module comprising:

  • a heat-exchanger having a first face for contacting a second face on said IC-module;

    a gimbal coupled to said heat-exchanger, which is configured to tilt and press said first face flatly against said second face, as said first and second faces are moved from a spaced-apart position to an engaged position at which said IC-chip temperature is regulated; and

    an output tube, coupled to an output port on said heat-exchanger, and having two ends configured to move relative to each other as said first and second faces move from said spaced-apart position to said engaged position;

    wherein said output tube is formed into a spring which is characterized by a stiffness matrix that is limited by a predetermined acceptance criterion.

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