In situ optical surface temperature measuring techniques and devices

• US 7,374,335 B2
• Filed: 02/24/2006
• Issued: 05/20/2008
• Est. Priority Date: 04/20/2001
• Status: Expired due to Term

• Current Assignee: LumaSense Technologies Holdings, Inc. (Advanced Energy Industries, Inc. (China))
• Original Assignee: Luxtron Corp. (Advanced Energy Industries, Inc. (China))
• Inventors: Champetier, Robert, Stapleton, Terry M., Dang, Hung, Gotthold, John P.
• Primary Examiner(s): VERBITSKY, GAIL KAPLAN
• Application Number:
  US11/361,543
• Publication Number:
  US 20060140248A1
• Time in Patent Office: 816 Days
• Field of Search: None
• US Class Current: 374/161
• CPC Class Codes: G01J 1/28 using variation of intensity or distance of source G01J1/34 takes precedence
• CPC Class Codes: G01J 1/58 using luminescence generated by light
• CPC Class Codes: G01J 5/0003 for sensing the radiant heat transfer of samples, e.g. emittance meter
• CPC Class Codes: G01J 5/0007 of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
• CPC Class Codes: G01J 5/02 Constructional details
• CPC Class Codes: G01J 5/0205 Mechanical elements; Supports for optical elements
• CPC Class Codes: G01J 5/025 Interfacing a pyrometer to an external device or network; User interface
• CPC Class Codes: G01J 5/046 Materials; Selection of thermal materials
• CPC Class Codes: G01J 5/048 Protective parts
• CPC Class Codes: G01J 5/08 Optical arrangements
• CPC Class Codes: G01J 5/0818 Waveguides
• CPC Class Codes: G01J 5/0821 Optical fibres
• CPC Class Codes: G01J 5/084 Adjustable or slidable
• CPC Class Codes: G01J 5/0887 Integrating cavities mimicking black bodies, wherein the heat propagation between the black body and the measuring element does not occur within a solid; Use of bodies placed inside the fluid stream for measurement of the temperature of gases; Use of the reemission from a surface, e.g. reflective surface; Emissivity enhancement by multiple reflections
• CPC Class Codes: G01J 5/0893 Arrangements to attach devices to a pyrometer, i.e. attaching an optical interface; Spatial relative arrangement of optical elements, e.g. folded beam path G01J5/049 takes precedence
• CPC Class Codes: G01K 1/14 Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
• CPC Class Codes: G01K 1/16 Special arrangements for conducting heat from the object to the sensitive element
• CPC Class Codes: G01K 11/20 using thermoluminescent materials G01K11/32 takes precedence
• CPC Class Codes: G01K 11/3206 at discrete locations in the fibre, e.g. using Bragg scattering
• CPC Class Codes: G01K 11/3213 using changes in luminescence, e.g. at the distal end of the fibres

Abstract

A luminescent temperature sensor comprising (i) an object having a recess, (ii) a layer of luminescent material disposed in the recess, wherein the luminescent material emits electromagnetic radiation having a detectable optical characteristic that is functionally dependent on the temperature of the object, and (iii) a light waveguide in optical communication with the layer of luminescent material, is provided. A test device for measuring a temperature in a processing step comprising (i) an object having a surface and having a recess in the surface of the object, (ii) a layer of luminescent material disposed in the recess, wherein the luminescent material emits electromagnetic radiation having a detectable optical characteristic that is functionally dependent on the temperature of the object in response to a source of excitation radiation, and (iii) an optical window that seals said layer of luminescent material in the recess in the surface of the object, is provided.

Claims

1. A temperature sensor in a chamber comprising:

a test substrate removeably disposed in said chamber, said test substrate having a surface, said surface having a recess therein;

a layer of luminescent material, disposed in the recess, that emits electromagnetic radiation having a detectable optical characteristic functionally dependent on the temperature of the test substrate;

an optical window that seals said layer of luminescent material in the recess;

a chuck disposed in said chamber; and

an optical fiber light waveguide that penetrates the chuck, the optical fiber light waveguide having an end, wherein the optical fiber light waveguide is in optical communication with the layer of luminescent material and wherein there is a spacing between the end of the optical fiber light waveguide and the optical window such that the end of the optical fiber light waveguide does not touch the optical window or the layer of luminescent material, and wherein the test substrate is positioned in the chamber so that the layer of luminescent material faces the end of the optical fiber light waveguide that penetrates the chuck; and

wherein the optical fiber light waveguide does not completely penetrate the chuck.

2. The temperature sensor of claim 1, further comprising an optical connector in optical communication with the optical fiber light waveguide and configured to transmit the electromagnetic radiation from the optical fiber light waveguide.

3. The temperature sensor of claim 1, being configured to measure the temperature of a process selected from the group consisting of:

physical vapor deposition;

dielectric etching;

optical coating of glass substrates;

chemical vapor deposition;

metal organic vapor deposition;

sputtering;

vaporization;

low pressure chemical vapor deposition; and

atomic layer deposition.

4. The temperature sensor of claim 1, wherein the layer of luminescent material surface has a known emissivity and emits radiation within an infrared range.

5. The temperature sensor of claim 1, wherein the test substrate is a semiconductor wafer or a flat panel display.

6. The temperature sensor of claim 1, wherein the layer of luminescent material is wholly contained within the recess.

7. The temperature sensor of claim 1, wherein the optical window is wholly contained within the recess.

8. The temperature sensor of claim 1, wherein the optical window is made of sapphire.

9. The temperature sensor of claim 1, the chamber further comprising a source of excitation radiation and wherein excitation radiation is passed through the optical window by said source of excitation radiation and said layer of luminescent material emits said electromagnetic radiation having said detectable optical characteristic in response to said excitation radiation.

10. The temperature sensor of claim 1, wherein the chamber is a heating chamber.

11. The temperature sensor of claim 1, wherein the chamber is a general vacuum processing chamber.

12. The temperature sensor of claim 1, wherein the chuck supports said test substrate.

13. The temperature sensor of claim 12, wherein the test substrate is horizontally supported by the chuck.

14. The temperature sensor of claim 12, wherein the chuck is cooled by circulation of a coolant through the chuck from an outside supply of coolant.

15. The temperature sensor of claim 12, wherein the test substrate is vertically supported by the chuck.

16. The temperature sensor of claim 1, wherein the test substrate is heated by a radiant heater.

17. The temperature sensor of claim 1, further comprising:

a photodetector in optical communication with the optical fiber light waveguide; and

a measuring circuit card or instrument in electrical communication with the photodetector, the measuring circuit card or instrument configured to provide an output signal of a measured temperature of the test substrate.

18. The temperature sensor of claim 1, wherein the chamber measures a temperature of the surface of the test substrate.

19. The temperature sensor of claim 1, wherein the detectable optical characteristic is a decaying characteristic.

20. The temperature sensor of claim 1, further comprising:

a plurality of posts on the chuck, and wherein the test substrate is overlayed on the plurality of posts.

21. The temperature sensor of claim 1,

wherein the light waveguide does not extend all the way to a surface of the chuck and wherein the test substrate is overlayed directly on the surface of the chuck.

22. The temperature sensor of claim 1 wherein the optical fiber light waveguide is fixedly held within the chuck during an entire process.

23. A test device for measuring a temperature in a processing step, the test device comprising:

a test substrate, said test substrate having a surface, said surface having a recess therein, wherein said test substrate is dimensioned for removeable placement in a chamber;

a layer of luminescent material wholly contained in the recess, wherein the luminescent material emits electromagnetic radiation has a detectable optical characteristic that is functionally dependent on the temperature of the test substrate in response to a source of excitation radiation in a processing chamber; and

an optical window that seals said layer of luminescent material in the recess in the surface of the substrate, wherein the optical window is wholly contained within the recess.

24. The test device of claim 23, wherein the test substrate is a semiconductor wafer shape or a flat panel display.

25. The test device of claim 23, wherein the optical window is made of sapphire.

26. The test device of claim 23, wherein the processing step is selected from the group consisting of:

physical vapor deposition;

dielectric etching;

optical coating of glass substrates;

chemical vapor deposition;

metal organic vapor deposition;

sputtering;

vaporization;

low pressure chemical vapor deposition; and

atomic layer deposition.

27. The test device of claim 23, wherein the layer of luminescent material has a known emissivity and emits radiation within an infrared range.