Method of forming a conductive via through a wafer
First Claim
1. A method of creating vias through a wafer, comprising:
- sawing into a fabrication side of the wafer;
sawing into a backside of the wafer to form a number of trenches so that the sawing on the fabrication side and the number of trenches cross each other to form the vias;
forming bonding pads by metalization of a nonmasked area of the wafer; and
conductively connecting the vias to a number of bonding pads formed in single lines, a single line of the bonding pads being formed parallel to and equal distant between two sawings on the fabrication side, and wherein the number of trenches is less than the number of bonding pads.
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Accused Products
Abstract
Through vias in a substrate are formed by creating a trench in a top side of the substrate and at least one trench in the back side of the substrate. The sum of the depths of the trenches at least equals the height of the substrate. The trenches cross at intersections, which accordingly form the through vias from the top side to the back side. The through vias are filled with a conductor to form contacts on both sides and the edge of the substrate. Contacts on the backside are formed at each of the trench. The through vias from the edge contacts. Traces connect bond pads to the conductor in the through via. Some traces are parallel to the back side traces. Some traces are skew to the back side traces. The substrate is diced to form individual die.
131 Citations
35 Claims
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1. A method of creating vias through a wafer, comprising:
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sawing into a fabrication side of the wafer; sawing into a backside of the wafer to form a number of trenches so that the sawing on the fabrication side and the number of trenches cross each other to form the vias; forming bonding pads by metalization of a nonmasked area of the wafer; and conductively connecting the vias to a number of bonding pads formed in single lines, a single line of the bonding pads being formed parallel to and equal distant between two sawings on the fabrication side, and wherein the number of trenches is less than the number of bonding pads. - View Dependent Claims (2, 3, 4, 5)
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6. A method of creating a via through a wafer, comprising:
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sawing into a fabrication side of the wafer using a saw blade; flipping the wafer; sawing into a backside of the wafer using the saw blade to form a number of trenches, so that the sawing on the fabrication side and sawing on the backside cross each other to form vias; and conductively connecting the vias to a number of bonding pads formed in single lines, wherein the bonding pads are formed by metalization of a nonmasked area of the wafer, a single line of the bonding pads being formed parallel to and equal distant between two sawings on the fabrication side, and wherein the number of trenches is less than the number of bonding pads. - View Dependent Claims (7, 8)
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9. A method of creating vias through a substrate, comprising:
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sawing into a fabrication side of the substrate; sawing into a backside of the substrate to form a number of trenches so that the sawing on the fabrication side and the number of trenches cross each other to form the vias; forming bonding pads by metalization of a nonmasked area of the wafer; and conductively connecting the vias to a number of bonding pads, the bonding pads formed in single lines, a single line of the bonding pads being formed parallel to and equal distant between two sawings on the fabrication side, and wherein the number of trenches is less than the number of bonding pads. - View Dependent Claims (10, 11, 12, 13)
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14. A method of creating a via through a substrate, comprising:
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metalizing a nonmasked area of the wafer to form bonding pads; sawing into a fabrication side of the substrate using a saw blade; flipping the substrate; sawing into a backside of the substrate using the saw blade to form a number of trenches, so that saw paths on the fabrication side and the trenches on the backside cross each other to form vias; and conductively connecting the vias to a number of bonding pads formed in single lines, a single line of the bonding pads being formed parallel to and equal distant between two sawings on the fabrication side, and wherein the number of trenches is less than the number of bonding pads. - View Dependent Claims (15, 16)
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17. An integrated circuit fabrication method, comprising:
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forming an integrated circuit on a first fabrication side of a substrate; mechanically trenching the first side of the substrate to form more than one first trench; and mechanically trenching a second back side of the substrate to form at least one second trench that crosses the first trench at an intersection, whereby the intersection forms a via from the first side to the second side; and conductively connecting the via is to a number of bonding pads on the substrate, wherein the bonding pads are formed by metalization of a nonmasked area of the wafer, the bonding pads formed in single lines, a single line of the bonding pads being formed equal distant between and parallel to two first trenches, and wherein the number of second trenches is less than the number of bonding pads. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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24. A method for forming through holes in a substrate, comprising:
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forming more than one first trench on a fabrication side of a substrate, each trench in a saw street of a substrate; forming a plurality of second trenches in a backside of a substrate so that the second trenches intersect the first trenches to form a plurality of through holes; and conductively connecting the through holes to a number of bonding pads, wherein the bonding pads are formed by metalization of a nonmasked area of the wafer, the bonding pads formed in single lines, a single line of bonding pads formed parallel to and equal distant between two first trenches, and wherein the number of second trenches is less than the number of bonding pads. - View Dependent Claims (25, 26, 27, 28, 29)
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30. A method of fabricating an integrated circuit device, comprising:
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providing a substrate that includes at least one integrated circuit device; forming more than one first trench in a first direction on a fabrication side of the substrate; forming a second trench in a second direction on a backside of the substrate so that the second trench crosses the first trench to form a through via in the substrate from the first side to the second side; and conductively connecting the through via to a number of bond pads, wherein the bonding pads are formed by metalization of a nonmasked area of the wafer, the bonding pads formed on the first side in single lines, a single line of the bonding pads being formed parallel to and equal distant between two first trenches, wherein the number of bond pads is greater than the number of second trenches; and inserting a conductor in the through via to form an electrical connection on both the first side and the second side. - View Dependent Claims (31, 32, 33, 34, 35)
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Specification