Imaging element, imaging device, camera module and camera system

• US 7,375,757 B1
• Filed: 08/31/2000
• Issued: 05/20/2008
• Est. Priority Date: 09/03/1999
• Status: Expired due to Term

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Yonemoto, Kazuya, Hoshino, Kazuhiro, Sumi, Hirofumi
• Primary Examiner(s): Ye; Lin
• Assistant Examiner(s): HERNANDEZ, NELSON D
• Application Number:
  US09/652,150
• Time in Patent Office: 2,819 Days
• Field of Search: 250/208.1, 348/335, 348/373, 348/374, 348/375, 348/340, 348/294, 348/345, 348/394, 348/370, 348/371, 348/222.1, 348/229.1, 348/121, 348/65, 359/809, 359/808, 257/700, 257/730, 257/684, 257/719, 257/708, 257/709, 257/711, 438/121
• US Class Current: 348/340
• CPC Class Codes: H01L 27/1462 Coatings
• CPC Class Codes: H01L 27/14647 Multicolour imagers having a stacked pixel-element structure, e.g. npn, npnpn or MQW elements
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

The system and apparatus of the present invention are directed to a camera module in which an operational defect (generation of a ghost image) as a result of a reduction in thickness is eliminated. The camera module includes a substrate provided with a through-hole for light transmission, a light receiving portion provided on a first surface of an imaging element. The imaging element is flip chip mounted on a first side of the substrate such that the light receiving portion is exposed through the through-hole, and a shielding layer on a back surface of the imaging element wherein the back surface is opposite the first surface having the light receiving portion. A lens unit is mounted a second side of the substrate.

Claims

1. An optical system having an optical module, the optical module comprising:

an optical element including a light receiving portion, said light receiving portion being between a shielding layer and a lens;

an optical filter between said lens and a diaphragm portion of a lens barrel, an opening through said diaphragm portion exposing said optical filter;

a plate between said lens barrel and a wiring board, said wiring board being between said optical element and said plate,

wherein said plate is of a first material, said wiring board being of a material other than said first material,

wherein said light receiving portion and said lens are disposed along an optical axis,

wherein a through-hole extends through said lens barrel, said plate, and said wiring board,

wherein said optical axis extends through said opening, said optical filter, and said through-hole,

wherein said lens barrel is in an inner periphery of a holder, said plate being between said holder and said wiring board.

2. The optical system of claim 1, wherein said optical filter and said lens are moveable in a direction along said optical axis.

3. The optical system of claim 1, wherein said optical filter is an infrared cutting filter.

4. The optical system of claim 1, wherein said lens barrel contacts said holder.

5. The optical system of claim 1, wherein said diaphragm portion contacts said optical filter.

6. The optical system of claim 1, wherein said lens barrel contacts said lens.

7. The optical system of claim 1, wherein said lens barrel contacts said plate.

8. The optical system of claim 1, wherein said plate contacts said wiring board.

9. The optical system of claim 1, wherein bumps electrically connect said wiring board with said optical element.

10. The optical system of claim 1, wherein said first material is a metal.

11. The optical system of claim 1, wherein the shielding layer is a metal layer.

12. The optical system of claim 1, wherein said shielding layer is a resin layer.

13. The optical system of claim 12, wherein a portion of said resin layer is in contact with said wiring board.

14. An imaging device comprising:

the optical system according to claim 1.

15. A camera system using a camera module comprising:

the optical system according to claim 1.