Methods and configurations for manufacturing hinges for micro-mirror devices
First Claim
1. A method for manufacturing an image display system with a plurality of micromirrors supported on a plurality of doped semiconductor hinges supported on a substrate comprising:
- applying an elevated temperature for crystallizing said semiconductor hinges followed by forming a plurality of metallic lines between said hinges; and
said step of forming a plurality of metallic lines between said hinges further comprising a step of spin coating a photo resist between said hinges by spinning said photo resist as a flow between said hinges with a Reynolds number below 70, representing by 0<
Re<
70.
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Accused Products
Abstract
An image display system includes an improved hinge for a micro-mirror device composed of a conductive doped semiconductor and immune to plastic deformation at typical to extreme temperatures. The hinge is directly connected to the micro-mirror device and facilitates the manufacturing of an optically flat micro-mirror. This eliminates Fraunhofer diffraction due to recesses on the reflective surface of the micro-mirror. In addition, the hinge is hidden from incoming light thus improving contrast and fill-factor. The image display system further includes signal transmission metal traces formed on areas between the doped semiconductor hinges. The signal transmission metal traces are formed either before or after a high temperature crystallization process is applied to the hinges.
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Citations
27 Claims
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1. A method for manufacturing an image display system with a plurality of micromirrors supported on a plurality of doped semiconductor hinges supported on a substrate comprising:
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applying an elevated temperature for crystallizing said semiconductor hinges followed by forming a plurality of metallic lines between said hinges; and said step of forming a plurality of metallic lines between said hinges further comprising a step of spin coating a photo resist between said hinges by spinning said photo resist as a flow between said hinges with a Reynolds number below 70, representing by 0<
Re<
70. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An image display system comprising a plurality of micromirrors wherein:
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each of said micromirrors supported on a doped semiconductor hinge hidden from an incident light projecting to said micromirrors; said image display system further includes signal transmission metal traces disposed on areas between said doped semiconductor hinges supporting said micromirrors; and said signal transmission metal traces are formed prior to an elevated temperature is applied locally to crystallize said hinges by a laser heating process with a laser beam projecting toward said hinges to heat said hinges to a temperature substantially above 600 Celisus. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 26)
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20. An image display system comprising a plurality of micromirrors wherein:
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each of said micromirrors supported on a doped semiconductor hinge hidden from an incident light projecting to said micromirrors; said image display system further includes signal transmission metal traces disposed on areas between said doped semiconductor hinges supporting said micromirrors; and said signal transmission metal traces are formed prior to an elevated temperature is applied locally to crystallize said hinges by a laser heating process with a laser beam projecting toward said hinges with an tilted incident angle substantially between 10 to 80 degrees relative to said hinges. - View Dependent Claims (27)
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21. A method for manufacturing an image display system with a plurality of micromirrors supported on a plurality of doped semiconductor hinges supported on a substrate comprising:
applying a laser beam to each of said hinges for annealing said semiconductor hinges after forming a plurality of metallic lines between said hinges. - View Dependent Claims (22, 23, 24, 25)
Specification