Electronic device

• US 7,375,974 B2
• Filed: 03/08/2005
• Issued: 05/20/2008
• Est. Priority Date: 03/15/2004
• Status: Expired due to Fees

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Kirigaya, Masato
• Primary Examiner(s): Gutierrez; Diego
• Assistant Examiner(s): Levi; Dameon E
• Application Number:
  US11/073,621
• Publication Number:
  US 20050201069A1
• Time in Patent Office: 1,169 Days
• Field of Search: 361719-721, 361/702, 361/704, 361/707, 361/752, 361/807, 361/767, 361/760, 174/520, 174/521
• US Class Current: 361/752
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15322 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/16251 Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/19106 in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 7/20436 Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence

Abstract

A circuit board is disposed on a support plate, with electronic components mounted on this circuit board being accommodated in recessed portions of the support plate. Thermal adhesive members intervene between rear surfaces of the electronic components and bottom surfaces of the recessed portions of the support plate. The support plate has degassing grooves. Furthermore, the support plate has raised portions provided on its upper surface for supporting the circuit board in a floated condition with a gap between them.

Claims

1. An electronic device comprising:

a circuit board on which at least one electronic component is mounted;

a support plate supporting the circuit board and having one surface, the one surface facing the circuit board, the one surface having a principal surface, the one surface being formed with at least one recessed portion recessed relative to the principal surface to accommodate the electronic component of the circuit board, the one surface having at least three raised portions formed thereon and raised relative to the principal surface and held in direct contact with a surface of the circuit board; and

a thermal adhesive member intervening between a rear surface of said electronic component and a bottom surface of the recessed portion of said support plate;

wherein the raised portions of the support plate have heights to allow the electronic component and the thermal adhesive member to be received between the surface of the circuit board and the bottom surface of the recessed portion of said support plate,

wherein;

the support plate further has a communicating passage extending from the recessed portion to an end portion of the circuit board placed in the face-to-face relationship with the support plate in a layout to allow an opening portion contiguous with the communicating passage to be exposed under a status where the circuit board is placed on the support plate in the face-to-face relationship therewith, and

the communicating passage is a groove formed on the one surface of the support plate.

2. An electronic device comprising:

a circuit board on which at least one electronic component is mounted;

a support plate supporting the circuit board and having one surface, the one surface facing the circuit board, the one surface having a principal surface, the one surface being formed with at least one recessed portion recessed relative to the principal surface to accommodate the electronic component of the circuit board, the one surface having at least three raised portions formed thereon and raised relative to the principal surface and held in direct contact with a surface of the circuit board; and

a thermal adhesive member intervening between a rear surface of said electronic component and a bottom surface of the recessed portion of said support plate;

wherein the raised portions of the support plate have heights to allow the electronic component and the thermal adhesive member to be received between the surface of the circuit board and the bottom surface of the recessed portion of said support plate,

wherein;

the support plate further has a communicating passage extending from the recessed portion to an end portion of the circuit board placed in the face-to-face relationship with the support plate in a layout to allow an opening portion contiguous with the communicating passage to be exposed under a status where the circuit board is placed on the support plate in the face-to-face relationship therewith, and

the communicating passage includes a plurality of passages starting from the recessed portion of said support plate and extending in plural directions.

3. An electronic device comprising:

a circuit board on which at least one electronic component is mounted;

a support plate supporting the circuit board and having one surface, the one surface facing the circuit board, the one surface having a principal surface, the one surface being formed with at least one recessed portion recessed relative to the principal surface to accommodate the electronic component of the circuit board, the one surface having at least three raised portions formed thereon and raised relative to the principal surface and held in direct contact with a surface of the circuit board; and

a thermal adhesive member intervening between a rear surface of said electronic component and a bottom surface of the recessed portion of said support plate;

wherein the raised portions of tbe support plate have heights to allow the electronic component and the thermal adhesive member to be received between the surface of the circuit board and the bottom surface of the recessed portion of said support plate,

wherein;

the support plate further has a communicating passage extending from the recessed portion to an end portion of the circuit board placed in the face-to-face relationship with the support plate in a layout to allow an opening portion contiguous with the communicating passage to be exposed under a status where the circuit board is placed on the support plate in the face-to-face relationship therewith, and

the communicating passage includes a plurality of passages starting from sidewalls of the recessed portion of said support plate and extending in given orientations, respectively.

4. An electronic device comprising:

a circuit board on which at least one electronic component is mounted;

a support plate supporting the circuit board and having one surface, the one surface facing the circuit board, the one surface having a principal surface, the one surface being formed with at least one recessed portion recessed relative to the principal surface to accommodate the electronic component of the circuit board, the one surface having at least three raised portions formed thereon and raised relative to the principal surface and held in direct contact with a surface of the circuit board; and

a thermal adhesive member intervening between a rear surface of said electronic component and a bottom surface of the recessed portion of said support plate;

wherein the raised portions of the support plate have heights to allow the electronic component and the thermal adhesive member to be received between the surface of the circuit board and the bottom surface of the recessed portion of said support plate,

wherein;

the support plate further has a communicating passage extending from the recessed portion to an end portion of the circuit board placed in the face-to-face relationship with the support plate in a layout to allow an opening portion contiguous with the communicating passage to be exposed under a status where the circuit board is placed on the support plate in the face-to-face relationship therewith, and

the communicating passage is formed in a zonal pattern with a width embracing the recessed portion of said support plate.

5. An electronic device comprising:

a circuit board having one surface on which at least one electronic component is mounted;

a support plate supporting the circuit board and having one surface, the one surface of the, support plate facing the circuit board, the one surface having a principal surface, the one surface of the support plate being formed with at least one recessed portion recessed relative to the principal surface to accommodate the at least one electronic component of the circuit board, the one surface of the support plate having at least three raised portions formed thereon and raised relative to the principal surface and held in direct contact with the one surface of the circuit substrate; and

a thermal adhesive member intervening between a rear surface of said electronic component and a bottom surface of the recessed portion of said support plate, wherein, said at least three raised portions of the support plate support said circuit board a floated condition with a gap corresponding to the height of said raised portions between said support plate and said circuit board to allow the at least one electronic component and the thermal adhesive member to be received between the one surface of the circuit board and the bottom surface of the recessed portion of said support plate,

wherein;

the support plate also has a communicating passage extending from the recessed portion to an end portion of the circuit board placed in a face-to-face relationship with the support plate in a layout to allow an opening portion contiguous with the communicating passage to be exposed under a status where the circuit board is placed on the support plate in the face-to-face relationship therewith.

6. The electronic device according to claim 5, wherein:

the communicating passage includes a plurality of passages starting from the recessed portion of said support plate and extending in plural directions.

7. The electronic device according to claim 5, wherein:

the communicating passage includes a plurality of passages starting from sidewalls of the recessed portion of said support plate and extending in given orientations, respectively.

8. The electronic device according to claim 5, wherein:

the communicating passage is formed in a zonal pattern with a width embracing the recessed portion of said support plate.

9. The electronic device in accordance with claim 5, wherein said communicating passage is a groove formed on the one surface of said support plate.

10. The electronic device of claim 5,

wherein the end portion is a surface of the support plate adjacent to a periphery of the one surface, the end portion being not between the circuit board and the support plate,

wherein the communicating passage has a depth identical to a depth of the recessed portion.